10
LT3436
3436fa
Figure 6. Typical Application and Suggested Layout (Topside Only Shown)
V
OUT
INPUT
GND
C3
C1
R2 R1
L1
D1
KELVIN SENSE
V
OUT
MINIMIZE
LT3436,
C1, D1 LOOP
PLACE FEEDTHROUGHS
AROUND GROUND PIN FOR
GOOD THERMAL CONDUCTIVITY
C4
U1
SOLDER EXPOSED
GROUND PAD
TO BOARD
KEEP FB AND V
C
COMPONENTS
AWAY FROM
HIGH FREQUENCY,
HIGH INPUT
COMPONENTS
C2
LT3436
V
IN
OUTPUT
12V
0.8A
INPUT
5V
C2
10nF
C4
470pF
R3
4.7k
R2
10k
1%
R1
90.9k
D1
B220A
C1
22µF
CERAMIC
C3
4.7µF
CERAMIC
V
SW
FBSHDN
OPEN
OR
HIGH
= ON
GND
V
C
SYNC
MAXIMUM OUTPUT CURRENT IS SUBJECT TO THERMAL DERATING.
L1
3.9µH
GND
R3
APPLICATIONS INFORMATION
WUU
U
11
LT3436
3436fa
APPLICATIONS INFORMATION
WUU
U
The inductor must have a rating greater than its peak
operating current to prevent saturation resulting in effi-
ciency loss. Peak inductor current is given by:
I
VI
V
VV V
VLf
LPEAK
OUT OUT
IN
IN OUT IN
OUT
=+
()()
()
()()η 2
Also, consideration should be given to the DC resistance
of the inductor. Inductor resistance contributes directly to
the efficiency losses in the overall converter.
THERMAL CALCULATIONS
Power dissipation in the LT3436 chip comes from four
sources: switch DC loss, switch AC loss, drive current, and
input quiescent current. The following formulas show how
to calculate each of these losses. These formulas assume
continuous mode operation, so they should not be used
for calculating efficiency at light load currents.
DC duty cycle
VV
V
I
VI
V
OUT IN
OUT
SW
OUT OUT
IN
,
()
()()
=
=
Switch loss:
PDCIR nIVf
SW SW SW SW OUT
=+
()
()
()
()( )( )
2
17
V
IN
loss:
P
VI DC
mA V
VIN
IN SW
IN
=+
()( )()
()
50
1
R
SW
= Switch resistance (0.16 hot)
Example: V
IN
= 5V, V
OUT
= 12V and I
OUT
= 0.8A
Total power dissipation = 0.34 + 0.31 + 0.11 + 0.005 =
0.77W
Thermal resistance for LT3436 package is influenced by
the presence of internal or backside planes. With a full
plane under the package, thermal resistance will be about
40°C/W. To calculate die temperature, use the appropriate
thermal resistance number and add in worst-case ambient
temperature:
T
J
= T
A
+ θ
JA
(P
TOT
)
If a true die temperature is required, a measurement of
the SYNC to GND pin resistance can be used. The SYNC
pin resistance across temperature must first be cali-
brated, with no device power, in an oven. The same
measurement can then be used in operation to indicate the
die temperature.
FREQUENCY COMPENSATION
Loop frequency compensation is performed on the output
of the error amplifier (V
C
pin) with a series RC network.
The main pole is formed by the series capacitor and the
output impedance (500k) of the error amplifier. The
pole falls in the range of 2Hz to 20Hz. The series resistor
creates a “zero” at 1kHz to 5kHz, which improves loop
stability and transient response. A second capacitor, typi-
cally one-tenth the size of the main compensation capaci-
tor, is sometimes used to reduce the switching frequency
ripple on the V
C
pin. V
C
pin ripple is caused by output
voltage ripple attenuated by the output divider and multi-
plied by the error amplifier. Without the second capacitor,
V
C
pin ripple is:
V
C
Pin Ripple =
V
RIPPLE
= Output ripple (V
P–P
)
g
m
= Error amplifier transconductance
(850µmho)
R
C
= Series resistor on V
C
pin
V
OUT
= DC output voltage
1.2(V
RIPPLE
)(g
m
)(R
C
)
(V
OUT
)
To prevent irregular switching, V
C
pin ripple should be
kept below 50mV
P–P
.
Worst-case V
C
pin ripple occurs at
maximum output load current and will also be increased if
poor quality (high ESR) output capacitors are used. The
addition of a 150pF capacitor on the V
C
pin reduces
switching frequency ripple to only a few millivolts. A low
value for R
C
will also reduce V
C
pin ripple, but loop phase
margin may be inadequate.
12
LT3436
3436fa
V
IN
(V)
0
MAXIMUM LOAD CURRENT (A)
161412 18
3436 TA02c
48
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
2 6 10 20
LOAD CURRENT (mA)
EFFICIENCY (%)
0 1.5k1.0k
3436 TA02d
500
100
90
80
70
60
50
40
30
20
10
0
2.0k
3.3V
IN
5V
IN
12V
IN
LT3436
V
IN
FB
V
C
SYNC GND
LT3436 • TA02
V
SW
SHDN
D2
1N4148
D3
1N4148
C3
4.7µF
C1
4.7µF
C6
0.1µF
C2
10nF
C4
470pF
R3
4.7k
R1
90.9k
R2
10k
1%
R4
1M
V
OUT
12V
0.8A
C7
22µF
C5
0.1µF
OFF ON
V
IN
5V
D1
B220A
L1
3.9µH
Q1
Si2306DS
Load Disconnects in Shutdown
TYPICAL APPLICATIO S
U
3V to 20V
IN
5V
OUT
SEPIC with Either Two Inductors or a Transformer
V
IN
FB
V
C
SYNC
GNDGND
3436 TA02b
SW
SHDN
C1
OPT
C3
10nF
C4
470pF
R3
2.2k
R1
31.6K
1%
R2
10K
1%
V
OUT
5V
GNDGND
C6
OPT
C5
OPT
V
IN
3V TO 20V
D1
B220A
L1
CDRH6D28-100
C1
4.7µF
X5R
25V
CERAMIC
C2
22µF
X5R
10V
CERAMIC
C7
1µF, X5R, 25V
CERAMIC
L2
CDRH6D28-100
+
LT3436
SYNC
SHDN
OPTION: REPLACE L1, L2 WITH TRANSFORMER CTX5-1A, CTX8-1A, CTX10-2A
Maximum Load Current
Increases with Input Voltage Efficiency

LT3436EFE#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 3A, 800kHz Boost Sw Reg
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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