TC2320TG-G

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adequate “product liability indemnification insurance agreement.Supertex inc. does not assume responsibility for use of devices described, and limits its liability to the
replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and specifications
are subject to change without notice. For the latest product specifications refer to the Supertex inc. website: http//www.supertex.com
.
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1235 Bordeaux Drive, Sunnyvale, CA 94089
Tel: 408-222-8888
www.supertex.com
4
TC2320
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline
information go to http://www.supertex.com/packaging.html.)
Doc.# DSFP-TC2320
B122208
8-Lead SOIC (Narrow Body) Package Outline (TG)
4.90x3.90mm body, 1.75mm height (max), 1.27mm pitch
1
8
Seating
Plane
Gauge
Plane
L
L1
L2
E
E1
D
e
b
A
A2
A1
Seating
Plane
A
A
Top View
Side View
View B
View B
θ1
θ
Note 1
(Index Area
D/2 x E1/2)
View A-A
h
h
Note 1
Symbol A A1 A2 b D E E1 e h L L1 L2 θ θ1
Dimension
(mm)
MIN 1.35* 0.10 1.25 0.31 4.80* 5.80* 3.80*
1.27
BSC
0.25 0.40
1.04
REF
0.25
BSC
0
O
5
O
NOM - - - - 4.90 6.00 3.90 - - - -
MAX 1.75 0.25 1.65* 0.51 5.00* 6.20* 4.00* 0.50 1.27 8
O
15
O
JEDEC Registration MS-012, Variation AA, Issue E, Sept. 2005.
* This dimension is not specified in the original JEDEC drawing. The value listed is for reference only.
Drawings are not to scale.
Supertex Doc. #: DSPD-8SOLGTG, Version H101708.
Note:
This chamfer feature is optional. A Pin 1 identifier must be located in the index area indicated. The Pin 1 identifier can be: a molded mark/identifier;
an embedded metal marker; or a printed indicator.
1.

TC2320TG-G

Mfr. #:
Manufacturer:
Microchip Technology
Description:
MOSFET N/P Ch 200 Volt
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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