Data Sheet ADG1408/ADG1409
Rev. D | Page 19 of 19
OUTLINE DIMENSIONS
16
9
8
1
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 37. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGC.
042709-A
1
0.65
BSC
BOTTOMVIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
P
IN 1
I
NDI
CA
TO
R
4.10
4.00 SQ
3.90
0.50
0.40
0.30
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
PIN 1
INDICATOR
0.35
0.30
0.25
2.60
2.50 SQ
2.40
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 38. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-16-26)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG1408YRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1408YRUZ-REEL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1408YRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1408YCPZ-REEL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-26
ADG1409YRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1409YRUZ-REEL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1409YRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1409YCPZ-REEL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-26
1
Z = RoHS Compliant Part.
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D04861-0-6/16(D)
