IRF7321D2TRPBF

Parameter Maximum Units
I
D
@ T
A
= 25°C Continuous Drain Current, V
GS
@ -10V -4.7 A
I
D
@ T
A
= 70°C -3.8
I
DM
Pulsed Drain Current À -38
P
D
@T
A
= 25°C Power Dissipation 2.0 W
P
D
@T
A
= 70°C 1.3
Linear Derating Factor 16 mW/°C
V
GS
Gate-to-Source Voltage ± 20 V
dv/dt Peak Diode Recovery dv/dt Á -5.0 V/ns
T
J,
T
STG
Junction and Storage Temperature Range -55 to +150 °C
l Co-packaged HEXFET® Power
MOSFET and Schottky Diode
l Ideal For Buck Regulator Applications
l P-Channel HEXFET®
l Low V
F
Schottky Rectifier
l Generation 5 Technology
l SO-8 Footprint
l Lead-Free
IRF7321D2PbF
10/12/04
FETKY
MOSFET & Schottky Diode
Absolute Maximum Ratings ( T
A
= 25°C Unless Otherwise Noted)
TM
Description
SO-8
V
DSS
= -30V
R
DS(on)
= 0.062
Schottky Vf = 0.52V
The FETKY
TM
family of Co-packaged HEXFETs and
Schottky diodes offer the designer an innovative board
space saving solution for switching regulator and
power management applications. Generation 5
HEXFETs utilize advanced processing techniques to
achieve extremely low on-resistance per silicon area.
Combinining this technology with International
Rectifier's low forward drop Schottky rectifiers results in
an extremely efficient device suitable for use in a wide
variety of portable electronics applications.
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics. The
SO-8 package is designed for vapor phase, infrared or
wave soldering techniques.
Top View
8
1
2
3
4
5
6
7
A
A
S
G
D
D
K
K
Parameter Maximum Units
R
θJA
Junction-to-Ambient à 62.5 °C/W
Thermal Resistance Ratings
Notes:
Repetitive rating – pulse width limited by max. junction temperature (see fig. 11)
I
SD
-2.9A, di/dt -77A/µs, V
DD
V
(BR)DSS
, T
J
150°C
Pulse width 300µs – duty cycle 2%
Surface mounted on FR-4 board, t 10sec.
www.irf.com
PD - 95297
IRF7321D2PbF
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage -30 –– –– V V
GS
= 0V, I
D
= -250µA
––– 0.042 0.062 V
GS
= -10V, I
D
= -4.9A
––– 0.076 0.098 V
GS
= -4.5V, I
D
= -3.6A
V
GS(th)
Gate Threshold Voltage -1.0 ––– ––– V V
DS
= V
GS
, I
D
= -250µA
g
fs
Forward Transconductance ––– 7.7 ––– S V
DS
= -15V, I
D
= -4.9A
––– ––– -1.0 V
DS
= -24V, V
GS
= 0V
––– ––– -25 V
DS
= -24V, V
GS
= 0V, T
J
= 55°C
Gate-to-Source Forward Leakage ––– ––– 100 V
GS
= -20V
Gate-to-Source Reverse Leakage ––– ––– -100 V
GS
= 20V
Q
g
Total Gate Charge –– 23 34 I
D
= -4.9A
Q
gs
Gate-to-Source Charge ––– 3.8 5.7 nC V
DS
= -15V
Q
gd
Gate-to-Drain ("Miller") Charge –– 5.9 8.9 V
GS
= -10V, See Fig. 6
t
d(on)
Turn-On Delay Time ––– 13 19 V
DD
= -15V
t
r
Rise Time ––– 13 20 I
D
= -1.0A
t
d(off)
Turn-Off Delay Time ––– 34 51 R
G
= 6.0
t
f
Fall Time ––– 32 48 R
D
= 15,
C
iss
Input Capacitance ––– 710 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 380 ––– pF V
DS
= -25V
C
rss
Reverse Transfer Capacitance ––– 180 –– ƒ = 1.0MHz, See Fig. 5
MOSFET Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
R
DS(on)
Static Drain-to-Source On-Resistance
I
DSS
Drain-to-Source Leakage Current
I
GSS
µA
nA
ns
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current(Body Diode) ––– ––– -2.5
I
SM
Pulsed Source Current (Body Diode) ––– ––– -30
V
SD
Body Diode Forward Voltage ––– -0.78 -1.0 V T
J
= 25°C, I
S
= -1.7A, V
GS
= 0V
t
rr
Reverse Recovery Time (Body Diode) ––– 44 66 ns T
J
= 25°C, I
F
= -1.7A
Q
rr
Reverse Recovery Charge ––– 42 63 nC di/dt = 100A/µs
A
MOSFET Source-Drain Ratings and Characteristics
Parameter Max. Units Conditions
If (av) Max. Average Forward Current 3.2 50% Duty Cycle. Rectangular Wave, Tc = 25°C
2.0 See Fig.14 Tc = 70°C
I
SM
Max. peak one cycle Non-repetitive 200 5µs sine or 3µs Rect. pulse Following any rated
Surge current 20 10ms sine or 6ms Rect. pulse load condition &
with Vrrm applied
A
Schottky Diode Maximum Ratings
A
Parameter Max. Units Conditions
Vfm Max. Forward voltage drop 0.57 If = 3.0, Tj = 25°C
0.77 If = 6.0, Tj = 25°C
0.52 If = 3.0, Tj = 125°C
0.79 If = 6.0, Tj = 125°C .
Irm Max. Reverse Leakage current 0.30 Vr = 30V Tj = 25°C
37 Tj = 125°C
Ct Max. Junction Capacitance 310 pF Vr = 5Vdc ( 100kHz to 1 MHz) 25°C
dv/dt Max. Voltage Rate of Charge 4900 V/µs Rated Vr
Schottky Diode Electrical Specifications
V
mA
( HEXFET is the reg. TM for International Rectifier Power MOSFET's )
IRF7321D2PbF
www.irf.com 3
Fig 3. Typical Transfer Characteristics
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
1
10
100
0.1 1 10
D
DS
20µs PULSE WIDTH
T = 25°C
A
-I , Drain-to-Source Current (A)
-V , Drain-to-Source Voltage (V)
J
-3.0V
VGS
TOP - 15V
- 10V
- 7.0V
- 5.5V
- 4.5V
- 4.0V
- 3.5V
BOTTOM - 3.0V
1
10
100
0.1 1 10
D
DS
A
-I , Drain-to-Source Current (A)
-V , Drain-to-Source Voltage (V)
-3.0V
VGS
TOP - 15V
- 10V
- 7.0V
- 5.5V
- 4.5V
- 4.0V
- 3.5V
BOTTOM - 3.0V
20µs PULSE WIDTH
T = 150°C
J
1
10
100
3.0 3.5 4.0 4.5 5.0 5.5 6.0
T = 25°C
T = 150°C
J
J
GS
D
A
-I , Drain-to-Source Current (A)
-V , Gate-to-Source Voltage (V)
V = -10V
20µs PULSE WIDTH
DS
Fig 4. Normalized On-Resistance
Vs. Temperature
-60 -40 -20 0 20 40 60 80 100 120 140 160
0.0
0.5
1.0
1.5
2.0
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
4.9A
-
-
-4.9A
-10V
Power Mosfet Characteristics

IRF7321D2TRPBF

Mfr. #:
Manufacturer:
Infineon / IR
Description:
MOSFET MOSFT PCh w/Schttky -4.9A 62mOhm 23nC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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