CA064C104K4RACTU Datasheet CA064C331K5RACTU, CA064C683M4RACTU, CA064C102M3RACTU | P4-P6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

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Capacitance

Code

&DVH6L]H6HULHV C0508 (CA052C 2-Cap Case Size) C0612 (CA064C 4-Cap Case Size)

Voltage Code

84351843512

Rated Voltage (VDC)

10 16 25 50 100 10 16 25 50 100 200

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chi

Thickness Dimensions

330 pF 331 J K M PA PA PA PA PA MA MA MA MA MA MA

390 pF 391 J K M PA PA PA PA PA MA MA MA MA MA MA

470 pF 471 J K M PA PA PA PA PA MA MA MA MA MA MA

560 pF 561 J K M PA PA PA PA PA MA MA MA MA MA MA

680 pF 681 J K M PA PA PA PA PA MA MA MA MA MA

820 pF 821 J K M PA PA PA PA PA MA MA MA MA MA

1,000 pF 102 J K M PA PA PA PA PA MA MA MA MA MA

1,200 pF 122 J K M PA PA PA PA PA MA MA MA MA MA

1,500 pF 152 J K M PA PA PA PA PA MA MA MA MA MA

1,800 pF 182 J K M PA PA PA PA PA MA MA MA MA MA

2,200 pF 222 J K MPAPAPAPAPAMAMAMAMAMA

2,700 pF 272 J K M PA PA PA PA PA MA MA MA MA MA

3,300 pF 332 J K M PA PA PA PA PA MA MA MA MA MA

3,900 pF 392 J K M PA PA PA PA PA MA MA MA MA MA

4,700 pF 472 J K M PA PA PA PA PA MA MA MA MA MA

5,600 pF 562 J K M PA PA PA PA MA MA MA MA

6,800 pF 682 J K M PA PA PA PA MA MA MA MA

8,200 pF 822 J K M PA PA PA PA MA MA MA MA

10,000 pF 103 J K M PA PA PA PA MA MA MA MA

12,000 pF 123 J K M PA PA PA PA MA MA MA MA

15,000 pF 153 J K M PA PA PA PA MA MA MA MA

18,000 pF 183 J K M PA PA PA PA MA MA MA MA

22,000 pF 223 J K M PA PA PA PA MA MA MA MA

27,000 pF 273 J K M PA PA PA PA MA MA MA

33,000 pF 333 J K MPAPAPAPA MAMAMA

39,000 pF 393 J K M PA PA PA PA MA MA MA

47,000 pF 473 J K M PA PA PA PA MA MA MA

56,000 pF 563 J K M PA PA PA PA MA MA MA

68,000 pF 683 J K M PA PA

PA PA MA MA

82,000 pF 823 J K M PA PA PA PA MA MA

0.10 uF 104 J K M PA PA PA PA MA MA

0.15 uF 154 J K M PA

0.22 uF 224 J K M PA

Capacitance Capacitance Code

Rated Voltage (VDC)

10 16 25 50 100 10 16 25 50 100 200

Voltage Code

84351843512

&DVH6L]H6HULHV C0508 C0612

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Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity Plastic Quantity

7" Reel 13" Reel 7" Reel 13" Reel

PA 0508 0.80 ± 0.10 0 0 4,000 10,000

MA 0612 0.80 ± 0.10 0 0 4,000 10,000

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Table 3 – Chip Capacitor Array Land Pattern Design Recommendations per IPC–7351

EIA SIZE

CODE

METRIC

SIZE

CODE

Density Level A:

Maximum (Most) Land

Protrusion (mm)

Density Level B:

Median (Nominal) Land

Protrusion (mm)

Density Level C:

Minimum (Least) Land

Protrusion (mm)

C Y X P V1 V2 C Y X P V1 V2 C Y X P V1 V2

0508/CA052 1220 1.60 1.00 0.55 1.00 3.50 3.30 1.50 0.90 0.50 1.00 2.90 2.80 1.40 0.75 0.45 1.00 2.40 2.50

0612/CA064 1632 1.80 1.10 0.50 0.80 3.90 4.40 1.80 0.95 0.50 0.80 3.30 3.90 1.70 0.85 0.40 0.80 2.80 3.60

Density Level A: )RUORZGHQVLW\SURGXFWDSSOLFDWLRQV3URYLGHVDZLGHUSURFHVVZLQGRZIRUUHÀRZVROGHUSURFHVVHV

Density Level B: )RUSURGXFWVZLWKDPRGHUDWHOHYHORIFRPSRQHQWGHQVLW\3URYLGHVDUREXVWVROGHUDWWDFKPHQWFRQGLWLRQIRUUHÀRZVROGHUSURFHVVHV

Density Level C: )RUKLJKFRPSRQHQWGHQVLW\SURGXFWDSSOLFDWLRQV%HIRUHDGDSWLQJWKHPLQLPXPODQGSDWWHUQYDULDWLRQVWKHXVHUVKRXOGSHUIRUPTXDOL¿FDWLRQ

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Grid Placement Courtyard

Soldering Process

Recommended Soldering Technique:

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• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress Reference Test or Inspection Method

Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Board Flex JIS–C–6429

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.

Flexible termination system – 3.0 mm (minimum).

Solderability J–STD–002

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a) Method B, 4 hours @ 155°C, dry heat @ 235°C

b) Method B @ 215°C category 3

c) Method D, category 3 @ 260°C

Temperature Cycling JESD22 Method JA–104 1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.

Biased Humidity MIL–STD–202 Method 103

Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement

at 24 hours +/- 2 hours after test conclusion.

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.

Measurement at 24 hours +/- 2 hours after test conclusion.

Moisture Resistance MIL–STD–202 Method 106

t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.

Measurement at 24 hours +/- 2 hours after test conclusion.

Thermal Shock MIL–STD–202 Method 107

-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell

time – 15 minutes. Air – Air.

High Temperature Life

MIL–STD–202 Method 108

/EIA–198

1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.

Storage Life MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.

Vibration MIL–STD–202 Method 204

5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure

points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"

from an

secure

oint. Test from 10 – 2,000 Hz

Mechanical Shock MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.

Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.

Storage & Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%

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chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of

receipt.

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CA064C104K4RACTU

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CA064C104K4RACTU

CA064C104K4RACTU

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