NB6L239
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4
Table 5. ATTRIBUTES
Characteristics Value
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
75 kW
75 kW
ESD Protection Human Body Model
Machine Model
Charged Device Model
> 1500 V
> 150 V
> 1000 V
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) PbFree Pkg
QFN16 Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
Transistor Count 367
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
V
CC
Positive Mode Power Supply V
EE
= 0 V 3.6 V
V
I
Input Voltage V
EE
= 0 V V
EE
v V
I
v V
CC
3.6 V
I
out
Output Current Continuous
Surge
50
100
mA
mA
I
BB
V
BBAC
Sink/Source Current ± 0.5 mA
T
A
Operating Temperature Range 40 to +85 °C
T
stg
Storage Temperature Range 65 to +150 °C
q
JA
Thermal Resistance (JunctiontoAmbient) 0 lfpm
500 lfpm
41.6
35.2
°C/W
°C/W
q
JC
Thermal Resistance (JunctiontoCase) Standard Board 4.0 °C/W
T
sol
Wave Solder PbFree 265 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may
affect device reliability.
NB6L239
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5
Table 6. DC CHARACTERISTICS, CLOCK INPUTS, LVPECL OUTPUTS
(V
CC
= 2.375 V to 3.465 V, V
EE
= 0 V)
Symbol Characteristic
405C 255C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
I
EE
Power Supply Cur-
rent
30 40 50 30 40 50 30 40 50 mA
V
OH
Output HIGH
Voltage (Notes 2, 3)
V
CC
= 3.3 V
V
CC
= 2.5 V
V
CC
1150
2150
1350
V
CC
1060
2240
1440
V
CC
950
2350
1550
V
CC
1100
2200
1400
V
CC
1015
2285
1485
V
CC
900
2400
1600
V
CC
1050
2250
1450
V
CC
980
2320
1520
V
CC
850
2450
1650
mV
V
OL
Output LOW Voltage
(Notes 2, 3)
V
CC
= 3.3 V
V
CC
= 2.5 V
V
CC
1935
1365
565
V
CC
1775
1525
725
V
CC
1630
1670
870
V
CC
1875
1430
630
V
CC
1735
1565
765
V
CC
1580
1720
920
V
CC
1810
1490
690
V
CC
1675
1625
825
V
CC
1530
1770
970
mV
DIFFERENTIAL INPUT DRIVEN SINGLEENDED (Figures 7, 10)
V
th
Input Threshold Ref-
erence Voltage
(Note 4)
100 V
CC
100 100 V
CC
100 100 V
CC
100 mV
V
IH
Singleended Input
HIGH Voltage
V
th
+ 100 V
CC
V
th
+ 100 V
CC
V
th
+ 100 V
CC
mV
V
IL
Singleended Input
LOW Voltage
V
EE
V
th
100 V
EE
V
th
100 V
EE
V
th
100 mV
V
BBAC
Output Voltage Ref-
erence @ 100 mA
(Note 7)
V
CC
= 3.3 V
V
CC
= 2.5 V
V
CC
1460
1840
1040
V
CC
1330
1970
1170
V
CC
1200
2100
1300
V
CC
1460
1840
1040
V
CC
1340
1960
1160
V
CC
1200
2100
1300
V
CC
1460
1840
1040
V
CC
1350
1950
1150
V
CC
1200
2100
1300
mV
DIFFERENTIAL INPUT DRIVEN DIFFERENTIALLY (Figures 8, 9, 11) (Note 6)
V
IHD
Differential Input
HIGH Voltage
100 V
CC
100 V
CC
100 V
CC
mV
V
ILD
Differential Input
LOW Voltage
V
EE
V
CC
– 100 V
EE
V
CC
– 100 V
EE
V
CC
– 100 mV
V
CMR
Input Common
Mode Range (Differ-
ential Crosspoint
Voltage) (Note 5)
50 V
CC
– 50 50 V
CC
– 50 50 V
CC
– 50 mV
V
ID
Differential Input
Voltage (V
IHD(CLK)
V
ILD(CLK)
) and
(V
IHD(CLK)
V
ILD(CLK)
)
100 V
CC
V
EE
100 V
CC
V
EE
100 V
CC
V
EE
mV
R
TIN
Internal Input Ter-
mination Resistor
45 50 55 45 50 55 45 50 55
W
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Input and output parameters vary 1:1 with V
CC
.
3. Outputs loaded with 50 W to V
CC
– 2.0 V for proper operation.
4. V
th
is applied to the complementary input when operating in singleended mode.
5. VCMR
MIN
varies 1:1 with V
EE
, VCMR
MAX
varies 1:1 with V
CC
.
6. Input and output voltage swing is a singleended measurement operating in differential mode.
7. V
BBAC
used to rebias capacitorcoupled inputs only (see Figures 16 and 17).
NB6L239
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6
Table 7. DC CHARACTERISTICS, LVTTL/LVCMOS INPUTS (V
CC
= 2.375 V to 3.465 V, V
EE
= 0 V, T
A
= 40°C to +85°C)
Symbol
Characteristic Min Typ Max Unit
V
IH
Input HIGH Voltage (LVCMOS/LVTTL) 2.0 V
CC
V
V
IL
Input LOW Voltage (LVCMOS/LVTTL) V
EE
0.8 V
I
IH
Input HIGH Current 150 150
mA
I
IL
Input LOW Current 150 150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 8. AC CHARACTERISTICS V
CC
= 2.375 V to 3.465 V; V
EE
= 0 V (Note 8)
Symbol
Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
f
inMAX
Maximum Input CLOCK Frequency 3.0 3.0 3.0 GHz
V
OUTPP
Output Voltage Amplitude (Notes 10, 11)
QA(B2, 4, 8), QB(Bn) f
in
v 3.0 GHz
QA(B1), QB(Bn) f
in
v 2.5 GHz
QA(B1), QB(Bn) 2.5 GHz < f
in
v 3.0 GHz
450
450
300
650
650
650
450
450
250
650
630
650
450
450
200
650
610
650
mV
t
PLH
,
t
PHL
Propagation Delay to CLK, Qn
Output Differential @ 50 MHz MR
, Qn
370
330
470
370
570
430
370
330
470
380
570
430
400
330
500
400
600
480
ps
t
RR
Reset Recovery 0 90 0 90 0 90 ps
t
s
Setup Time @ 50 MHz EN, CLK
SELA/B, CLK
0
0
60
300
0
0
60
300
0
0
60
300
ps
t
h
Hold Time @ 50 MHz CLK, EN
CLK, SELA/B
150
700
65
200
150
700
65
200
150
700
65
200
ps
t
skew
WithinDevice Skew @ 50 MHz (Note 9)
DevicetoDevice Skew (Note 9)
Duty Cycle Skew (Note 9)
5
25
25
30
80
40
5
30
30
30
90
45
6
30
30
35
90
45
ps
t
PW
Minimum Pulse Width MR 550 550 550 ps
t
JITTER
RMS Random Clock Jitter
(See Figure 20. F
max
/JITTER)
< 1 < 1 < 1 ps
V
INPP
Input Voltage Swing (Differential Configuration)
(Note 10)
100 V
CC
V
EE
100 V
CC
V
EE
100 V
CC
V
EE
mV
t
r
t
f
Output Rise/Fall Times @ 50 MHz Qn, Qn
(20% 80%)
30 60 120 30 65 120 30 70 120 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
8. Measured using a 750 mV, 50% duty cycle clock source. All loading with 50 W to V
CC
2.0 V.
9. Skew is measured between outputs under identical transitions and conditions. Duty cycle skew is defined only for differential operation
when the delays are measured from the cross point of the inputs to the cross point of the outputs.
10.Input and output voltage swing is a singleended measurement operating in differential mode.
11. Output Voltage Amplitude (V
OHCLK
V
OLCLK
) at input CLOCK frequency, f
in
. The output frequency, f
out
, is the input CLOCK frequency
divided by n, f
out
= f
in
B n. Input CLOCK frequency is v3.0 GHz.

NB6L239MNR2

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Drivers & Distribution 2.5V/3.3V LVPECL Out
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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