NXP Semiconductors
PHPT61003PY
100 V, 3A PNP high power bipolar transistor
PHPT61003PY All information provided in this document is subject to legal disclaimers. © NXP N.V. 2014. All rights reserved
Product data sheet 13 January 2014 3 / 15
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
collector-base voltage open emitter - -100 V
V
CEO
collector-emitter voltage open base - -100 V
V
EBO
emitter-base voltage open collector - -8 V
I
C
collector current - -3 A
I
CM
peak collector current t
p
≤ 1 ms; single pulse - -8 A
I
B
base current - -0.5 A
[1] - 1.25 W
[2] - 3 W
[3] - 5 W
P
tot
total power dissipation T
amb
≤ 25 °C
[4] - 25 W
T
j
junction temperature - 175 °C
T
amb
ambient temperature -55 175 °C
T
stg
storage temperature -65 175 °C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB); single-sided copper; tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB; single-sided copper; tin-plated mounting pad for collector 6 cm
2
.
[3] Device mounted on an ceramic PCB; Al
2
O
3
; standard footprint.
[4] Power dissipation from junction to mounting base.
(1) Ceramic PCB, Al
2
O
3
, standard footprint
(2) FR4 PCB, mounting pad for collector 6 cm
2
(3) FR4 PCB, standard footprint
Fig. 1. Power derating curves
NXP Semiconductors
PHPT61003PY
100 V, 3A PNP high power bipolar transistor
PHPT61003PY All information provided in this document is subject to legal disclaimers. © NXP N.V. 2014. All rights reserved
Product data sheet 13 January 2014 4 / 15
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
[1] - - 115 K/W
[2] - - 50 K/W
R
th(j-a)
thermal resistance
from junction to
ambient
in free air
[3] - - 30 K/W
R
th(j-sp)
thermal resistance
from junction to solder
point
- - 6 K/W
[1] Device mounted on an FR4 Printed-Circuit Board (PCB); single-sided copper; tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB; single-sided copper; tin-plated and mounting pad for collector 6 cm
2
.
[3] Device mounted on an ceramic PCB; Al
2
O
3
; standard footprint.
aaa-010427
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
-1
10
-5
1010
-2
10
-4
10
2
10
-1
t
p
(s)
10
-3
10
3
1
duty cycle = 1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01
0
0.25
FR4 PCB, standard footprint
Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
NXP Semiconductors
PHPT61003PY
100 V, 3A PNP high power bipolar transistor
PHPT61003PY All information provided in this document is subject to legal disclaimers. © NXP N.V. 2014. All rights reserved
Product data sheet 13 January 2014 5 / 15
aaa-010428
10
-5
1010
-2
10
-4
10
2
10
-1
t
p
(s)
10
-3
10
3
1
10
1
10
2
Z
th(j-a)
(K/W)
10
-2
duty cycle = 1
0.75
0.5
0.33
0.25
0.2
0.1
0.05
0.02
0.01
0
FR4 PCB, mounting pad for collector 6 cm
2
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

PHPT61003PYX

Mfr. #:
Manufacturer:
Nexperia
Description:
Bipolar Transistors - BJT NPN High Power BipolarTransistor
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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