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NLX2G08MUTCG

P1-P3P4-P6P7-P8
NLX2G08
www.onsemi.com
4
Figure 3. Switching Waveform Figure 4. Test Circuit
R
L
C
L
A 1−MHz square input wave is recommended for
propagation delay tests.
V
CC
V
CC
GND
50%
50% V
CC
t
PHL
t
PLH
Y
A and B
50%
PROPAGATION DELAYS
t
R
= t
F
= 2.5 ns, 10% to 90%; f = 1 MHz; t
W
= 500 ns
ORDERING INFORMATION
Device Package Shipping
†
NLX2G08MUTCG UQFN8
(Pb−Free)
3000 / Tape & Reel
NLX2G08DMUTCG* UDFN8, 1.95 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLX2G08DMUTWG* UDFN8, 1.95 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These device differ only in tape and reel pin 1 orientation.
NLX2G08
www.onsemi.com
5
PACKAGE DIMENSIONS
UDFN8 1.6x1.0, 0.4P
CASE 517BY
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
D 1.60 BSC
E 1.00 BSC
e 0.40 BSC
L 0.25 0.35
L1 0.30 0.40
A B
E
D
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10
C
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
2X
2X
A3
BOTTOM VIEW
b
e
8X
L7X
L1
1
4
58
e/2
0.10 B
0.05
AC
C
NOTE 3
M
M
DIMENSIONS: MILLIMETERS
0.26
7X
0.49
8X
1.24
0.53
PITCH
0.40
1
PKG
OUTLINE
NLX2G08
www.onsemi.com
6
PACKAGE DIMENSIONS
UDFN8 1.45x1.0, 0.35P
CASE 517BZ
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
D 1.45 BSC
E 1.00 BSC
e 0.35 BSC
L 0.25 0.35
L1 0.30 0.40
A B
E
D
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10
C
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
2X
2X
A3
BOTTOM VIEW
b
e
8X
L7X
L1
1
4
58
e/2
DIMENSIONS: MILLIMETERS
0.22
7X
0.48
8X
1.18
0.53
PITCH
0.35
1
PKG
OUTLINE
0.10 B
0.05
AC
C
NOTE 3
M
M
P1-P3P4-P6P7-P8

NLX2G08MUTCG

Mfr. #:
Buy NLX2G08MUTCG
Manufacturer:
ON Semiconductor
Description:
Logic Gates DUAL 2 INPUT AND GATE
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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