OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

NE5532DR2G

P1-P3P4-P6P7-P9P10-P10
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
7
ORDERING INFORMATION
Device Description Temperature Range Shipping
†
NE5532AD8 8−Pin Plastic Small Outline (SO−8) Package
0 to 70°C
98 Units / Rail
NE5532AD8G 8−Pin Plastic Small Outline (SO−8) Package
(Pb−Free)
98 Units / Rail
NE5532AD8R2 8−Pin Plastic Small Outline (SO−8) Package 2500 / Tape & Reel
NE5532AD8R2G 8−Pin Plastic Small Outline (SO−8) Package
(Pb−Free)
2500 / Tape & Reel
NE5532AN 8−Pin Plastic Dual In−Line Package (PDIP−8) 50 Units / Rail
NE5532ANG 8−Pin Plastic Dual In−Line Package (PDIP−8)
(Pb−Free)
50 Units / Rail
NE5532D 16−Pin Plastic Small Outline (SO−16 WB) Package 47 Units / Rail
NE5532DG 16−Pin Plastic Small Outline (SO−16 WB) Package
(Pb−Free)
47 Units / Rail
NE5532DR2 16−Pin Plastic Small Outline (SO−16 WB) Package 1000 Tape & Reel
NE5532DR2G 16−Pin Plastic Small Outline (SO−16 WB) Package
(Pb−Free)
1000 Tape & Reel
NE5532D8 8−Pin Plastic Small Outline (SO−8) Package 98 Units / Rail
NE5532D8G 8−Pin Plastic Small Outline (SO−8) Package
(Pb−Free)
98 Units / Rail
NE5532D8R2 8−Pin Plastic Small Outline (SO−8) Package 2500 / Tape & Reel
NE5532D8R2G 8−Pin Plastic Small Outline (SO−8) Package
(Pb−Free)
2500 / Tape & Reel
NE5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) 50 Units / Rail
NE5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8)
(Pb−Free)
50 Units / Rail
SA5532N 8−Pin Plastic Dual In−Line Package (PDIP−8)
−40 to +85°C
50 Units / Rail
SA5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8)
(Pb−Free)
50 Units / Rail
SE5532AD8 8−Pin Plastic Small Outline (SO−8) Package
−55 to +125°C
98 Units / Rail
SE5532AD8G 8−Pin Plastic Small Outline (SO−8) Package
(Pb−Free)
98 Units / Rail
SE5532AD8R2 8−Pin Plastic Small Outline (SO−8) Package 2500 / Tape & Reel
SE5532AD8R2G 8−Pin Plastic Small Outline (SO−8) Package
(Pb−Free)
2500 / Tape & Reel
SE5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) 50 Units / Rail
SE5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8)
(Pb−Free)
50 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
8
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
SEATING
PLANE
1
4
58
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0 8 0 8
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) Z
S
X
S
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒ
mm
inches
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
9
PACKAGE DIMENSIONS
8−Pin Plastic Dual In−Line Package (PDIP−8)
N SUFFIX
CASE 626−05
ISSUE N
14
58
b2
NOTE 8
D
b
L
A1
A
eB
E
A
TOP VIEW
C
SEATING
PLANE
0.010 CA
SIDE VIEW
END VIEW
END VIEW
WITH LEADS CONSTRAINED
DIM MIN MAX
INCHES
A −−−− 0.210
A1 0.015 −−−−
b 0.014 0.022
C 0.008 0.014
D 0.355 0.400
D1 0.005 −−−−
e 0.100 BSC
E 0.300 0.325
M −−−− 10
−−− 5.33
0.38 −−−
0.35 0.56
0.20 0.36
9.02 10.16
0.13 −−−
2.54 BSC
7.62 8.26
−−− 10
MIN MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT
TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1 0.240 0.280 6.10 7.11
b2
eB −−−− 0.430 −−− 10.92
0.060 TYP 1.52 TYP
E1
M
8X
c
D1
B
A2 0.115 0.195 2.92 4.95
L 0.115 0.150 2.92 3.81
°°
H
NOTE 5
e
e/2
A2
NOTE 3
M
B
M
NOTE 6
M
P1-P3P4-P6P7-P9P10-P10

NE5532DR2G

Mfr. #:
Buy NE5532DR2G
Manufacturer:
ON Semiconductor
Description:
Operational Amplifiers - Op Amps 3-20V Dual Low Noise Commercial Temp
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet