APTCV60TLM99T3G

APTCV60TLM99T3G
APTCV60TLM99T3G – Rev 3 November, 2017
www.microsemi.com
1-10
All ratings @ T
j
= 25°C unless otherwise specified
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
All multiple inputs and outputs must be shorted together
Example: 10/11/12 ; 7/8 …
Trench & Field Stop IGBT3 Q2, Q3:
V
CES
= 600V ; I
C
= 30A @ Tc = 80°C
Super junction MOSFET Q1, Q4:
V
DSS
= 600V ; I
D
= 17A @ Tc = 80°C
Application
Solar converter
Uninterruptible Power Supplies
Features
Q2, Q3 Trench + Field Stop IGBT3
- Low voltage drop
- Low tail current
- Switching frequency up to 20 kHz
- Low leakage current
- RBSOA and SCSOA rated
Q1, Q4 Super junction MOSFET
- Ultra low R
DSon
- Low Miller capacitance
- Ultra low gate charge
- Avalanche energy rated
- Very rugged
Kelvin emitter for easy drive
Very low stray inductance
High level of integration
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Low profile
RoHS Compliant
Three level inverter Power Module
APTCV60TLM99T3G
APTCV60TLM99T3G – Rev 3 November, 2017
www.microsemi.com
2-10
Q1 & Q4 Absolute maximum ratings (per Super junction MOSFET)
Q1 & Q4 Electrical Characteristics (per Super junction MOSFET)
Symbol Characteristic Test Conditions Min Typ Max Unit
I
DSS
Zero Gate Voltage Drain Current V
GS
= 0V ; V
DS
= 600V 50 µA
R
DS(on)
Drain – Source on Resistance V
GS
= 10V, I
D
= 18A
99 m
V
GS
(
th
)
Gate Threshold Voltage V
GS
= V
DS
, I
D
= 1.2 mA 2.5 3 3.5 V
I
GSS
Gate – Source Leakage Current V
GS
= ±20 V, V
DS
= 0V 100 nA
Q1 & Q4 Dynamic Characteristics
(per Super junction MOSFET)
Symbol Characteristic Test Conditions Min Typ Max Unit
C
iss
Input Capacitance
V
GS
= 0V ; V
DS
= 100V
f = 1MHz
2800
pF
C
oss
Output Capacitance 130
Q
g
Total gate Charge
V
GS
= 10V
V
Bus
= 400V
I
D
= 18A
14
nC
Q
gs
Gate – Source Charge 20
Q
gd
Gate – Drain Charge 60
T
d(on)
Turn-on Delay Time
V
GS
= 10V
V
Bus
= 400V
I
D
= 18A
R
G
= 3.3Ω
10
ns
T
r
Rise Time 5
T
d(off)
Turn-off Delay Time 60
T
f
Fall Time 5
R
thJC
Junction to Case Thermal Resistance
1.15
°C/W
Q2 & Q3 Absolute maximum ratings
(per IGBT)
Symbol Parameter Max ratings Unit
V
CES
Collector - Emitter Voltage 600
V
I
C
Continuous Collector Current
T
C
= 25°C
50
A
T
C
= 80°C
30
I
CM
Pulsed Collector Current T
C
= 25°C 60
V
GE
Gate – Emitter Voltage ±20 V
P
D
Power Dissipation
T
C
= 25°C
90 W
RBSOA Reverse Bias Safe Operating Area
T
J
= 150°C
60A @ 550V
Symbol Parameter Max ratings Unit
V
DSS
Drain - Source Voltage 600 V
I
D
Continuous Drain Current
T
c
= 25°C 22
A
T
c
= 80°C 17
I
DM
Pulsed Drain current 75
V
GS
Gate - Source Voltage ±20 V
R
DSon
Drain - Source ON Resistance 99
m
P
D
Power Dissipation T
c
= 25°C 110 W
I
AR
Avalanche current (repetitive and non repetitive) 11 A
E
AR
Repetitive Avalanche Energy 1.2
mJ
E
AS
Single Pulse Avalanche Energy 800
APTCV60TLM99T3G
APTCV60TLM99T3G – Rev 3 November, 2017
www.microsemi.com
3-10
Q2 & Q3 Electrical Characteristics (per IGBT)
Symbol Characteristic Test Conditions Min Typ Max Unit
I
CES
Zero Gate Voltage Collector Current V
GE
= 0V, V
CE
= 600V 250 µA
V
CE(sat)
Collector Emitter Saturation Voltage
V
GE
=15V
I
C
= 30A
T
j
= 25°C 1.5 1.9
V
T
j
= 150°C 1.7
V
GE
(
th
)
Gate Threshold Voltage V
GE
= V
CE
, I
C
= 400µA 5.0 5.8 6.5 V
I
GES
Gate – Emitter Leakage Current V
GE
= 20V, V
CE
= 0V 300 nA
Q2 & Q3 Dynamic Characteristics
(per IGBT)
Symbol Characteristic Test Conditions Min Typ Max Unit
C
ies
Input Capacitance
V
GE
= 0V
V
CE
= 25V
f = 1MHz
1600
pF
C
oes
Output Capacitance 110
C
res
Reverse Transfer Capacitance 50
Q
G
Gate charge
V
GE
=±15V, I
C
=30A
V
CE
=300V
0.3 µC
T
d(on)
Turn-on Delay Time
Inductive Switching (25°C)
V
GE
= ±15V
V
Bus
= 300V
I
C
= 30A
R
G
= 10
110
ns
T
r
Rise Time 45
T
d(off)
Turn-off Delay Time 200
T
f
Fall Time 40
T
d(on)
Turn-on Delay Time
Inductive Switching (150°C)
V
GE
= ±15V
V
Bus
= 300V
I
C
= 30A
R
G
= 10
120
ns
T
r
Rise Time 50
T
d(off)
Turn-off Delay Time 250
T
f
Fall Time 60
E
on
Turn-on Switching Energy
V
GE
= ±15V
V
Bus
= 300V
I
C
= 30A
R
G
= 10
T
j
= 25°C 0.16
mJ
T
j
= 150°C 0.3
E
off
Turn-off Switching Energy
T
j
= 25°C 0.7
mJ
T
j
= 150°C 1.05
I
sc
Short Circuit data
V
GE
≤15V ; V
Bus
= 360V
t
p
≤ 6µs ; T
j
= 150°C
150 A
R
thJC
Junction to Case Thermal Resistance
1.6
°C/W
CR2 & CR3 diode ratings and characteristics (per device)
Symbol Characteristic Test Conditions Min Typ Max Unit
V
F
Diode + tranzorb Forward Voltage I
F
= 10A 10 V
R
thJC
Junction to Case Thermal Resistance 8 °C/W

APTCV60TLM99T3G

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
IGBT Modules DOR CC3086
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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