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APPLICATIONS INFORMATION
DC−DC OPERATION
The converter is based on a charge pump technique to
generate a DC voltage capable to supply the white LED
load. The system regulates the current flowing into each
LED by means of internal current mirrors associated with
the white diodes. Consequently, the output voltage will be
equal to the Vf of the LED, plus the 300 mV (typical)
developed across the internal NMOS mirror. Typically,
assuming a standard white LED forward biased at 10 mA,
the output voltage will be 3.2 V.
The third external capacitor makes possible the 1.33X
extra mode of operation, with a significant efficiency
improvement of the converter over the normal battery
voltage span. The threshold levels have been defined to
optimize this range of operating voltages, assuming a high
efficiency is not relevant when the system is connected to
a battery charger (i.e. Vbat > 4.5 V).
The built−in OVP circuit continuously monitors each
output and stops the converter when the voltage is above
5.0 V. The converter resumes normal operation when the
voltage drops below 5.0 V (no latch−up mechanism).
Consequently, the chip can operate with no load during any
test procedures, but in the case of special applications, it is
recommended to connect the unused LED driver either to
the V
OUT
supply to avoid any uncontrolled operation.
The structure is built with power MOS devices to
accommodate the modes selected by the analog functions.
The current flowing into each LED is continuously
regulated according to the value defined by the
programming message. The total current is limited to
500 mA DC.
The system runs with two cycles:
− Cycle#1
Fly capacitors are charged from the battery.
− Cycle#2
Energy accumulated into the fly capacitors is
transferred to the load.
PIN 16
GND
V
OUT
PWRGND
Q2
PIN 19
C1C1N C1P
PIN 17
Q8
C2 C2P
PIN 21
Q12
C3 C3P
PIN 22
Q1 Q6 Q10 Q11Q3 Q7
Q4
Q5 Q9
PIN 23PIN 20
CURRENT CONTROL
PIN 18
PIN 13
LEDx
GND
C2N C3N
Li−Ion
2.90 V − 4.10 V
Figure 3. Basic DC−DC NCP5608 Converter Structure
GND
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LOAD CURRENT CALCULATION
The load current is derived from the 600 mV reference
voltage provided by the internal band gap associated to the
external resistor connected across the I
REFBK
and I
REFFL
pins and GND (see Figure 4). In any case, no voltage shall
be forced at I
REFBK
or I
REFFL
pins, either downward or
upward. The backlight block, LED1 − LED4, is powered by
the current reference defined at the I
REFBK
pin. The output
current can be dimmed by means of a dynamic modulation
of the I
REFBK
pin.
The I
REFBK
reference current is multiplied by the
constant ka to yield the output backlight LED load current.
Since the reference voltage is based on a temperature
compensated bandgap, a tight tolerance resistor will
provide a very accurate load current.
The ka parameter is derived from the constant 40
multiplied by the binary defined in the PWRLED_BK
register. Consequently, ka varies from 40 (1.0 mA
output/LED) to 1200 to support the full output current
range. The resistor is calculated from the Ohm’s law
(R = Vref/I
REF
) and a more practical equation can be
arranged to define the resistor value for a given output
current:
Let Iout = 4*I
LED
, then:
R
BK
+ (Vref * ka * 30)ńI
out
(eq. 1)
R
BK
+ (0.6 * 1200)ńI
out
R
BK
+ 720ńI
out
Consequently, the resistor value will range between
R
BK
= 720/(30 mA*4) = 6000 W and
R
BK
= 720/(0.5 mA*4) = 360 kW for the low power block.
Similarly, the PowerFlash block, LED5−LED8, is
powered by the current reference defined at the I
REFFL
pin. The same calculation as before applies, assuming
kb = 40, the maximum output current being 100 mA/LED:
Let Iout = 4*I
LED
, then:
R
FL
+ (Vref * kb * 100)ńI
out
(eq. 2)
R
FL
+ (0.6 * 4000)ńI
out
R
FL
+ 2400ńI
out
Finally, the resistor value will range between
R
FL
= 2400/(100 mA*4) = 6000 W and
R
FL
= 2400/(1 mA*4) = 600 kW for the High Power Flash
block.
On the other hand, the output currents can be dimmed by
means of a dynamic modulation of their respective
I
REFBK
/I
REFFL
pins current references. Obviously, the
tolerance of such resistors must be 1% or better, with a
100 ppm thermal coefficient, to get the expected overall
tolerance.
Figure 4. Typical Backlight
Reference Current Operation
(Similar Circuit Applies for Power Flash Section)
Vbat
+
600 mV
GND
I
REFBK
GND
R1
V
OUT
PWRGND
PIN 13
PIN 3
BOOST
CONVERTER
LEDx
ANALOG
CONTROL
PIN 18
Note: Due to relative high impedance connected at the
reference current pins, cares must be observed to minimize
the noise pick−up and stray current present at PCB level.
Multi layer layout, with dedicated ground screen, is
mandatory.
SERIAL LINK I2C PROTOCOL
The chip is remotely controlled by means of a byte
transferred along a serial link between the MCU and the
NCP5608. The industrial standard I2C protocol is used,
although one can drive the SCL and SDA signal from
standard MCU I/O pins . Two dedicated internal registers
are used to decode the SDA content and to store the output
currents.
The I2C message carries three bytes within the same
frame:
Byte #1:
The content of this byte is the physical address
of the NCP5608 in the I2C bus.
Byte #2:
The content of this byte contains the address
of the selected block.
Byte #3:
This byte contains the output current value to
set up the selected block.
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In order to improve the efficiency of the back light block
when three LED only are used, one can disconnect the
fourth LED by setting B6 = Low simultaneously with the
third byte (see Table 1).
Table 1. Programming Table
Byte B7 B6 B5 B4 B3 B2 B1 B0 Comments
Byte #1 0 1 1 1 0 0 1 0 This is the I2C address
Byte #2 0 0 0 0 0 0 0 1 $01 = Select the Back Light internal register
Byte #2 0 0 0 0 0 0 1 0 $02 = Select the Power Flash internal register
Byte #3 1 0 0 X X X X X Assuming Byte #2 = $01, then:
Bits[0..4] = Back Light output current
Bit[5..6] = shall be Low
Bit[7] = control the fourth LED in the Back Light Block:
B7 = 0 ³ LED 4
th
disconnect
B7 = 1³ LED 4
th
connected
Byte #3 0 X X X X X X X Assuming Byte #2 = $02, then:
Bits[0..6] = Power Flash output current
Bit[7] = shall be Low
LED CURRENT CONTROL REGISTERS
The eight LED are split in two blocks:
Back Light Block:
LED1 to LED4, current limited to 30 mA per
LED
Flash or High Power Block:
LED5 to LED8, current limited to 100 mA per
LED
The programmed value of a given bank of LED is memorized into the appropriate registers. There is one register for each
set of LED:
PWRLED_BK[0..4]
Stores the Back Light output current.
PWRLED_FL[0..6]
Stores the Power Flash output current.
The total output current is limited to 500 mA, whatever be the configuration.
Table 2. Internal LED Current Control Register
Internal LEDs registers Bit Unit
B7 B6 B5 B4 B3 B2 B1 B0
PWRLED_BK[7..0]
BLED4
(Note 12)
RFU
(Note 11)
RFU
(Note 11)
16 8.0 4.0 2.0 1.0 mA
PWRLED_FL[7..0]
RFU
(Note 11)
64 32 16 8.0 4.0 2.0 1.0 mA
11. Reserved for future use.
12.Activates/deactivates LED4.

NCP5608EVB

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Power Management IC Development Tools NCP5608 EVAL BRD
Lifecycle:
New from this manufacturer.
Delivery:
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