AD590 Data Sheet
Rev. G | Page 14 of 16
Figure 27. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
Figure 28. 4-Lead Lead Frame Chip Scale Package [LFCSP_WD]
2.00 mm × 3.00 mm Body, Very Very Thin, Dual Lead
(CP-4-1)
Dimensions shown in millimeters
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AA
012407-A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
85
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
1.65
1.55
1.45
0.50
0.40
0.30
TOP VIEW
4
1
3
2
0.35
0.30
0.25
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.80
1.70
1.60
0.203 REF
0.05 MAX
0.00 MIN
0.80 REF
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
(
R
0
.
1
5
)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATIONS
SECTION OF THIS DATA SHEET.
09-07-2010-B
2.10
2.00
1.90
3.10
3.00
2.90
COMPLIANT
TO
JEDEC STANDARDS MO-229
COPLANARITY
0.08
0.20 MIN
