AT28LV010-20JU-235

13
0395F–PEEPR–08/09
AT28LV010
24.2 32T – TSOP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
32T, 32-lead (8 x 20 mm Package) Plastic Thin Small Outline
Package, Type I (TSOP)
B
32T
10/18/01
PIN 1
D1
D
Pin 1 Identifier
b
e
E
A
A1
A2
0º ~ 8º
c
L
GAGE PLANE
SEATING PLANE
L1
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This package conforms to JEDEC reference MO-142, Variation BD.
2. Dimensions D1 and E do not include mold protrusion. Allowable
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.
3. Lead coplanarity is 0.10 mm maximum.
A 1.20
A1 0.05 0.15
A2 0.95 1.00 1.05
D 19.80 20.00 20.20
D1 18.30 18.40 18.50 Note 2
E 7.90 8.00 8.10 Note 2
L 0.50 0.60 0.70
L1 0.25 BASIC
b 0.17 0.22 0.27
c 0.10 0.21
e 0.50 BASIC
14
0395F–PEEPR–08/09
AT28LV010
Revision History
Doc. Rev. Date Comments
0395F 08/2009
Implemented Revision History and updated AC Characterisitics and
ordering information.
0395F 07/2009
Add a revision history page and update this version ‘F’ with the
changes.
Update AC Characateristics.
0395F–PEEPR–08/09
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AT28LV010-20JU-235

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
EEPROM 200NS, PLCC, IND TEMP, GREEN - test to 105C
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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