LTM4624
24
4624fc
For more information www.linear.com/LTM4624
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
PACKAGE TOP VIEW
4
PIN “A1”
CORNER
Y
X
aaa Z
aaa Z
DETAIL A
PACKAGE BOTTOM VIEW
3
SEE NOTES
SUGGESTED PCB LAYOUT
TOP VIEW
0.000
2.540
1.270
1.270
2.540 0.630 ±0.025
2.540
1.270
2.540
1.270
0.3175
0.3175
0.000
E
D
C
B
A
12345
PIN 1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNATION PER JESD MS-028 AND JEP95
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
4
3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
Øb (25 PLACES)
A
DETAIL B
PACKAGE SIDE VIEW
Z
M
X YZddd
M
Zeee
A2
D
E
e
b
F
G
DETAIL A
0.3175
0.3175
BGA 25 0913 REV B
LTMXXXXXX
µModule
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
BGA Package
25-Lead (6.25mm × 6.25mm × 5.01mm)
(Reference LTC DWG # 05-08-1905 Rev B)
DETAIL B
SUBSTRATE
A1
b1
ccc Z
MOLD
CAP
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
4.81
0.50
4.31
0.60
0.60
0.36
3.95
NOM
5.01
0.60
4.41
0.75
0.63
6.25
6.25
1.27
5.08
5.08
0.41
4.00
MAX
5.21
0.70
4.51
0.90
0.66
0.46
4.05
0.15
0.10
0.20
0.30
0.15
NOTES
DIMENSIONS
TOTAL NUMBER OF BALLS: 25
// bbb Z
Z
H2
H1
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
!
7
SEE NOTES
