ADV3202/ADV3203
Rev. 0 | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
POWER DISSIPATION
Table 5.
Parameter Rating
Analog Supply Voltage (V
POS
− V
NEG
) 7.5 V
Digital Supply Voltage
(DVCC − D
GND
)
6 V
Ground Potential Difference
(V
NEG
− D
GND
)
+0.5 V to –4 V
Maximum Potential Difference
DVCC − V
NEG
9.4 V
Disabled Outputs
ADV3202 (|V
OSD
− V
OUT
|) <3 V
ADV3203 (|V
OSD
−(V
OUT
+V
REF
)/2|) <3 V
|V
CLAMP
− V
INxx
| 6 V
V
REF
Input Voltage
ADV3202 V
POS
– 3.5 V to V
NEG
+ 3.5 V
ADV3203 V
POS
– 4 V to V
NEG
+ 4 V
Analog Input Voltage V
NEG
to V
POS
Digital Input Voltage DVCC
Output Voltage
(Disabled Analog Output)
(V
POS
− 1 V) to (V
NEG
+ 1 V)
Output Short-Circuit Duration Momentary
Output Short-Circuit Current 45 mA
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature
(Soldering, 10 sec)
300°C
Junction Temperature 150°C
The ADV3202/ADV3203 are operated with ±2.5 V, +5 V, or
±3.3 V supplies and can drive loads down to 150 , resulting in
a large range of possible power dissipations. For this reason,
extra care must be taken while derating the operating conditions
based on ambient temperature.
Packaged in a 176-lead exposed-pad LQFP, the ADV3202/
ADV3203 junction-to-ambient thermal impedance (θ
JA
) is
16°C/W. For long-term reliability, the maximum allowed
junction temperature of the die should not exceed 150°C.
Temporarily exceeding this limit may cause a shift in parametric
performance due to a change in stresses exerted on the die by
the package. Exceeding a junction temperature of 175°C for an
extended period can result in device failure. Figure 3 shows the
range of allowed internal die power dissipations that meet these
conditions over the −40°C to +85°C ambient temperature range.
When using Figure 3, do not include external load power in the
maximum power calculation, but do include load current
dropped on the die output transistors.
9
8
7
6
5
4
3
15 25 35 45 55 65 75 85
AMBIENT TEMPERATURE (°C)
MAXIMUM POWER (W)
07526-003
T
J
= 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 3. Maximum Die Power Dissipation vs. Ambient Temperature
THERMAL RESISTANCE
ESD CAUTION
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type θ
JA
Unit
176-Lead LQFP_EP 16 °C/W
