ADG5233/ADG5234 Data Sheet
Rev. D | Page 22 of 22
Figure 40. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
Figure 41. 20-LEAD LEAD FRAME CHIP SCALE PACKAGE [LFCSP_WQ]
4 mm × 4 mm BODY, VERY VERY THIN QUAD
(CP-20-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Description
EN
Pin
Package Option
ADG5233BRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] Yes RU-16
ADG5233BRUZ-RL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] Yes RU-16
ADG5233BCPZ-RL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] Yes CP-16-17
ADG5234BRUZ −40°C to +125°C 20-Lead Thin Shrink Small Outline Package [TSSOP] No RU-20
ADG5234BRUZ-RL7 −40°C to +125°C 20-Lead Thin Shrink Small Outline Package [TSSOP] No RU-20
ADG5234BCPZ-RL7 −40°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] Yes CP-20-8
1
Z = RoHS Compliant Part.
COMPLIANT TO JEDEC STANDARDS MO-153-AC
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX
0.20
0.09
0.75
0.60
0.45
8°
0°
COPLANARIT
0.10
0.50
BSC
0.50
0.40
0.30
0.30
0.25
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGD.
020509-B
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.75
2.60 SQ
2.35
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
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registered trademarks are the property of their respective owners.
D09919-0-8/15(D)
