OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

NCP708MU330TAG

P1-P3P4-P6P7-P9
NCP708
www.onsemi.com
7
TYPICAL CHARACTERISTICS
V
IN
= V
OUT−NOM
+ 0.3 V or V
IN
= 2.4 V whatever is greater, V
EN
= 0.9 V, I
OUT
= 10 mA, C
IN
= C
OUT
= 4.7 mF, T
J
= 25°C.
Figure 17. Load Transient Response Figure 18. Turn−ON/OFF − VIN Driven (slow)
Figure 19. Turn−ON/OFF − VIN Driven (fast) Figure 20. Turn−ON/OFF − EN Driven
Figure 21. q
JA
and P
D(MAX)
vs. Copper Area
PCB COPPER AREA (mm
2
)
6005004003002001000
60
80
100
120
140
180
200
220
q
JA
, JUNCTION TO AMBIENT
THERMAL RESISTANCE (°C/W)
500 mA/div50 mV/div
V
OUT−NOM
= 3.3 V
3.3 V
V
OUT
1 mA
t
R
= t
F
= 1 ms
40 ms/div
I
OUT
1000 mA
50 mA/div1 V/div
V
OUT−NOM
= 3.3 V
V
OUT
2 ms/div
I
IN
V
IN
160
0
0.2
0.4
0.6
0.8
1.2
1.4
1.6
1.0
P
D(MAX)
, MAXIMUM POWER
DISSIPATION (W)
q
JA
, 1 oz Cu
q
JA
, 2 oz Cu
P
D(MAX)
, 1 oz Cu
P
D(MAX)
, 2 oz Cu
V
OUT−NOM
= 3.3 V
V
OUT−NOM
= 3.3 V
100 mA/div1 V/div
5.5 V
3.3 V
V
OUT
40 ms/div
I
IN
0 V
V
IN
V
OUT
I
IN
V
EN
1 ms/div
0 V
0 V
3.3 V
0.9 V
100 mA/div 1 V/div1 V/div
C
OUT
is discharged just by
load resistance 250 Ohm
NCP708
www.onsemi.com
8
APPLICATIONS INFORMATION
Input Decoupling (Cin)
A 4.7 mF capacitor either ceramic or tantalum is
recommended and should be connected as close as possible
to the pins of NCP708 device. Higher values and lower ESR
will improve the overall line transient response.
Output Decoupling (Cout)
The minimum decoupling value is 4.7 mF and can be
augmented to fulfill stringent load transient requirements.
The regulator accepts ceramic chip capacitors MLCC. If a
tantalum capacitor is used, and its ESR is large, the loop
oscillation may result. Larger values improve noise
rejection and PSRR.
Enable Operation
The enable pin EN will turn on or off the regulator. These
limits of threshold are covered in the electrical specification
section of this data sheet. If the enable is not used then the
pin should be connected to V
IN
.
Hints
Please be sure the V
in
and GND lines are sufficiently wide.
If their impedance is high, noise pickup or unstable
operation may result.
Set external components, especially the output capacitor,
as close as possible to the circuit.
The sense pin SNS trace is recommended to be kept as far
from noisy power traces as possible and as close to load as
possible.
Thermal
As power across the NCP708 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature affect the rate of temperature rise for the part.
This is stating that when the NCP708 has good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation.
The power dissipation across the device can be roughly
represented by the equation:
P
D
+
ǒ
V
IN
* V
OUT
Ǔ
*I
OUT
[W]
(eq. 1)
The maximum power dissipation depends on the thermal
resistance of the case and circuit board, the temperature
differential between the junction and ambient, PCB
orientation and the rate of air flow.
The maximum allowable power dissipation can be
calculated using the following equation:
P
MAX
+
ǒ
T
J
* T
A
Ǔ
ńq
JA
[W]
(eq. 2)
Where (T
J
− T
A
) is the temperature differential between
the junction and the surrounding environment and q
JA
is the
thermal resistance from the junction to the ambient.
Connecting the exposed pad and non connected pin 3 to
a large ground pad or plane helps to conduct away heat and
improves thermal relief.
ORDERING INFORMATION
Device Nominal Ooutput Voltage Package Shipping
†
NCP708MU330TAG 3.3 V UDFN6 3 x 3
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCP708
www.onsemi.com
9
PACKAGE DIMENSIONS
UDFN6 3x3, 0.95P
CASE 517DD
ISSUE O
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PIN 1
REFERENCE
A
B
C0.15
2X
2X
TOP VIEW
D
E
C0.15
NOTES:
5. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
6. CONTROLLING DIMENSION: MILLIMETERS.
7. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30
MM FROM THE TERMINAL TIP.
8. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
E2
BOTTOM VIEW
b
0.10
6X
L
1
3
0.05
C AB
C
D2
e
K
64
6X
(A3)
C
C0.08
7X
C0.10
SIDE VIEW
A1
A
SEATING
PLANE
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.20 REF
b 0.25 0.35
D 3.00 BSC
D2 2.30 2.50
E 3.00 BSC
E2 1.55 1.75
e 0.95 BSC
K
L 0.30 0.50
NOTE 3
DETAIL B
DETAIL A
2.60
3.30
0.95
0.45
6X
1.80
DIMENSIONS: MILLIMETERS
1
0.60
6X
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
L1 −−− 0.15
PITCH
PKG
OUTLINE
RECOMMENDED
0.28 REF
NOTE 4
ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
P
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NCP708/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loc
al
Sales Representative
P1-P3P4-P6P7-P9

NCP708MU330TAG

Mfr. #:
Buy NCP708MU330TAG
Manufacturer:
ON Semiconductor
Description:
LDO Voltage Regulators NCP708 - 3V3 LDO
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet