Document #: 001-48923 Rev. *C Page 4 of 10
Frequency Table
Input
Output Frequency (MHz)
Input Xtal Frequency (MHz) FS
25 0 62.5
25 1 75.0
Absolute Maximum Conditions
Parameter Description Condition Min Max Unit
V
DD
Supply Voltage –0.5 4.4 V
V
IN
[1.]
Input Voltage, DC Relative to VSS –0.5 V
DD
+ 0.5 V
T
S
Temperature, Storage Non Functional –65 150 °C
T
J
Temperature, Junction – 135 °C
ESD
HBM
ESD Protection (Human Body Model) JEDEC STD 22-A114-B 2000 – V
UL–94 Flammability Rating At 1/8 in. V–0
Θ
JA
[2]
Thermal Resistance, Junction to
Ambient
0 m/s airflow 100 °C/W
1 m/s airflow 91
2.5 m/s airflow 87
Operating Conditions
Parameter Description Min Max Unit
V
DD
3.3 V Supply Voltage 3.135 3.465 V
T
A
Ambient Temperature, Commercial 0 70 °C
T
PU
Power up time for all V
DD
to reach minimum specified voltage (ensure power
ramps are monotonic)
0.05 500 ms
Electrical Characteristics for Input
Parameter Description Test Conditions Min Typ Max Unit
V
IL
Input Low Voltage , FS – – 0.3*V
DD
V
V
IH
Input High Voltage, FS 0.7*V
DD
–– V
I
IL
Input Low Current , FS FS = V
SS
–50 – – µA
I
IH
Input High Current, FS FS = V
DD
––115µA
C
IN
[3]
Input Capacitance, FS – 15 – pF
C
INX
[3]
Input Capacitance, XIN & XOUT – 4.5 – pF
DC Electrical Characteristics for Power Supplies
Parameter Description Min Typ Max Unit
I
DD
Power Supply Current with output unterminated – – 125 mA
I
DDT
Power Supply Current with output terminated – – 180 mA
Note
1. The voltage on any input or IO pin cannot exceed the power pin during power up. Power supply sequencing is NOT required.
2. Simulated using Apache Sentinel TI software. The board is derived from the JEDEC multilayer standard. It measures 76 x 114 x 1.6 mm and has 4-layers of
copper (2/1/1/2 oz.). The internal layers are 100% copper planes, while the top and bottom layers have 50% metallization. No vias are included in the model.
3. Not 100% tested, guaranteed by design and characterization.
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