13
PRELIMINARY
AT91SAM7A2 - Summary
6021BS–ATARM–07/04
Table 4.
Package Dimensions (mm)
Symbol Min Nom Max
c 0.09 0.20
c1 0.09 0.16
L 0.45 0.6 0.75
L1 1.00 REF
R2 0.08 0.2
R1 0.08
S0.2
q0
°
3.5
°
7
°
θ
10
°
θ
211
°
12
°
13
°
θ
311
°
12
°
13
°
A 1.6
A1 0.05 0.15
A2 1.35 1.4 1.45
Tolerances of Form and Position
aaa 0.2
bbb 0.2
Table 5.
Lead Count Dimensions (mm)
Pin
Count
D/E
BSC
D1/E1
BSC
bb1
e
BSC ccc dddMin Nom Max Min Nom Max
176 26.0 24.0 0.17 0.20 0.27 0.17 0.20 0.23 0.50 0.10 0.08
Table 6.
Device and 176-lead LQFP Package Maximum Weight
1900 mg
14
PRELIMINARY
AT91SAM7A2 - Summary
6021BS–ATARM–07/04
Soldering
Profile
Table 7 gives the recommended soldering profile from J-STD-20.
Small packages may be subject to higher temperatures if they are reflowed in boards with
larger components. In this case, small packages may have to withstand temperatures of up to
235×C, not 220×C (IR reflow).
Recommended package reflow conditions depend on package thickness and volume. See
Table 8 below.
Notes: 1. The packages are qualified by Atmel by using IR reflow conditions, not convection or VPR.
2. By default, the package level 1 is qualified at 220×C (unless 235×C is stipulated).
3. The body temperature is the most important parameter but other profile parameters such as
total exposure time to hot temperature or heating rate may also influence component
reliability.
A maximum of three reflow passes is allowed per component.
Table 7.
Soldering Profile
Convection or
IR/Convection VPR
Average Ramp-up Rate (183
°
C to Peak) 3
°
C/sec. max. 10
°
C/sec.
Preheat Temperature 125
°
C ±25
°
C 120 sec. max
Temperature Maintained Above 183
°
C 60 sec. to 150 sec.
Time within 5
°
C of Actual Peak Temperature 10 sec. to 20 sec. 60 sec.
Peak Temperature Range 220 +5/-0
°
C or
235 +5/-0
°
C
215 to 219
°
C or
235 +5/-0
°
C
Ramp-down Rate 6
°
C/sec. 10
°
C/sec.
Time 25
°
C to Peak Temperature 6 min. max
Table 8.
Recommended Package Reflow Conditions
(1, 2, 3)
Parameter Temperature
Convection 220 +5/-0
°
C
VPR 215 to 219
°
C
IR/Convection 220 +5/-0
°
C
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PRELIMINARY
Disclaimer:
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard
warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any
errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and
does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are
granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use
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6021BS–ATARM–07/04
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.
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0M

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IC MCU 16/32BIT ROMLESS 176LQFP
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