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MC100EP57DTR2G

P1-P3P4-P6P7-P9P10-P10
MC10EP57, MC100EP57
http://onsemi.com
7
Table 11. AC CHARACTERISTICS V
CC
= 0 V; V
EE
= −3.0 V to −5.5 V or V
CC
= 3.0 V to 5.5 V; V
EE
=
0 V (Note 20)
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
f
max
Maximum Frequency (Figure 2) > 3 > 3 > 3 GHz
t
PLH
,
t
PHL
Propagation Delay to
Output Differential
D to Q, Q
COM_SEL, SEL to Q, Q
250
300
350
400
450
500
275
320
375
420
475
520
320
320
420
450
520
575
ps
t
SKEW
Device to Device Skew (Note 21) 200 200 200 ps
t
JITTER
CLOCK Random Jitter (RMS)
@ v0.5 GHz
@ v1.0 GHz
@ v1.5 GHz
@ v2.0 GHz
@ v2.5 GHz
@ v3.0 GHz
0.122
0.110
0.112
0.128
0.114
0.116
0.3
0.3
0.3
0.3
0.3
0.3
0.140
0.135
0.132
0.139
0.129
0.152
0.3
0.3
0.3
0.3
0.3
0.3
0.172
0.151
0.152
0.163
0.177
0.305
0.3
0.3
0.3
0.3
0.3
1.0
ps
V
PP
Input Voltage Swing (Differential Con-
figuration)
150 800 1200 150 800 1200 150 800 1200 mV
t
r
t
f
Output Rise/Fall Times Q, Q
(20% − 80%)
70 120 170 70 140 200 70 150 220 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
20.Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to V
CC
− 2.0 V.
21.Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays
are measured from the cross point of the inputs to the cross point of the outputs.
Figure 2. F
max
0
100
200
300
400
500
600
700
800
900
1000
0 1000 2000 3000 4000
FREQUENCY (MHz)
V
OUTpp
(mV)
MC10EP57, MC100EP57
http://onsemi.com
8
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Z
o
= 50 W
Z
o
= 50 W
50 W 50 W
V
TT
V
TT
= V
CC
− 2.0 V
ORDERING INFORMATION
Device Package Shipping
†
MC10EP57DTG TSSOP−20
(Pb−Free)
75 Units / Rail
MC10EP57DTR2G TSSOP−20
(Pb−Free)
2500 / Tape & Reel
MC10EP57MNG QFN−20
(Pb−Free)
92 Units / Rail
MC10EP57MNTXG QFN−20
(Pb−Free)
3000 / Tape & Reel
MC100EP57DTG TSSOP−20
(Pb−Free)
75 Units / Rail
MC100EP57DTR2G TSSOP−20
(Pb−Free)
2500 / Tape & Reel
MC100EP57MNG QFN−20
(Pb−Free)
92 Units / Rail
MC100EP57MNTXG QFN−20
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D − ECL Clock Distribution Techniques
AN1406/D − Designing with PECL (ECL at +5.0 V)
AN1503/D −
ECLinPSt I/O SPiCE Modeling Kit
AN1504/D − Metastability and the ECLinPS Family
AN1568/D − Interfacing Between LVDS and ECL
AN1672/D − The ECL Translator Guide
AND8001/D − Odd Number Counters Design
AND8002/D − Marking and Date Codes
AND8020/D − Termination of ECL Logic Devices
AND8066/D − Interfacing with ECLinPS
AND8090/D − AC Characteristics of ECL Devices
MC10EP57, MC100EP57
http://onsemi.com
9
PACKAGE DIMENSIONS
TSSOP−20
CASE 948E−02
ISSUE C
DIM
A
MIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B 4.30 4.50 0.169 0.177
C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
110
1120
PIN 1
IDENT
A
B
−T−
0.100 (0.004)
C
D
G
H
SECTION N−N
K
K1
JJ1
N
N
M
F
−W−
SEATING
PLANE
−V−
−U−
S
U
M
0.10 (0.004) V
S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
--- ---
S
U0.15 (0.006) T
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
P1-P3P4-P6P7-P9P10-P10

MC100EP57DTR2G

Mfr. #:
Buy MC100EP57DTR2G
Manufacturer:
ON Semiconductor
Description:
Encoders, Decoders, Multiplexers & Demultiplexers 3.3V/5V ECL Diff 4:1 Mux
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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