© 2007 Microchip Technology Inc. DS21808D-page 13
25XX080A/B
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
3.1 Chip Select (CS)
A low level on this pin selects the device. A high level
deselects the device and forces it into Standby mode.
However, a programming cycle which is already
initiated or in progress will be completed, regardless of
the CS
input signal. If CS is brought high during a
program cycle, the device will go into Standby mode as
soon as the programming cycle is complete. When the
device is deselected, SO goes to the high-impedance
state, allowing multiple parts to share the same SPI
bus. A low-to-high transition on CS
after a valid write
sequence initiates an internal write cycle. After power-
up, a low level on CS
is required prior to any sequence
being initiated.
3.2 Serial Output (SO)
The SO pin is used to transfer data out of the
25XX080A/B. During a read cycle, data is shifted out
on this pin after the falling edge of the serial clock.
3.3 Write-Protect (WP)
This pin is used in conjunction with the WPEN bit in the
Status Register to prohibit writes to the nonvolatile bits
in the Status Register. When WP is low and WPEN is
high, writing to the nonvolatile bits in the Status Regis-
ter is disabled. All other operations function normally.
When WP
is high, all functions, including writes to the
nonvolatile bits in the Status Register operate normally.
If the WPEN bit is set, WP low during a Status Register
write sequence will disable writing to the Status
Register. If an internal write cycle has already begun,
WP
going low will have no effect on the write.
The WP
pin function is blocked when the WPEN bit in
the Status Register is low. This allows the user to install
the 25XX080A/B in a system with WP
pin grounded
and still be able to write to the Status Register. The WP
pin functions will be enabled when the WPEN bit is set
high.
3.4 Serial Input (SI)
The SI pin is used to transfer data into the device. It
receives instructions, addresses and data. Data is
latched on the rising edge of the serial clock.
3.5 Serial Clock (SCK)
The SCK is used to synchronize the communication
between a master and the 25XX080A/B. Instructions,
addresses or data present on the SI pin are latched on
the rising edge of the clock input, while data on the SO
pin is updated after the falling edge of the clock input.
3.6 Hold (HOLD)
The HOLD pin is used to suspend transmission to the
25XX080A/B while in the middle of a serial sequence
without having to retransmit the entire sequence again.
It must be held high any time this function is not being
used. Once the device is selected and a serial
sequence is underway, the HOLD
pin may be pulled
low to pause further serial communication without
resetting the serial sequence. The HOLD pin must be
brought low while SCK is low, otherwise the HOLD
function will not be invoked until the next SCK high-to-
low transition. The 25XX080A/B must remain selected
during this sequence. The SI, SCK and SO pins are in
a high impedance state during the time the device is
paused and transitions on these pins will be ignored. To
resume serial communication, HOLD
must be brought
high while the SCK pin is low, otherwise serial
communication will not resume. Lowering the HOLD
line at any time will tri-state the SO line.
Name Pin Number Function
CS
1 Chip Select Input
SO 2 Serial Data Output
WP 3 Write-Protect Pin
V
SS 4 Ground
SI 5 Serial Data Input
SCK 6 Serial Clock Input
HOLD
7 Hold Input
VCC 8 Supply Voltage
25XX080A/B
DS21808D-page 14 © 2007 Microchip Technology Inc.
4.0 PACKAGING INFORMATION
4.1 Package Marking Information
8-Lead MSOP (150 mil)
Example:
XXXXXXT
YWWNNN
5L8AI
6281L7
T/XXXNNN
XXXXXXXX
YYWW
8-Lead PDIP
8-Lead SOIC
XXXXYYWW
XXXXXXXT
NNN
XXXX
TYWW
8-Lead TSSOP
NNN
I/P 1L7
25LC080A
0628
Example:
Example:
SN 0628
25L080AI
1L7
1L7
5L8A
I628
Example:
MSOP
1st Line Marking Codes
Device
25AA080A
25
AA080B
25LC080A
25LC080B
Code
TSSOP 1st Line Marking Codes
Device
25AA080A
25AA080B
25LC080A
25LC080B
Code
5A8A
5A8B
5L8A
5L8B
5A8A
5A8B
5L8A
5L8B
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
3
e
3
e
© 2007 Microchip Technology Inc. DS21808D-page 15
25XX080A/B
8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 0.65 BSC
Overall Height A 1.10
Molded Package Thickness A2 0.75 0.85 0.95
Standoff A1 0.00 0.15
Overall Width E 4.90 BSC
Molded Package Width E1 3.00 BSC
Overall Length D 3.00 BSC
Foot Length L 0.40 0.60 0.80
Footprint L1 0.95 REF
Foot Angle φ
Lead Thickness c 0.08 0.23
Lead Width b 0.22 0.40
D
N
E
E1
NOTE 1
1
2
e
b
A
A1
A2
c
L1
L
φ
Microchip Technology Drawing C04-111
B

25AA080B-I/MS

Mfr. #:
Manufacturer:
Microchip Technology
Description:
EEPROM 1kx8 8k 32B Pg 1.8V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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