PROPRIETARY AND
CONFIDENTIAL
©2011 Silicon Storage Technology, Inc. DS75010B 09/11
16
2.4 GHz High-Gain, High-Efficiency Front-end Module
SST12LF03
Data Sheet
A
Microchip Technology Company
Product Ordering Information
Valid combinations for SST12LF03
SST12LF03-Q3DE
SST12LF03 Evaluation Kits
SST12LF03-Q3DE-K
Note:Valid combinations are those products in mass production or will be in mass production. Consult your SST
sales representative to confirm availability of valid combinations and to determine availability of new combi-
nations.
SST 12 LF 03 - Q3DE
XX XX XX
-
XXXX
Environmental Attribute
E
1
= non-Pb contact (lead) finish
Package Modifier
D = 20contact
Package Type
Q3 = UQFN
Product Family Identifier
Product Type
F = Front-end Module
Voltage
L = 3.0-3.6V
Frequency of Operation
2 = 2.4 GHz
Product Line
1 = RF Product
1. Environmental suffix “E” denotes non-Pb solder.
SST non-Pb solder devices are “RoHS Compliant”.
PROPRIETARY AND
CONFIDENTIAL
©2011 Silicon Storage Technology, Inc. DS75010B 09/11
17
2.4 GHz High-Gain, High-Efficiency Front-end Module
SST12LF03
Data Sheet
A
Microchip Technology Company
Packaging Diagrams
Figure 11:20-Contact Ultra-thin Qual Flat No-lead (UQFN)
SST Package Code: Q3D
Note: 1. Complies with JEDEC JEP95 MO-248E, variant UEEE except external paddle nominal dimensions, shape of terminals
at the body edge and shape of inboard terminals near the corners.
2. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch.
3. The external paddle is electrically connected to the die back-side and to V
SS
.
This paddle must be soldered to the PC board; it is required to connect this paddle to the V
SS
of the unit.
Connection of this paddle to any other voltage potential result in shorts and electrical malfunction of the device.
4. Untoleranced dimensions are nominal target dimensions.
5. All linear dimensions are in millimeters (max/min).
20-uqfn-3x3-Q3D-1.0
1.7
0.4 BSC
See notes
2 and 3
Pin #1
0.25
0.15
0.075
1.7
0.15
0.05 Max
0.45
0.35
0.60
0.50
TOP VIEW BOTTOM VIEWSIDE VIEW
1mm
3.00
±0.075
3.00
±0.075
0.15
0.06
Pin #1
(Engraved
Indicator)
PROPRIETARY AND
CONFIDENTIAL
©2011 Silicon Storage Technology, Inc. DS75010B 09/11
18
2.4 GHz High-Gain, High-Efficiency Front-end Module
SST12LF03
Data Sheet
A
Microchip Technology Company
Table 8:Revision History
Revision Description Date
A
Initial release of data sheet
Jun 2011
B
Various updates in Features and Product Description
Updated pin names in Figure 1 on page 3, Figure 2 on page 4, and
Table 1 on page 5
Revised values in Table 3 on page 6, Table 5 on page 7, Table 6 on
page 8, and Table 7 on page 8
Minor change in “Product Ordering Information” on page 16
Sep 2011
©
2011 Silicon Storage Technology, Inc–a Microchip Technology Company. All rights reserved.
SST, Silicon Storage Technology, the SST logo, SuperFlash, MTP, and FlashFlex are registered trademarks of Silicon Storage Tech-
nology, Inc. MPF, SQI, Serial Quad I/O, and Z-Scale are trademarks of Silicon Storage Technology, Inc. All other trademarks and
registered trademarks mentioned herein are the property of their respective owners.
Specifications are subject to change without notice. Refer to www.microchip.com for the most recent documentation. For the most current
package drawings, please see the Packaging Specification located at http://www.microchip.com/packaging.
Memory sizes denote raw storage capacity; actual usable capacity may be less.
SST makes no warranty for the use of its products other than those expressly contained in the Standard Terms and Conditions of
Sale.
For sales office locations and information, please see www.microchip.com.
Silicon Storage Technology, Inc.
A Microchip Technology Company
www.microchip.com
ISBN: 978-1-61341-643-3

SST12LF03-Q3DE

Mfr. #:
Manufacturer:
Microchip Technology
Description:
RF Front End WLAN 11B/G/N FEM PA+LNA+SPDT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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