NTD5862N, NTP5862N
www.onsemi.com
4
TYPICAL CHARACTERISTICS
0
1000
2000
3000
4000
5000
0 102030405060
Figure 7. Capacitance Variation
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
T
J
= 25°C
V
GS
= 0 V
C
iss
C
oss
C
rss
0
2
4
6
8
01020304050
Q
gs
Q
T
Q
gd
Figure 8. Gate−to−Source vs. Total Charge
Q
g
, TOTAL GATE CHARGE (nC)
V
GS
, GATE−TO−SOURCE VOLTAGE (V)
V
DS
= 48 V
I
D
= 45 A
T
J
= 25°C
1
10
100
1000
1 10 100
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
R
G
, GATE RESISTANCE (W)
V
DD
= 48 V
I
D
= 45 A
V
GS
= 10 V
t
d(off)
t
d(on)
t
r
t
f
0
20
40
60
80
100
0.50 0.60 0.70 0.80 1.000.90 1.1
Figure 10. Diode Forward Voltage vs. Current
V
SD
, SOURCE−TO−DRAIN VOLTAGE (V)
I
S
, SOURCE CURRENT (A)
T
J
= 25°C
V
GS
= 0 V
0.1
1
10
100
1000
0.1 1 10 100
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
D
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
R
DS(on)
LIMIT
THERMAL LIMIT
PACKAGE LIMIT
V
GS
= 10 V
SINGLE PULSE
T
C
= 25°C
10 ms
100 ms
10 ms
dc
1 ms
0
25
50
75
100
125
150
175
25 50 75 100 125 17
AVALANCHE ENERGY (mJ)
T
J
, STARTING JUNCTION TEMPERATURE
Figure 12. Maximum Avalanche Energy versus
Starting Junction Temperature
I
D
= 37 A
60 70 80 9
1
3
5
7
9
150
200
225