XA3S200-4PQG208I

DS314 (v1.3) June 18, 2009 www.xilinx.com
Product Specification 1
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Summary
The Xilinx® Automotive (XA) Spartan®-3 family of Field-Programmable Gate Arrays meets the needs of high-volume,
cost-sensitive automotive electronic applications. The five-member family offers densities ranging from 50,000 to 1.5 million
system gates, as shown in Ta bl e 1 .
Introduction
XA devices are available in both extended-temperature
Q-grade (–40
°C to +125°C T
J
) and I-grade (–40°C to
+100
°C T
J
) and are qualified to the industry-recognized
AEC-Q100 standard.
The XA Spartan-3 family builds on the success of the earlier
XA Spartan-IIE family by increasing the amount of logic
resources, the capacity of internal RAM, the total number of
I/Os, and the overall level of performance as well as by
improving clock management functions. These Spartan-3
enhancements, combined with advanced process
technology, deliver more functionality and bandwidth per
dollar than was previously possible, setting new standards
in the programmable logic industry.
Because of their exceptionally low cost, Spartan-3 FPGAs
are ideally suited to a wide range of advanced automotive
electronics modules and systems ranging from the latest
driver assistance and infotainment systems to instrument
clusters and gateways.
The Spartan-3 family is a flexible alternative to ASICs,
ASSPs, and microcontrollers. FPGAs avoid the high initial
NREs, the lengthy development cycles, and problems with
obsolescence. Also, FPGA programmability permits design
upgrades in the field with no hardware replacement
necessary.
Features
AEC-Q100 device qualification and full PPAP
documentation support available in both extended
temperature Q-grade and I-grade
Guaranteed to meet full electrical specification over the
T
J
= –40°C to +125°C temperature range
Revolutionary 90-nanometer process technology
Low cost, high-performance logic solution for
high-volume, automotive applications
Three power rails: for core (1.2V), I/Os (1.2V to
3.3V), and auxiliary purposes (2.5V)
SelectIO™ interface signaling
Up to 487 I/O pins
622 Mb/s data transfer rate per I/O
Eighteen single-ended signal standards
Eight differential signal standards including LVDS
Termination by Digitally Controlled Impedance
Signal swing ranging from 1.14V to 3.45V
Double Data Rate (DDR) support
Logic resources
Abundant logic cells with shift register capability
Wide multiplexers
0<BL Blue>
XA Spartan-3 Automotive FPGA Family:
Introduction and Ordering Information
DS314 (v1.3) June 18, 2009
00
Product Specification
R
Tabl e 1 : Summary of Spartan-3 FPGA Attributes
Device
System
Gates
Logic
Cells
CLB Array
(One CLB = Four Slices)
Distributed
RAM (bits
1
)
Block RAM
(bits
1
)
Dedicated
Multipliers DCMs
Maximum
User I/O
Maximum
Differential
I/O PairsRows Columns Total CLBs
XA3S50 50K 1,728 16 12 192 12K 72K 4 2 124 56
XA3S200 200K 4,320 24 20 480 30K 216K 12 4 173 76
XA3S400 400K 8,064 32 28 896 56K 288K 16 4 264 116
XA3S1000 1M 17,280 48 40 1,920 120K 432K 24 4 333 149
XA3S1500 1.5M 29,952 64 52
3,328
208K 576K 32 4 487 221
Notes:
1. By convention, one Kb is equivalent to 1,024 bits.
Introduction and Ordering Information
DS314 (v1.3) June 18, 2009 www.xilinx.com
Product Specification 2
R
Fast look-ahead carry logic
Dedicated 18 x 18 multipliers
JTAG logic compatible with IEEE 1149.1/1532
SelectRAM™ hierarchical memory
Up to 576 Kbits of total block RAM
Up to 208 Kbits of total distributed RAM
Digital Clock Manager (up to four DCMs)
Clock skew elimination
Frequency synthesis
High-resolution phase shifting
Maximum clock frequency 125 MHz
Fully supported by Xilinx ISE® software development
system
Synthesis, mapping, placement and routing
MicroBlaze™ processor, CAN, LIN, MOST, and other
cores
Pb-free packaging options
Xilinx and all of our production partners are qualified to
ISO-TS16949
Please refer to the Spartan-3 complete data sheet (DS099)
for a full product description, AC and DC specifications, and
package pinout descriptions
Architectural Overview
The Spartan-3 family architecture consists of five
fundamental programmable functional elements:
Configurable Logic Blocks (CLBs) contain RAM-based
Look-Up Tables (LUTs) to implement logic and storage
elements that can be used as flip-flops or latches.
CLBs can be programmed to perform a wide variety of
logical functions as well as to store data.
Input/Output Blocks (IOBs) control the flow of data
between the I/O pins and the internal logic of the
device. Each IOB supports bidirectional data flow plus
3-state operation. Twenty-six different signal standards,
including eight high-performance differential standards,
are available as shown in Table 2 . Double Data-Rate
(DDR) registers are included. The Digitally Controlled
Impedance (DCI) feature provides automatic on-chip
terminations, simplifying board designs.
Block RAM provides data storage in the form of 18-Kbit
dual-port blocks.
Multiplier blocks accept two 18-bit binary numbers as
inputs and calculate the product.
Digital Clock Manager (DCM) blocks provide
self-calibrating, fully digital solutions for distributing,
delaying, multiplying, dividing, and phase shifting clock
signals.
These elements are organized as shown in Figure 1. A ring
of IOBs surrounds a regular array of CLBs. The XA3S50
has a single column of block RAM embedded in the array.
Those devices ranging from the XA3S200 to the XA3S1500
have two columns of block RAM. Each column is made up
of several 18
Kbit RAM blocks; each block is associated
with a dedicated multiplier. The DCMs are positioned at the
ends of the block RAM columns.
The Spartan-3 family features a rich network of traces and
switches that interconnect all five functional elements,
transmitting signals among them. Each functional element
has an associated switch matrix that permits multiple
connections to the routing.
Introduction and Ordering Information
DS314 (v1.3) June 18, 2009 www.xilinx.com
Product Specification 3
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Configuration
Spartan-3 FPGAs are programmed by loading configuration
data into robust static memory cells that collectively control
all functional elements and routing resources. Before
powering on the FPGA, configuration data is stored
externally in a PROM or some other nonvolatile medium
either on or off the board. After applying power, the
configuration data is written to the FPGA using any of five
different modes: Master Parallel, Slave Parallel, Master
Serial, Slave Serial and Boundary Scan (JTAG). The Master
and Slave Parallel modes use an 8-bit-wide SelectMAP
port.
I/O Capabilities
The SelectIO feature of Spartan-3 devices supports 18
single-ended standards and eight differential standards as
listed in
Tabl e 2. Many standards support the DCI feature,
which uses integrated terminations to eliminate unwanted
signal reflections.
Ta bl e 3 shows the number of user I/Os as
well as the number of differential I/O pairs available for each
device/package combination.
.
Figure 1: Spartan-3 Family Architecture
DS314-1_01_100808
Notes:
1. The XA3S50 has only the block RAM column on the far left.

XA3S200-4PQG208I

Mfr. #:
Manufacturer:
Xilinx
Description:
IC FPGA 141 I/O 208QFP
Lifecycle:
New from this manufacturer.
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