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POWER-DOWN MODES
Upon power-up, the LTC1408-12 is initialized to the
active state and is ready for conversion. The Nap and Sleep
mode waveforms show the power down modes for the
LTC1408-12. The SCK and CONV inputs control the power
down modes (see Timing Diagrams). Two rising edges at
CONV, without any intervening rising edges at SCK, put
the LTC1408-12 in Nap mode and the power consumption
drops from 15mW to 3.3mW. The internal reference
remains powered in Nap mode. One or more rising edges
at SCK wake up the LTC1408-12 very quickly and CONV
can start an accurate conversion within a clock cycle. Four
rising edges at CONV, without any intervening rising
edges at SCK, put the LTC1408-12 in Sleep mode and the
power consumption drops from 15mW to 6µW. One or
more rising edges at SCK wake up the LTC1408-12 for
operation. The internal reference (V
REF
) takes 2ms to slew
and settle with a 10µF load. Using sleep mode more
frequently compromises the accuracy of the output data.
Note that for slower conversion rates, the Nap and Sleep
modes can be used for substantial reductions in power
consumption.
DIGITAL INTERFACE
The LTC1408-12 has a 3-wire SPI (Serial Peripheral Inter-
face) interface. The SCK and CONV inputs and SDO output
implement this interface. The SCK and CONV inputs
accept swings from 3V logic and are TTL compatible, if the
logic swing does not exceed V
DD
. A detailed description of
the three serial port signals follows:
Conversion Start Input (CONV)
The rising edge of CONV starts a conversion, but subse-
quent
rising edges at CONV are ignored by the LTC1408-12
until the following 96 SCK rising edges have occurred. The
duty cycle of CONV can be arbitrarily chosen to be
used as
a frame sync signal for the processor serial port. A simple
approach to generate CONV is to create a pulse that is one
SCK wide to drive the LTC1408-12 and then buffer this
signal to drive the frame sync input of the processor
serial port. It is good practice to drive the LTC1408-12
CONV input first to avoid digital noise interference during
the sample-to-hold transition triggered by CONV at the
start of conversion. It is also good practice to keep the
width of the low portion of the CONV signal
greater than
15ns to avoid introducing glitches in the front end of the
ADC just before the sample-and-hold goes into Hold mode
at the rising edge of CONV.
Minimizing Jitter on the CONV Input
In high speed applications where high amplitude sine
waves above 100kHz are sampled, the CONV signal must
have as little jitter as possible (10ps or less). The square
wave output of a common crystal clock module usually
meets this requirement. The challenge is to generate a
CONV signal from this crystal clock without jitter corrup-
tion from other digital circuits in the system. A clock
divider and any gates in the signal path from the crystal
clock to the CONV input should not share the same
integrated circuit with other parts of the system. The SCK
and CONV inputs should be driven first, with digital buffers
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LTC1408-12
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used to drive the serial port interface. Also note that the
master clock in the DSP may already be corrupted with
jitter, even if it comes directly from the DSP crystal.
Another problem with high speed processor clocks is that
they often use a low cost, low speed crystal (i.e., 10MHz)
to generate a fast, but jittery, phase-locked-loop system
clock (i.e., 40MHz). The jitter in these PLL-generated high
speed clocks can be several nanoseconds. Note that if you
choose to use the frame sync signal generated by the DSP
port, this signal will have the same jitter of the DSP’s
master clock.
The Typical Application Figure on page 20 shows a circuit
for level-shifting and squaring the output from an RF
signal generator or other low-jitter source. A single D-type
flip flop is used to generate the CONV signal to the
LTC1408-12. Re-timing the master clock signal eliminates
clock jitter introduced by the controlling device (DSP,
FPGA, etc.) Both the inverter and flip flop must be treated
as analog components and should be powered from a
clean analog supply.
Serial Clock Input (SCK)
The rising edge of SCK advances the conversion process
and also udpates each bit in the SDO data stream. After
CONV rises, the third rising edge of SCK sends out up to
six sets of 12 data bits, with the MSB sent first. A simple
approach is to generate SCK to drive the LTC1408-12 first
and then buffer this signal with the appropriate number of
inverters to drive the serial clock input of the processor
serial port. Use the falling edge of the clock to latch data
from the Serial Data Output (SDO) into your processor
serial port. The 12-bit Serial Data will be received in six
16-bit words with 96 or more clocks per frame sync. If
fewer than 6 channels are selected by SEL0–SEL2 for
conversion, then 16 clocks are needed per channel to
convert the analog inputs and read out the resulting data
after the next convert pulse. It is good practice to drive the
LTC1408-12 SCK input first to avoid digital noise interfer-
ence during the internal bit comparison decision by the
internal high speed comparator. Unlike the CONV input,
the SCK input is not sensitive to jitter because the input
signal is already sampled and held constant.
Serial Data Output (SDO)
Upon power-up, the SDO output is automatically reset
to the high impedance state. The SDO output remains
in high impedance until a new conversion is started.
SDO sends out up to six sets of 12 bits in the output data
stream after the third rising edge of SCK after the start
of conversion with the rising edge of CONV. The six or
fewer 12-bit words are separated by two don’t care bits
and two clock cycles in high impedance mode. Please
note the delay specification from SCK to a valid SDO.
SDO is always guaranteed to be valid by the next rising
edge of SCK. The 16 – 96-bit output data stream is
compatible with the 16-bit or 32-bit serial port of most
processors.
BOARD LAYOUT AND BYPASSING
Wire wrap boards are not recommended for high resolu-
tion and/or high speed A/D converters. To obtain the best
performance from the LTC1408-12, a printed circuit board
with ground plane is required. Layout for the printed
circuit board should ensure that digital and analog signal
lines are separated as much as possible. In particular, care
should be taken not to run any digital track alongside an
analog signal track. If optimum phase match between the
inputs is desired, the length of the twelve input wires of the
six input channels should be kept matched. But each pair
of input wires to the six input channels should be kept
separated by a ground trace to avoid high frequency
crosstalk between channels.
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High quality tantalum and ceramic bypass capacitors should
be used at the V
CC
, V
DD
and V
REF
pins as shown in the
Block Diagram on the first page of this data sheet. For
optimum performance, a 10µF surface mount tantalum
capacitor with a 0.1µF ceramic is recommended for the
V
CC
, V
DD
and V
REF
pins. Alternatively, 10µF ceramic chip
capacitors such as X5R or X7R may be used. The capaci-
tors must be located as close to the pins as possible. The
traces connecting the pins and the bypass capacitors must
be kept short and should be made as wide as possible. The
V
CC
and V
DD
bypass capacitor returns to the ground plane
and the V
REF
bypass capacitor returns to the Pin 22. Care
should be taken to place the 0.1µF V
CC
and V
DD
bypass
capacitor as close to Pins 24 and 25 as possible.
Figure 6 shows the recommended system ground connec-
tions. All analog circuitry grounds should be terminated at
the LTC1408-12 Exposed Pad. The ground return from the
LTC1408-12 to the power supply should be low imped-
ance for noise-free operation. The Exposed Pad of the 32-
pin QFN package is also internally tied to the ground pads.
The Exposed Pad should be soldered on the PC board to
reduce ground connection inductance. All ground pins
(GND, DGND, OGND) must be connected directly to the
same ground plane under the LTC1408-12.
HARDWARE INTERFACE TO TMS320C54x
The LTC1408-12 is a serial output ADC whose interface
has been designed for high speed buffered serial ports in
fast digital signal processors (DSPs). Figure 7 shows an
example of this interface using a TMS320C54X.
The buffered serial port in the TMS320C54x has direct
access to a 2kB segment of memory. The ADC’s serial
data can be collected in two alternating 1kB segments, in
real time, at the full 600ksps conversion rate of the
LTC1408-12. The DSP assembly code sets frame sync
mode at the BFSR pin to accept an external positive going
pulse and the serial clock at the BCLKR pin to accept an
external positive edge clock. Buffers near the LTC1408-12
may be added to drive long tracks to the DSP to prevent
corruption of the signal to LTC1408-12. This configura-
tion is adequate to traverse a typical system board, but
source resistors at the buffer outputs and termination
resistors at the DSP, may be needed to match the charac-
teristic impedance of very long transmission lines. If you
need to terminate the SDO transmission line, buffer it first
with one or two 74ACxx gates. The TTL threshold inputs of
the DSP port respond properly to the 3V swing used with
the LTC1408-12.
Figure 6. Recommended Layout
V
DD
BYPASS,
0.1µF, 0402
OV
DD
BYPASS,
0.1µF, 0402
V
REF
BYPASS,
10µF, 0805
V
CC
BYPASS,
0.1µF, 0402 AND
10µF, 0805
1408 F06
3
30
32
1
2
3-WIRE SERIAL
INTERFACE LINK
OV
DD
CONV
SCK
LTC1408-12
SDO
V
CC
BFSR
BCLKR
TMS320C54x
BDR
OGND
31
DGND
CONV
0V TO 3V LOGIC SWING
CLK
5V3V
B11 B10
Figure 7. DSP Serial Interface to TMS320C54x

LTC1408CUH-12#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 6 Ch, 12-B, 600ksps Simultaneous Smpl AD
Lifecycle:
New from this manufacturer.
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