7
FN6798.2
October 16, 2015
ISL89411 Macro Model
**** ISL89411 Model ****
* input
* | gnd
* | | Vsupply
* | | | Vout
.subckt M89411 2 3 6 7
V1 12 3 1.6
R1 13 15 1k
R2 14 15 5k
R5 11 12 100
C1 15 3 43.3 pF
D1 14 13 dmod
X1 13 11 2 3 comp1
X2 16 12 15 3 comp1
sp 6 7 16 3 spmod
sn 7 3 16 3 snmod
g1 11 0 13 0 938µ
.model dmod d
.model spmod vswitch ron3 roff2meg von1 voff1.5
.model snmod vswitch ron4 roff2meg von3 voff2
.ends M89411
FIGURE 12. RISE/FALL TIME vs TEMPERATURE FIGURE 13. DELAY vs TEMPERATURE
Typical Performance Curves (Continued)
ISL89410, ISL89411, ISL89412
8
FN6798.2
October 16, 2015
.subckt comp1 out inp inm vss
e1 out vss table { (v(inp) v(inm))* 5000} (0,0) (3.2,3.2)
Rout out vss 10meg
Rinp inp vss 10meg
Rinm inm vss 10meg
.ends comp1
Application Guidelines
It is important to minimize inductance to the power FET by
keeping the output drive current loop as short as possible.
Also, the decoupling capacitor, Cq, should be a high quality
ceramic capacitor with a Q that should be a least 10x the
gate Q of the power FET. A ground plane under this circuit is
also recommended.
In applications where it is difficult to place the driver very
close to the power FET (which may result with excessive
parasitic inductance), it then may be necessary to add an
external gate resistor to dampen the inductive ring. If this
resistor must be too large in value to be effective, then as an
alternative, Schottky diodes can be added to clamp the ring
voltage to V+ or GND.
Where high supply voltage operation is required (15V to
18V), input signals with a minimum of 3.3V input drive is
suggested and a minimum rise/fall time of 100ns. This is
recommended to minimize the internal bias current power
dissipation.
Excessive power dissipation in the driver can result when
driving highly capacitive FET gates at high frequencies.
These gate power losses are defined by Equation 1:
where:
P = Power
Q
c
= Charge of the Power FET at V
gs
V
gs
= Gate drive voltage (V+)
f
SW
= switching Frequency
Adding a gate resistor to the output of the driver will transfer
some of the driver dissipation to the resistor. Another
possible solution is to lower the gate driver voltage which
also lowers Q
c
.
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask
.
Reliability reports are also available from our website at www.intersil.com/support
FIGURE 14. RECOMMENDED LAYOUT METHODS
GND
V+
C
q
LOOP AS
SHORT AS
POSSIBLE
C
q
SHOULD BE AS CLOSE AS
POSSIBLE TO THE V+ AND
GND PINS
GND
V+
C
q
PARASITIC LEAD
INDUCTANCE
P2Q
C
V
gs
f
SW
=
(EQ. 1)
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that
you have the latest revision.
DATE REVISION CHANGE
October 16, 2015 FN6798.2 Updated Ordering Information Table on page 2.
Added Revision History and About Intersil sections.
Updated POD MDP0027 to M8.15E.
ISL89410, ISL89411, ISL89412
9
FN6798.2
October 16, 2015
ISL89410, ISL89411, ISL89412
Package Outline Drawing
M8.15E
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 0, 08/09
Unless otherwise specified, tolerance : Decimal ± 0.05
The pin #1 identifier may be either a mold or mark feature.
Interlead flash or protrusions shall not exceed 0.25mm per side.
Dimension does not include interlead flash or protrusions.
Dimensions in ( ) for Reference Only.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
5.
4.
2.
Dimensions are in millimeters.1.
NOTES:
DETAIL "A"
SIDE VIEW “A
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
A
B
4
4
0.25 AMC B
C
0.10 C
5
ID MARK
PIN NO.1
(0.35) x 45°
SEATING PLANE
GAUGE PLANE
0.25
(5.40)
(1.50)
4.90 ± 0.10
3.90 ± 0.10
1.27
0.43 ± 0.076
0.63 ±0.23
4° ± 4°
DETAIL "A"
0.22 ± 0.03
0.175 ± 0.075
1.45 ± 0.1
1.75 MAX
(1.27)
(0.60)
6.0 ± 0.20
Reference to JEDEC MS-012.
6.
SIDE VIEW “B

ISL89410IP

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
IC DRVR MOSFET DUAL-CH 8DIP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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