NCP5608
http://onsemi.com
4
PIN FUNCTION DESCRIPTION
Pin Symbol Type Description
1 AGND GROUND This pin is the NCP5608 analog ground and shall be connected to the system ground. Care
must be observed to minimize the total parasitic inductance between the pin and the ground
plane.
2 IREFFL OUTPUT, ANALOG This pin is used to set up the current reference for the FLASH output currents (LED5 to
LED8). The reference current is derived from the internal bandgap voltage to ground by
means of an external resistor. (Note 1)
3 IREFBK OUTPUT, ANALOG This pin is used to set up the current reference for the BACK LIGHT output currents (LED1
to LED4). The reference current is derived from the internal bandgap voltage to ground by
means of an external resistor. (Note 1)
4 SDA INPUT, DIGITAL This pin, associated with the SCL signal, carries the DATA signal to set up the selected
output LED current.
The DATA signal is built with a single SDA line to support the I2C protocol.
5 SCL INPUT, DIGITAL This is the clock signal associated with the SDA pins. The pin carries the standard CLOCK
signal to operate the I2C protocol.
6 CCMP ANALOG, INPUT This pin is connected to the internal I2C bias network and must be either left open, or
bypassed to ground by a 10 nF ceramic capacitor when the I2C voltage drops below 1.8 V.
Such a capacitor compensate the voltage drop during normal operation, keeping in mind it is
not mandatory when the I2C voltage is 1.8 V and above.
7 LED1 INPUT, POWER This pin sinks to ground the current flowing into the first LED, and is intended to be used in
backlight application. The current is limited to 30 mA max. (Note 2)
8 LED2 INPUT, POWER This pin sinks to ground the current flowing into the second LED, and is intended to be used
in backlight application. The current is limited to 30 mA max. (Note 2)
9 LED3 INPUT, POWER This pin sinks to ground the current flowing into the third LED, and is intended to be used in
backlight application. The current is limited to 30 mA max. (Note 2)
10 LED4 INPUT, POWER This pin sinks to ground the current flowing into the fourth LED, and is intended to be used
in backlight application. The current is limited to 30 mA max. (Note 2)
On the other hand, LED4 can be disconnected when only three LEDs are used in the
backlight application. (Table 1)
11 LED5 INPUT, POWER This pin sinks to ground the current flowing into the fifth LED (100 mA max), and is intended
to be used in Flash application. (Note 2)
12 LED6 INPUT, POWER This pin sinks to ground the current flowing into the sixth LED (100 mA max), and is
intended to be used in Flash or high power application. (Note 2)
13 PWRGND POWER This pin provides the ground reference for the power elements and must be connected to
the system ground by a heavy track. Using the ground plane technique is strongly
recommended. Care must be observed to minimize the total parasitic inductance between
the pin and the ground plane.
14 LED7 INPUT, POWER This pin sinks to ground the current flowing into the seventh LED (100 mA max), and is
intended to be used in flash or high power application. (Note 2)
15 LED8 INPUT, POWER This pin sinks to ground the current flowing into the eighth LED (100 mA max), and is
intended to be used in flash or high power application. (Note 2)
16 C1N POWER This pin is the second side of the C1 fly capacitor.
17 C1P POWER This pin is the first side of the C1 fly capacitor.
18 VOUT OUTPUT, POWER This pin provides the output power to the external LED. Since the regulation is based on a
current loop, the voltage will varies as the output current varies in the application. The Vout
pin must be bypassed to GND by a 4.7 mF ceramic capacitor. (Note 3)
19 PVBAT INPUT, POWER This pin provides the supply voltage to the charge pump converter. The pin must be
connected to the AVbat supply source and bypassed to GND by a 10 mF/16 V ceramic
capacitor. (Note 3) Using a power plane is recommended.
20 C2N POWER This pin is the second side of the C2 fly capacitor.
21 C2P POWER This pin is the first side of the C2 fly capacitor.
22 C3P POWER This pin is the second side of the C3 fly capacitor.
23 C3N POWER This pin is the first side of the C3 fly capacitor.
24 AVbat INPUT, POWER This pin provides the supply voltage to the analog and digitals blocks. The pin must be
connected to the PVbat supply source and bypassed to GND by a 1 mF/16 V ceramic
capacitor. (Note 3) Using a power plane is recommended.
1. To achieve a good accuracy of the LED current, 1% tolerance resistor, with 100 ppm stability, or better, shall be used. The reference current
is internally mirrored and sized according to the programmed value for a given external LED.
2. Total DC−DC output current is limited to 500 mA.
3. Ceramic X7R, ESR < 50 mW ESL < 0.5 nH, SMD types capacitors are mandatory to achieve the Iout specifications. On the other hand, care
must be observed to take into account the DC bias impact on the capacitance value; see ceramic capacitor manufacturer data sheets.
NCP5608
http://onsemi.com
5
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Supply V
bat
7.0 V
Digital Input Voltage
Digital Input Current
SDA, SCL
−0.3 v V
in
v V
BAT
+ 0.3
1.0
V
mA
ESD Capability (Note 4)
Human Body Model (HBM)
Machine Model (MM)
V
ESD
2.0
200
kV
V
QFN24 Package
Power Dissipation @ T
A
= +85°C (Note 5)
Thermal Resistance, Junction−to−Air (according to JEDEC/EIA JESD51−12)
P
D
R
q
JA
250
160
mW
°C/W
Operating Ambient Temperature Range T
A
−40 to +85 °C
Operating Junction Temperature Range T
J
−40 to +125 °C
Maximum Junction Temperature T
Jmax
+150 °C
Storage Temperature Range T
stg
−65 to +150 °C
Latchup Current Maximum Rating (per JEDEC standard: JESD78) Class II "100 mA
Moisture Sensitivity Level (Note 6) MSL 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
4. This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM): JESD22−A114.
Machine Model (MM): JESD22−A115.
5. The maximum package power dissipation limit must not be exceeded.
6. Moisture Sensitivity Level (MSL): per IPC/JEDEC standard: J−STD−020A.
NCP5608
http://onsemi.com
6
POWER SUPPLY SECTION (Typical values are referenced to T
A
= +25°C, Min & Max values are referenced −40°C to +85°C ambient
temperature, unless otherwise noted.)
Pin Symbol Rating Min Typ Max Unit
19, 24 PV
bat,
AV
bat
Power Supply 2.7 5.5 V
18 I
out
Continuous DC Current in the Load @ V
out
= 8xLED, V
bat
= 3.4 V 500 mA
18 Isch Continuous Output Short Circuit Current 60 120 mA
18 Vout Output Voltage Compliance (OVP) 4.8 5.5 V
24 I
stdb
Standby Current, @ I
out
= 0 mA, @ 2.7 V < Vbat < 4.2 V 5.0 mA
19 I
op
Operating Current, @ I
out
> 0 mA
PV
bat
= 3.6 V
PV
bat
= 4.2 V
0.5
0.8
mA
Fpwr Charge Pump Operating Frequency (Any C
FLY
Capacitor Pins) 1.3 MHz
7, 8, 9, 10 I
MAT
Output LED to LED Current Matching,
@ V
bat
= 3.6 V, I
LED
= 20 mA, LED1 to LED4 are Identical 2.0 "0.5 2.0
%
7, 8, 9, 10 I
TOL
Output Current Tolerance, LED1 to LED4
@ V
bat
= 3.6 V, I
LED
= 20 mA "2.0
%
11, 12, 14,
15
I
MAT
Output LED to LED Current Matching,
@ V
bat
= 3.6 V, I
LED
= 80 mA, LED5 to LED8 are Identical 2.0 "0.5 2.0
%
11, 12, 14,
15
I
TOL
Output Current Tolerance, LED5 to LED8
@ V
bat
= 3.6 V, I
LED
= 80 mA "2.0
%
18 t
start
DC−DC Start Time (C
out
= 4.7 mF )
− from Vbat Operating to Full Load Operation 150
ms
T
SD
Thermal Shutdown Protection 160 °C
T
SDH
Thermal Shutdown Protection Hysteresis 30 °C
ANALOG SECTION (Typical values are referenced to T
A
= +25°C, Min & Max values are referenced −25°C to +85°C ambient
temperature, unless otherwise noted.)
Pin Symbol Rating Min Typ Max Unit
3 I
REFBK
Backlight Reference Current @ Vref = 600 mV (Notes 7, 8) 1.0 100 mA
3 Reference Current (I
REF
) to Backlight Ratio 40
2 I
REFFL
Flash Reference Current @ Vref = 600 mV (Notes 7, 8) 1.0 100 mA
2 Reference Current (I
REF
) to Flash Ratio 40
4, 5 C
in
Input Capacitance (Parameter not tested, guaranteed by design) 10 pF
7. The overall output current tolerance depends upon the accuracy of the external resistor. Using 1% or better resistor is recommended.
8. The external circuit must not force the I
REF
pin voltage either higher or lower than the 600 mV specified.
DIGITAL PARAMETERS SECTION @ 2.70 V v V
CC
v 5.5 V (T
A
= −25°C to +85°C unless otherwise noted.)
Note: Digital inputs undershoot v −0.30 V to ground. Digital inputs overshoot v 0.30 V to V
CC
.
Pin Symbol Rating Min Typ Max Unit
5 F
CLK
Input I2C Clock, Duty Cycle = 50% 400 kHz
4, 5 V
IH
Positive−Going Input High Voltage Threshold (SDA, SCL) 0.7 V
CC
V
cc
+ 0.5 V V
4, 5 V
IL
Negative−Going Input High Voltage Threshold (SDA, SCL) 0 0.4 V
9. The V
CC
Bias pins can be either left open, or biased by the same voltage as the external MCU power supply source. An external 10 nF capacitor
might be necessary to improve the I2C function when operating with SDA and SCL signal amplitude below 1.8 V.
10.Expernal pullup resistors shall be connected to properly bias the SDA and SCL logic levels according to the I2C specifications.

NCP5608EVB

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Power Management IC Development Tools NCP5608 EVAL BRD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet