P1P8160A
http://onsemi.com
6
PACKAGE DIMENSIONS
WDFN10 3x3, 0.5P
CASE 511BK−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
C
SEATING
PLANE
D
E
0.10 C
A3
A
A1
0.10 C
DIM
A
MIN
MILLIMETERS
0.70
A1 0.00
A3 0.20 REF
b 0.20
D 3.00 BSC
D2 2.20
E 3.00 BSC
1.50
E2
e 0.50 BSC
PIN ONE
REFERENCE
0.08 C
0.10 C
A0.10 C
NOTE 3
L
e
D2
E2
b
B
5
6
10X
1
10
0.05 C
0.35
L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
3.30
0.50
0.62
10X
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
K
K
0.20
0.30
2.46
PITCH
1.76
10X
0.80
0.05
0.30
2.40
1.70
0.45
---
MAX
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
---
L1
0.15
B
TOP VIEW
SIDE VIEW
1
PACKAGE
OUTLINE
DETAIL B
DETAIL A
2X
2X
NOTE 4
RECOMMENDED
A
A1
A3
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