LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 7.1 — 16 October 2013 37 of 69
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
7.25.6 Memory mapping control
The memory mapping control alters the mapping of the interrupt vectors that appear at the
beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the Boot
ROM or the SRAM. This allows code running in different memory spaces to have control
of the interrupts.
7.26 Emulation and debugging
The LPC2364/65/66/67/68 support emulation and debugging via a JTAG serial port. A
trace port allows tracing program execution. Debugging and trace functions are
multiplexed only with GPIOs on P2[0] to P2[9]. This means that all communication, timer,
and interface peripherals residing on other pins are available during the development and
debugging phase as they are when the application is run in the embedded system itself.
7.26.1 EmbeddedICE
The EmbeddedICE logic provides on-chip debug support. The debugging of the target
system requires a host computer running the debugger software and an EmbeddedICE
protocol convertor. The EmbeddedICE protocol convertor converts the Remote Debug
Protocol commands to the JTAG data needed to access the ARM7TDMI-S core present
on the target system.
The ARM core has a Debug Communication Channel (DCC) function built-in. The DCC
allows a program running on the target to communicate with the host debugger or another
separate host without stopping the program flow or even entering the debug state. The
DCC is accessed as a coprocessor 14 by the program running on the ARM7TDMI-S core.
The DCC allows the JTAG port to be used for sending and receiving data without affecting
the normal program flow. The DCC data and control registers are mapped in to addresses
in the EmbeddedICE logic.
The JTAG clock (TCK) must be slower than
1
6
of the CPU clock (CCLK) for the JTAG
interface to operate.
7.26.2 Embedded trace
Since the LPC2364/65/66/67/68 have significant amounts of on-chip memories, it is not
possible to determine how the processor core is operating simply by observing the
external pins. The ETM provides real-time trace capability for deeply embedded
processor cores. It outputs information about processor execution to a trace port. A
software debugger allows configuration of the ETM using a JTAG interface and displays
the trace information that has been captured.
The ETM is connected directly to the ARM core and not to the main AMBA system bus. It
compresses the trace information and exports it through a narrow trace port. An external
Trace Port Analyzer captures the trace information under software debugger control. The
trace port can broadcast the Instruction trace information. Instruction trace (or PC trace)
shows the flow of execution of the processor and provides a list of all the instructions that
were executed. Instruction trace is significantly compressed by only broadcasting branch
addresses as well as a set of status signals that indicate the pipeline status on a cycle by
cycle basis. Trace information generation can be controlled by selecting the trigger
resource. Trigger resources include address comparators, counters and sequencers.
LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 7.1 — 16 October 2013 38 of 69
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
Since trace information is compressed the software debugger requires a static image of
the code being executed. Self-modifying code can not be traced because of this
restriction.
7.26.3 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables
real-time debug. It is a lightweight debug monitor that runs in the background while users
debug their foreground application. It communicates with the host using the DCC, which is
present in the EmbeddedICE logic. The LPC2364/65/66/67/68 contain a specific
configuration of RealMonitor software programmed into the on-chip ROM memory.
LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 7.1 — 16 October 2013 39 of 69
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
8. Limiting values
[1] The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless
otherwise noted.
[2] Including voltage on outputs in 3-state mode.
[3] Not to exceed 4.6 V.
[4] The peak current is limited to 25 times the corresponding maximum current.
[5] The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined
based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details.
[6] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Symbol Parameter Conditions Min Max Unit
V
DD(3V3)
supply voltage (3.3 V) core and external
rail
3.0 3.6 V
V
DD(DCDC)(3V3)
DC-to-DC converter supply voltage
(3.3 V)
3.0 3.6 V
V
DDA
analog 3.3 V pad supply voltage 0.5 +4.6 V
V
i(VBAT)
input voltage on pin VBAT for the RTC 0.5 +4.6 V
V
i(VREF)
input voltage on pin VREF 0.5 +4.6 V
V
IA
analog input voltage on ADC related
pins
0.5 +5.1 V
V
I
input voltage 5 V tolerant I/O
pins; only valid
when the V
DD(3V3)
supply voltage is
present
[2]
0.5 +6.0 V
other I/O pins
[2][3]
0.5 V
DD(3V3)
+
0.5
V
I
DD
supply current per supply pin
[4]
- 100 mA
I
SS
ground current per ground pin
[4]
- 100 mA
T
stg
storage temperature non-operating
[5]
65 +150 C
P
tot(pack)
total power dissipation (per package) based on package
heat transfer, not
device power
consumption
-1.5W
V
ESD
electrostatic discharge voltage human body
model; all pins
[6]
2500 +2500 V

LPC2366FBD100,551

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU ARM7 256KF/USB/ENET
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