NB6L239
http://onsemi.com
12
PACKAGE DIMENSIONS
QFN16 3x3, 0.5P
CASE 485G
ISSUE F
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
2X
0.50
PITCH
1.84
3.30
1
DIMENSIONS: MILLIMETERS
0.58
16X
2X
0.30
16X
OUTLINE
PACKAGE
SOLDERING FOOTPRINT*
16X
SEATING
PLANE
L
D
E
0.10 C
A
A1
e
D2
E2
b
1
4
8
9
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
B
A
0.10
C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
LOCATION
0.05 C
0.05 C
(A3)
C
NOTE 4
16X
0.10 C
0.05 C
A B
NOTE 3
K
16X
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL A
DETAIL B
2X
2X
0.10 C A B
e/2
DIM MIN NOM MAX
MILLIMETERS
A 0.80 0.90 1.00
A1 0.00 0.03 0.05
A3 0.20 REF
b 0.18 0.24 0.30
D 3.00 BSC
D2 1.65 1.75 1.85
E 3.00 BSC
E2 1.65 1.75 1.85
e 0.50 BSC
K 0.18 TYP
L 0.30 0.40 0.50
L1 0.00 0.08
0.15
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NB6L239/D
ECLinPS and ECLinPS MAX are trademarks of Semiconductor Components Industries, LLC (SCILLC).
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