IRLML2803TRPBF

Fifth Generation HEXFETs from International Rectifier utilize
advanced processing techniques to achieve extremely low on-
resistance per silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that HEXFET
Power MOSFETs are well known for, provides the designer with
an extremely efficient and reliable device for use in a wide variety
of applications.
A customized leadframe has been incorporated into the standard
SOT-23 package to produce a HEXFET Power MOSFET with
the industry's smallest footprint. This package, dubbed the
Micro3, is ideal for applications where printed circuit board
space is at a premium. The low profile (<1.1mm) of the Micro3
allows it to fit easily into extremely thin application environments
such as portable electronics and PCMCIA cards.
V
DSS
= 30V
R
DS(on)
= 0.25Ω
HEXFET
®
Power MOSFET
Description
l Generation V Technology
l Ultra Low On-Resistance
l N-Channel MOSFET
l SOT-23 Footprint
l Low Profile (<1.1mm)
l Available in Tape and Reel
l Fast Switching
l Lead-Free
l RoHS Compliant, Halogen-Free
Absolute Maximum Ratings
Parameter
Units
I
D
@ T
A
= 25°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
A
= 70°C
Continuous Drain Current, V
GS
@ 10V
I
DM
Pulsed Drain Current
P
D
@T
A
= 25°C
Power Dissipation
Linear Derating Factor
mW/°C
V
GS
Gate-to-Source Voltage
V
E
AS
Single Pulse Avalanche Energy
mJ
dv/dt
Peak diode Recovery dv/dt
V/ns
T
J ,
T
STG
Junction and Storage Temperature Range °C
Thermal Resistance
Parameter
Typ.
Max.
Units
R
θJA
Maximum Junction-to-Ambient
–––
230
°C/W
3.9
A
5.0
540
4.3
±20
Max.
1.2
0.93
7.3
-55 to + 150
D
S
G
3
1
2
Micro3
IRLML2803PbF
Form Quantity
IRLML2803TRPbF Micro3
(SOT-23) Tape and Reel 3000 IRLML2803TRPbF
Package Type
Standard Pack
Orderable Part NumberBase Part Number
1 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback April 24, 2014
2 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback April 24, 2014
IRLML2803PbF
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 30   V V
GS
= 0V, I
D
= 250µA
ΔV
(BR)DSS
/ΔT
J
Breakdown Voltage Temp. Coefficient  0.029 VC Reference to 25°C, I
D
= 1mA
  0.25 V
GS
= 10V, I
D
= 0.91A
  0.40 V
GS
= 4.5V, I
D
= 0.46A
V
GS(th)
Gate Threshold Voltage 1.0   V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 0.87   S V
DS
= 10V, I
D
= 0.46A
  1.0 V
DS
= 24V, V
GS
= 0V
  25 V
DS
= 24V, V
GS
= 0V, T
J
= 125°C
Gate-to-Source Forward Leakage   -100 V
GS
= -20V
Gate-to-Source Reverse Leakage   100 V
GS
= 20V
Q
g
Total Gate Charge  3.3 5.0 I
D
= 0.91A
Q
gs
Gate-to-Source Charge  0.48 0.72 nC V
DS
= 24V
Q
gd
Gate-to-Drain ("Miller") Charge  1.1 1.7 V
GS
= 10V, See Fig. 6 and 9
t
d(on)
Turn-On Delay Time  3.9  V
DD
= 15V
t
r
Rise Time  4.0  I
D
= 0.91A
t
d(off)
Turn-Off Delay Time  9.0  R
G
= 6.2Ω
t
f
Fall Time  1.7  R
D
= 16Ω, See Fig. 10
C
iss
Input Capacitance  85  V
GS
= 0V
C
oss
Output Capacitance  34  pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance  15  = 1.0MHz, See Fig. 5
Ω
µA
nA
ns
I
GSS
I
DSS
Drain-to-Source Leakage Current
R
DS(on)
Static Drain-to-Source On-Resistance
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode) showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode) p-n junction diode.
V
SD
Diode Forward Voltage   1.2 V T
J
= 25°C, I
S
= 0.91A, V
GS
= 0V
t
rr
Reverse Recovery Time  26 40 ns T
J
= 25°C, I
F
= 0.91A
Q
rr
Reverse RecoveryCharge  22 32 nC di/dt = 100A/µs
Source-Drain Ratings and Characteristics
A
  7.3
  0.54
S
D
G
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
I
SD
0.91A, di/dt 120A/µs, V
DD
V
(BR)DSS
,
T
J
150°C
Notes:
Pulse width 300µs; duty cycle 2%.
Limited by T
Jmax
, starting T
J
= 25°C, L = 9.4mH, R
G
= 25Ω, I
AS
= 0.9A.
Surface mounted on FR-4 board, t 5sec.
3 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback April 24, 2014
IRLML2803PbF
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
0.1
1
10
0.1 1 10
20μs PULSE WIDTH
T = 25°C
A
J
DS
V , Drain-to-Source Voltage (V)
3.0V
VGS
TOP 15V
10V
7.0V
5.5V
4.5V
4.0V
3.5V
BOTTOM 3.0V
D
I , Drain-to-Source Current (A)
0.1
1
10
0.1 1 10
A
DS
V , Drain-to-Source Voltage (V)
D
I , Drain-to-Source Current (A)
20μs PULSE WIDTH
T = 150°C
J
3.0V
VGS
TOP 15V
10V
7.0V
5.5V
4.5V
4.0V
3.5V
BOTTOM 3.0V
0.0
0.5
1.0
1.5
2.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
J
T , Junction Temperature (°C)
R , Drain-to-Source On Resistance
DS(on)
(Normalized)
V = 10V
GS
A
I = 0.91A
D
0.1
1
10
3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
T = 25°C
T = 150°C
J
J
GS
V , Gate-to-Source Voltage (V)
D
I , Drain-to-Source Current (A)
A
V = 10V
20μs PULSE WIDTH
DS

IRLML2803TRPBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET MOSFT 30V 1.2A 250mOhm 3.3nC LogLvl
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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