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STPS1H100A

P1-P3P4-P6P7-P9P10-P10
Characteristics STPS1H100
4/10
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMAflat)
Figure 8. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
0
1
2
3
4
5
6
1.E-03 1.E-02 1.E-01 1.E+00
T
a
=25 °C
T
a
=75 °C
T
a
=110 °C
I
M
t
δ
=0.5
SMAflat
I
(
A
)
M
t(s)
Z/R
th(j-a) th(j-a)
0.01
0.10
1.00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
SMB
t(s)
p
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMAflat)
Z/R
th(j-a) th(j-a)
0.01
0.10
1.00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
SMA
t(s)
p
0.01
0.10
1.00
1.E-
03
1.E-
0
2 1.E-
0
1 1.E+
00
1.E+
0
1 1.E+
0
2 1.E+
03
Single pulse
SMAflat
Z/R
th(j-a) th(j-a)
t(s)
p
Figure 11. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 12. Junction capacitance versus
reverse voltage applied
(typical values)
I (µA)
R
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
0 102030405060708090100
T
j
=125 °C
T
j
=25 °C
V (V)
R
C(pF)
10
100
1 10 100
F=1 MHz
V
OSC
=30 mV
RMS
T
j
=25 °C
V (V)
R
STPS1H100 Characteristics
5/10
Figure 13. Forward voltage drop versus
forward current (maximum values)
Figure 14. Thermal resistance junction to
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMB)
I (A)
FM
0.01
0.10
1.00
10.00
100.00
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
T
j
=25 °C
T
j
=125 °C
V (V)
FM
R (°C/W)
th(j-a)
20
30
40
50
60
70
80
90
100
110
120
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB
S(Cu)(cm²)
Figure 15. Thermal resistance junction to
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMA)
Figure 16. Thermal resistance junction to
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMAflat)
R (°C/W)
th(j-a)
20
30
40
50
60
70
80
90
100
110
120
130
140
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMA
S(Cu)(cm²)
0
20
40
60
80
100
120
140
160
180
200
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
SMAflat
R (°C/W)
th(j-a)
S(Cu)(cm²)
Package information STPS1H100
6/10
2 Package information
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Figure 17. SMA package dimensions
Ref
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.094
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
Figure 18. SMA footprint dimensions in
millimeters (inches)
Figure 19. Marking information
E
C
L
E1
D
A1
A2
b
2.63
(0.103)
5.43
(0.214)
1.4
1.64
(0.064)
1.4
(0.055) (0.055)
y w w
e3
z
x x x
e3: ECOPACK (Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
Cathode bar (
unidirectional
devices only )
P1-P3P4-P6P7-P9P10-P10

STPS1H100A

Mfr. #:
Buy STPS1H100A
Manufacturer:
STMicroelectronics
Description:
Schottky Diodes & Rectifiers 1.0 Amp 100 Volt
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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