Introduction and Ordering Information
DS314 (v1.3) June 18, 2009 www.xilinx.com
Product Specification 7
R
Pb-Free Packaging
For additional information on Pb-free packaging, see XAPP427: Implementation and Solder Reflow Guidelines for Pb-Free
Packages.
Additional Resources
• DS099, Spartan-3 FPGA Family Data Sheet
• UG331
, Spartan-3 Generation FPGA User Guide
• UG332
, Spartan-3 Generation Configuration User Guide
Revision History
The following table shows the revision history for this document:
XA3S50 -4 PQ G 208 Q
Device Type
Speed Grade
Temperature Range:
Q-Grade = Automotive Extended (T
J
= –40°C to +125°C)
I-Grade = Automotive Industrial (T
J
= –40°C to +100°C)
Package Type
Number of Pins
Pb-free
Example:
DS314-1_03_100808
Tabl e 6 : Package Types and Number of Pins
Device Speed Grade Package Type / Number of Pins Temperature Range ( T
J
)
XA3S50 -4
Standard
Performance
VQG100 100-pin Very Thin Quad Flat Pack (VQFP) I I-Grade (– 40°C to +100°C)
XA3S200 TQG144 144-pin Thin Quad Flat Pack (TQFP) Q Q-Grade (– 40°C to +125°C)
XA3S400 PQG208 208-pin Plastic Quad Flat Pack (PQFP)
XA3S1000 FTG256
256-ball Fine-Pitch Thin Ball Grid Array
(FTBGA)
XA3S1500 FGG456 456-ball Fine-Pitch Ball Grid Array (FBGA)
FGG676 676-ball Fine-Pitch Ball Grid Array (FBGA)
Date Version Description
10/18/04 1.0 Initial Xilinx release.
12/20/04 1.1 Multiple text edits throughout.
10/27/06 1.2 Updated IO standards (Ta b l e 2 ), and link to Spartan-3 Data Sheet, added XA3S1500, TQG144, FGG676,
Table 4, and Ta bl e 5 .
11/28/06 1.2.1 Changed order of explanations in Ta ble 6 for TQG144 and PQG208.
11/12/07 1.2.2 Changed all values for the Block RAM (bits) column and two values for the XA3S1000 row in Tabl e 1 .
01/25/08 1.2.3 Changed XA3S1500 Q-Grade Maximum in Table 5 .
06/18/09 1.3 Added UG331 and UG332 to "Additional Resources" section.
