13
LT5526
5526f
APPLICATIO S I FOR ATIO
WUUU
Figure 12. Typical Return Loss Performance with
a 240MHz Narrowband Bridge IF Balun (Swept IF)
Figure 13. Typical Gain and IIP3 Performance with
a 240MHz Narrowband Bridge IF Balun (Swept IF)
IF
+
C12
IF
OUT
50
L12
L11
C11
IF
V
CC
C13
C14
L14
OPT
L13
OPT
5526 F11
Figure 11. Narrowband Bridge IF Balun
LL
RR
CC
RR
IF L
IF L
11 12
11 12
1
==
==
ω
ω
I
nductors L13 and L14 provide a DC path between V
CC
and the IF
+
pin. Only one of these inductors is required.
Low cost multilayer chip inductors are adequate for L11,
L12 and L13. If L14 is used instead of L13, a larger value
is usually required, which may require the use of a wire-
wound inductor. Capacitor C13 is a DC block which can
also be used to adjust the impedance match. Capacitor
C14 is a bypass capacitor.
Typical return loss of the IF output port is plotted versus
frequency in Figure 12 for a 240MHz balun design. For this
example, L11 = L12 = 100nH, C11 = C12 = 3.9pF, L14 =
560nH and C13 = 100pF. Performance versus IF output
frequency is shown in Figure 13 in the case of a 1900MHz
RF input. These results show that the usable IF bandwidth
is greater than 60MHz, assuming tight tolerance matching
components. Contact the factory for applications assis-
tance with this circuit.
FREQUENCY (MHz)
100
–25
RETURN LOSS (dB)
–20
–15
–10
–5
0
150
200 250 300
5526 F12
350 400
IF FREQUENCY (MHz)
190
GAIN (dB), IIP3 (dBm)
10
15
20
270
5526 F13
5
0
–5
210
IIP3
GAIN
230
250
290
T
A
= 25°C
f
RF
= 1900MHz
f
LO
= f
RF
– f
IF
P
LO
= –5dBm
14
LT5526
5526f
TYPICAL APPLICATIO S
U
Evaluation Board Layouts
Top Layer Silkscreen Top Layer Metal
15
LT5526
5526f
U
PACKAGE DESCRIPTIO
UF Package
16-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1692)
4.00 ± 0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.55 ± 0.20
1615
1
2
BOTTOM VIEW—EXPOSED PAD
2.15 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.30 ± 0.05
0.65 BSC
0.200 REF
0.00 – 0.05
(UF) QFN 1103
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.72 ±0.05
0.30 ±0.05
0.65 BSC
2.15 ± 0.05
(4 SIDES)
2.90 ± 0.05
4.35 ± 0.05
PACKAGE OUTLINE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

LT5526EUF#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Mixer 2GHz Low Power Downconverting Mixer
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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