IRFZ34NPBF

IRFZ34NPbF
HEXFET
®
Power MOSFET
V
DSS
= 55V
R
DS(on)
= 0.040
I
D
= 29A
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Ease of Paralleling
Thermal Resistance
Fifth Generation HEXFETs from International Rectifier utilize advanced
processing techniques to achieve the lowest possible on-resistance per
silicon area. This benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs are well known for,
provides the designer with an extremely efficient device for use in a wide variety
of applications.
The TO-220 package is universally preferred for all commercial-industrial
applications at power dissipation levels to approximately 50 watts. The low
thermal resistance and low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
Description
Parameter Min. Typ. Max. Units
R
θJC
Junction-to-Case –––– –––– 2.2
R
θCS
Case-to-Sink, Flat, Greased Surface –––– 0.50 –––– °C/W
R
θJA
Junction-to-Ambient –––– –––– 62
S
D
G
11/3/03
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 29
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 20 A
I
DM
Pulsed Drain Current 100
P
D
@T
C
= 25°C Power Dissipation 68 W
Linear Derating Factor 0.45 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
E
AS
Single Pulse Avalanche Energy 65 mJ
I
AR
Avalanche Current 16 A
E
AR
Repetitive Avalanche Energy 6.8 mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Mounting torque, 6-32 or M3 srew 10 lbf•in (1.1N•m)
Absolute Maximum Ratings
TO-220AB
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Lead-Free
PD - 94807
IRFZ34NPbF
2 www.irf.com
Notes:
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode) showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode) p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.6 V T
J
= 25°C, I
S
= 16A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 57 86 ns T
J
= 25°C, I
F
= 16A
Q
rr
Reverse Recovery Charge ––– 130 200 nC di/dt = 100A/µs
t
on
Forward Turn-On Time
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
V
DD
= 25V, starting T
J
= 25°C, L = 410µH
R
G
= 25, I
AS
= 16A. (See Figure 12)
I
SD
16 A, di/dt 420A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
Pulse width 300µs; duty cycle 2%.
Source-Drain Ratings and Characteristics
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 55 –– –– V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.052 ––– V/°C Reference to 25°C, I
D
= 1mA
R
DS(ON)
Static Drain-to-Source On-Resistance ––– ––– 0.040 V
GS
= 10V, I
D
= 16A
V
GS(th)
Gate Threshold Voltage 2.0 ––– 4.0 V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 6.5 ––– ––– S V
DS
= 25V, I
D
= 16A
––– ––– 25 V
DS
= 55V, V
GS
= 0V
––– ––– 250 V
DS
= 44V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– ––– 100 V
GS
= 20V
Gate-to-Source Reverse Leakage ––– ––– -100 V
GS
= -20V
Q
g
Total Gate Charge –– ––– 34 I
D
= 16A
Q
gs
Gate-to-Source Charge ––– ––– 6.8 nC V
DS
= 44V
Q
gd
Gate-to-Drain ("Miller") Charge ––– ––– 14 V
GS
= 10V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time ––– 7.0 ––– V
DD
= 28V
t
r
Rise Time ––– 49 ––– I
D
= 16A
t
d(off)
Turn-Off Delay Time ––– 31 –– R
G
= 18
t
f
Fall Time ––– 40 ––– R
D
= 1.8Ω, See Fig. 10
Between lead,
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance ––– 700 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 240 ––– pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 100 ––– ƒ = 1.0MHz, See Fig. 5
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
––– ––– 100
––– ––– 29
A
nH
L
D
Internal Drain Inductance ––– 4.5 –––
L
S
Internal Source Inductance ––– 7.5 –––
I
DSS
Drain-to-Source Leakage Current
I
GSS
ns
µA
nA
S
D
G
S
D
G
IRFZ34NPbF
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Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics
0.1
1
10
100
1000
0.1 1 10 100
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Voltage (V)
DS
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
20µs PULSE WIDTH
T = 25°C
C
A
4.5V
0.1
1
10
100
1000
0.1 1 10 100
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Voltage (V)
DS
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
A
4.5V
20µs PULSE WIDTH
T = 17C
C
1
10
100
45678910
T = 25°C
J
GS
V , Gate-to-Source Voltage (V)
D
I , Drain-to-Source Current (A)
A
V = 25V
20µs PULSE WIDTH
T = 175°C
J
DS
0.0
0.4
0.8
1.2
1.6
2.0
2.4
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
J
T , Junction Temperature (°C)
R , Drain-to-Source On Resistance
DS(on)
(Normalized)
V = 10V
GS
A
I = 26A
D

IRFZ34NPBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET MOSFT 55V 26A 40mOhm 22.7nC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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