Characteristics BAT48
4/8 Doc ID 12634 Rev 2
Figure 3. Reverse leakage current versus
reverse applied voltage
(typical values)
Figure 4. Reverse leakage current versus
junction temperature
(typical values)
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 5 10 15 20 25 30 35 40
I (µA)
R
V (V)
R
T =25°C
j
T =125°C
j
T =100°C
j
T =75°C
j
T =50°C
j
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 25 50 75 100 125
I (µA)
R
T (°C)
j
V =40V
R
Figure 5. Junction capacitance versus
reverse applied voltage
(typical values)
Figure 6. Forward voltage drop versus
forward current (typical values)
0
5
10
15
20
25
30
35
0 5 10 15 20 25 30 35 40
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
0.0 0.2 0.4 0.6 0.8 1.0
I (A)
FM
V (V)
FM
T =125°C
j
T =25°C
j
Figure 7. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOD-323)
Figure 8. Thermal resistance junction to
ambient versus copper surface
under each lead (SOD-323)
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Z/R
th(j-a) th(j-a)
SOD-323
Epoxy FR4
S = 2.25 mm
e = 35 µm
CU
2
CU
Single pulse
t (s)
p
epoxy FR4 with recommended pad layout, e = 35 µm
CU
300
350
400
450
500
550
600
0 5 10 15 20 25 30 35 40 45 50
S (mm²)
CU
R (°C/W)
th(j-a)
printed circuit board, epoxy FR4, e =35 µm
CU
