25/30
M93C86, M93C76, M93C66, M93C56, M93C46, M93C06
Figure 15. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Package Outline
Notes: 1. Drawing is not to scale.
Table 25. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Package
Mechanical Data
TSSOP8BM
1
8
CP
c
L
EE1
D
A2A
α
eb
4
5
A1
L1
Symbol
mm inches
Typ. Min. Max. Typ. Min. Max.
A 1.100 0.0433
A1 0.050 0.150 0.0020 0.0059
A2 0.850 0.750 0.950 0.0335 0.0295 0.0374
b 0.250 0.400 0.0098 0.0157
c 0.130 0.230 0.0051 0.0091
D 3.000 2.900 3.100 0.1181 0.1142 0.1220
E 4.900 4.650 5.150 0.1929 0.1831 0.2028
E1 3.000 2.900 3.100 0.1181 0.1142 0.1220
e 0.650 0.0256
CP 0.100 0.0039
L 0.550 0.400 0.700 0.0217 0.0157 0.0276
L1 0.950 0.0374
α
M93C86, M93C76, M93C66, M93C56, M93C46, M93C06
26/30
Figure 16. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline
Notes: 1. Drawing is not to scale.
Table 26. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data
TSSOP8AM
1
8
CP
c
L
EE1
D
A2A
α
eb
4
5
A1
L1
Symbol
mm inches
Typ. Min. Max. Typ. Min. Max.
A 1.200 0.0472
A1 0.050 0.150 0.0020 0.0059
A2 1.000 0.800 1.050 0.0394 0.0315 0.0413
b 0.190 0.300 0.0075 0.0118
c 0.090 0.200 0.0035 0.0079
CP 0.100 0.0039
D 3.000 2.900 3.100 0.1181 0.1142 0.1220
e 0.650 0.0256
E 6.400 6.200 6.600 0.2520 0.2441 0.2598
E1 4.400 4.300 4.500 0.1732 0.1693 0.1772
L 0.600 0.450 0.750 0.0236 0.0177 0.0295
L1 1.000 0.0394
α
27/30
M93C86, M93C76, M93C66, M93C56, M93C46, M93C06
PART NUMBERING
Table 27. Ordering Information Scheme
Note: 1. Produced with High Reliability Certified Flow (HRCF).
2. M93C06 is “Not for New Design”.
3. Available only on new products: identified by the Process Identification letter W.
4. Turned die option is not available for all devices. Please contact your nearest STMicroelectronics Sales Office.
Devices are shipped from the factory with the
memory content set at all 1s (FFFFh for x16, FFh
for x8).
For a list of available options (speed, package,
etc.) or for further information on any aspect of this
Example: M93C86 –TWMN6TP
Device Type
M93 = MICROWIRE serial access EEPROM
Device Function
86 = 16 Kbit (2048 x 8)
76 = 8 Kbit (1024 x 8)
66 = 4 Kbit (512 x 8)
56 = 2 Kbit (256 x 8)
46 = 1 Kbit (128 x 8)
06
2
= 256 bit (32 x 8)
Turned Die
blank = Normal (unturned) Die
T
4
= 90° Turned Die
Operating Voltage
blank = V
CC
= 4.5 to 5.5V
W = V
CC
= 2.5 to 5.5V
R = V
CC
= 1.8 to 5.5V
Package
BN = PDIP8
MN = SO8 (150 mil width)
DW = TSSOP8 (169 mil width)
DS
3
= TSSOP8 (3x3mm body size)
Temperature Range
6 = –40 to 85 °C
7
1
= –40 to 105 °C
3
1
= –40 to 125 °C
Option
blank = Standard Packing
T = Tape & Reel Packing
Plating Technology
blank = Standard SnPb plating
P = Pb-Free, RoHS compliant
G = Green package

M93C46-RDS6G

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
EEPROM 1K (64x8 or 32x16)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet