Philips Semiconductors Product data sheet
SC26C562
CMOS dual universal serial communications controller
(CDUSCC)
2006 Aug 10
7
MNEMONIC NAME AND FUNCTIONTYPEPIN
TxDAKA/BN,
GPI2A/BN
38, 16 I Channel A (B) Transmitter DMA Acknowledge or General Purpose Input: Active-LOW. When the
channel is programmed for full-duplex single address DMA operation, this input is asserted to
indicate to the CDUSCC that the DMA controller has acquired the bus and that the requested load
transmitter FIFO bus cycle is beginning. Because the state of this input can be read under program
control, it can be used as a general purpose input when not in full-duplex single address DMA mode.
EOPN 29 I/O Done (EOP): Active-LOW, open-drain. EOPN can be used and is active in both DMA and non-DMA
modes. As an input, EOPN indicates the last DMA transfer cycle to the TxFIFO. As an output, EOPN
indicates either the last DMA transfer from the RxFIFO or that the transmitted character count has
reached terminal count.
RTSA/BN,
SYNOUTA/BN
45, 9 O Channel A (B) Sync Detect or Request-to-Send: Active-LOW. If programmed as a sync output, it
is asserted one bit time after the specified sync character (COP or BISYNC modes) or a FLAG (BOP
modes) is detected by the receiver. As a Request-to-Send modem control signal, it functions as
described previously for the TxDRQN/RTSN pin.
V
CC
34, 52 I +5 V Power Input
GND 26, 13,
41, 7
I Signal and Power Ground Input
Philips Semiconductors Product data sheet
SC26C562
CMOS dual universal serial communications controller
(CDUSCC)
2006 Aug 10
8
DC ELECTRICAL CHARACTERISTICS
4,5
T
amb
= 0 °C to +70 °C, V
CC
= 5.0 V ± 10 %
4,5
SYMBOL
PARAMETER
TEST CONDITIONS
LIMITS
UNIT
SYMBOL
PARAMETER
TEST
CONDITIONS
Min Typ Max
UNIT
Input LOW voltage:
V
IL
All except X1/CLK 0.8 V
X1/CLK 0.8 V
Input HIGH voltage except X1/CLK
V
IH
All except X1/CLK 2.0 V
X1/CLK 0.8 × V
CC
V
CC
V
Output LOW voltage:
V
OL
All except IRQN
7
I
OL
= 5.3 mA V
IRQN I
OL
= 8.8 mA 0.5 V
V
OH
Output HIGH voltage
(Except open drain outputs)
I
OH
= –400 µA V
CC
– 0.5 0.5 V
I
ILX1
X1/CLK input LOW current
10
V
IN
= 0, X2 = open –150 0.0 µA
I
IHX1
X1/CLK input HIGH current
10
V
IN
= V
CC
, X2 = GND 150 µA
I
SC
X2 short circuit current
X1 = open, V
IN
= 0 V –15 mA
I
SCX2
X2
short
circ
u
it
c
u
rrent
X1 = open, V
IN
= V
CC
+15 mA
I
IL
Input LOW current
RESETN, TxDAKN, RxDAKN
V
IN
= 0 V –15 –0.5 µA
I
I
Input leakage current V
IN
= 0 V to V
CC
–1 +1 µA
I
OZH
Output off current HIGH, 3-State data bus V
IN
= V
CC
+1 µA
I
OZL
Output off current LOW, 3-State data bus V
IN
= 0 V –1 µA
I
ODL
Open drain output LOW current in off state:
EOPN, RDYN V
IN
= 0 V –15 –0.5 µA
IRQN V
IN
= 0 V –1 µA
I
ODH
Open drain output HIGH current in off state:
EOPN, IRQN, RDYN V
IN
= V
CC
–1 1 µA
I
CC
13
Power supply current
(see Figure 19 for graphs)
25 80 mA
C
IN
Input capacitance
9
V
CC
= GND = 0 V 10 pF
C
OUT
Output capacitance
9
V
CC
= GND = 0 V 15 pF
C
I/O
Input/output capacitance
9
V
CC
= GND = 0 V 20 pF
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those indicated in the operation section of this specification is not
implied.
2. Clock may be stopped (DC) for testing purposes, or when CDUSCC is in non-operational modes.
3. This product includes circuitry specifically designed for the protection of its internal devices from damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying any voltages larger than the rated maxima.
4. Parameters are valid over specified temperature range.
5. All voltage measurements are referenced to ground (GND). For testing, all inputs except X1/CLK swing between 0.2 V and 3.0 V with a
transition time of 20 ns maximum. For X1/CLK, this swing is between 0.2 V and 4.4 V. All time measurements are referenced at input
voltages of 0.2 V and 3.0 V and output voltages of 0.8 V and 2.0 V, as appropriate.
6. See Figure 20 for test conditions for outputs.
7. Tests for open drain outputs are intended to guarantee switching of the output transistor. Measurement of this response is referenced from
midpoint of the switching signal to a point 0.2 V above the actual output signal level. This point represents noise margin that assures true
switching has occurred.
8. Execution of the valid command (after it is latched) requires 3 rising edges of X1 (see Figure 15).
9. These values were not explicitly tested; they are guaranteed by design and characterization data.
10.X1/CLK and X2 are not tested with a crystal installed.
11. X1/CLK frequency must be at least the faster of the receiver or transmitter serial data rate.
12.Timing is illustrated and referenced to the WRN and RDN inputs. The device may also be operated with CSN as the ‘strobing’ input. CSN
and RDN (also CSN and WRN) are ANDed internally. As a consequence, the signal asserted last initiates the cycle and the signal negated
first terminates the cycle.
13.V
O
= 0 V to V
CC
, Rx and Tx clocks at 10 MHz, X1 clock at 10 MHz.
Philips Semiconductors Product data sheet
SC26C562
CMOS dual universal serial communications controller
(CDUSCC)
2006 Aug 10
9
AC ELECTRICAL CHARACTERISTICS
4,5,6,7
T
amb
= 0 °C to +70 °C; V
CC
= 5 V ± 10 %
t
RELREH
RESETN
SD00205
Figure 3. Reset Timing
SYMBOL
PARAMETER
LIMITS
UNIT
SYMBOL
PARAMETER
Min Max
UNIT
t
RELREH
RESETN LOW to RESETN HIGH 200 ns
A6–A1
t
ADVRDL
CSN (CEN)
t
CEHCEL
t
CELRDL
RDN
t
RDHCEH
t
RDLADI
t
RDLRDH
t
RDHRDL
D0–D7
t
RDLDDV
t
RDHDDF
t
RDHDDI
RDYN
t
RDLRYL
t
RYZDDV
NOTE:
Wait on Rx. Receiver FIFO empty.
A
A
t
RDLDLZ
SD00240
Figure 4. Read Cycle
12
SYMBOL
PARAMETER
LIMITS
UNIT
SYMBOL
PARAMETER
Min Max
UNIT
t
ADVRDL
Address valid to RDN LOW 5 ns
t
CELRDL
CEN LOW to RDN LOW 0 ns
t
RDLADI
RDN LOW to address invalid 50 ns
t
RDLRYL
RDN LOW to RDYN LOW 150 ns
t
RDLDDV
RDN LOW to read data valid 130 ns
t
RDLRDH
RDN LOW to RDN HIGH 130 ns
t
RYZDDV
RDYN high-impedance to read data valid
9
90 ns
t
RDHCEH
RDN HIGH to CEN HIGH 0 ns
t
CEHCEL
CEN HIGH to CEN LOW 30 ns
t
RDHDDI
RDN HIGH to read data invalid 5 ns
t
RDHRDL
RDN HIGH to RDN LOW 30 ns
t
RDHDDF
RDN HIGH to data bus floating 40 ns
t
RDLDLZ
RDN LOW to data bus low-impedance
9
10 ns

SC26C562C1A,512

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC DUAL SRL COMM CTRLR 52-PLCC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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