7
LT5526
5526f
UU
U
PI FU CTIO S
NC (Pins 1, 4, 8, 13, 16): Not Connected Internally. These
pins should be grounded on the circuit board for improved
LO-to-RF and LO-to-IF isolation.
RF
+
, RF
(Pins 2, 3): Differential Inputs for the RF Signal.
These pins must be driven with a differential signal. Each
pin must also be connected to a DC ground capable of
sinking 7.5mA (15mA total). This DC bias return can be
accomplished through the center-tap of a balun or with
shunt inductors. An impedance transformation is required
to match the RF input to 50 (or 75).
EN (Pin 5): Enable Pin. When the input voltage is higher
than 3V, the mixer circuits supplied through Pins 6, 7, 10
and 11 are enabled. When the input voltage is less than
0.3V, all circuits are disabled. Typical enable pin input
current is 55µA for EN = 5V and 0.01µA when EN = 0V.
V
CC1
(Pin 6): Power Supply Pin for the LO Buffer Circuits.
Typical current consumption is 11mA. This pin should be
externally connected to the other V
CC
pins and decoupled
with 100pF and 0.01µF capacitors.
V
CC2
(Pin 7): Power Supply Pin for the Bias Circuits.
Typical current consumption is 2.5mA. This pin should be
externally connected to the other V
CC
pins and decoupled
with 100pF and 0.01µF capacitors.
GND (Pins 9, 12): Ground. These pins are internally
connected to the Exposed Pad for better isolation. They
should be connected to ground on the circuit board,
though they are not intended to replace the primary
grounding through the Exposed Pad of the package.
IF
and IF
+
(Pins 10, 11): Differential Outputs for the IF
Signal. An impedance transformation may be required to
match the outputs. These pins must be connected to V
CC
through impedance matching inductors, RF chokes or a
transformer center-tap.
LO
, LO
+
(Pins 14, 15): Differential Inputs for the Local
Oscillator Signal. The LO input is internally matched to
50; however, external DC blocking capacitors are re-
quired because these pins are internally biased to approxi-
mately 1.7V DC. Either LO input can be driven with a
single-ended source while connecting the unused input to
ground through a DC blocking capacitor.
Exposed Pad (Pin 17): Circuit Ground Return for the
Entire IC. This must be soldered to the printed circuit board
ground plane.
BLOCK DIAGRA
W
15 14
6
112
3
75
10
HIGH
SPEED
LO BUFFER
DOUBLE-
BALANCED
MIXER
LINEAR
AMPLIFIER
LO
EXPOSED
PAD
LO
+
RF
+
RF
V
CC2
V
CC1
EN
IF
+
12
17
GND
IF
9
GND
5526 BD
BIAS
8
LT5526
5526f
TEST CIRCUITS
IF
OUT
140MHz
5526 F01
16 15 14 13
56 78
12
11
10
9
NC NC
GND
GND
EN
EN
V
CC1
V
CC2
RF
+
RF
LO
+
LO
NC
17
1
2
3
4
NC
NC
IF
+
IF
C1
TL1
TL2
T1
2
1
4
6
3
RF
IN
900MHz
LO
IN
760MHz
15
4
3
2
C4
L3
L2
C3
C2
C6 C5
C8
V
CC
LT5526
RF
GND
GND
DC
ER = 4.4
0.018"
0.018"
0.062"
1900MHz INPUT MATCHING:
C1: 1.5pF
T1: LDB311G9010C-440
T2
REF DES VALUE SIZE PART NUMBER REF DES VALUE SIZE PART NUMBER
C1 2.7pF 0402 AVX 04025A2R7CAT L2, L3 150nH 1608 Toko LL1608-FSR15J
C2 0.01µF 0402 AVX 04023C103JAT T1 1:1 1206 Murata LDB31900M05C-417
C3 1.2pF 0402 AVX 04025A1R2BAT T2 4:1 SM-22 M/A-COM ETC4-1-2
C4, C5, C6 100pF 0402 AVX 04025A101JAT TL1, TL2 Z
O
= 80 L = 1.25mm
C8 1µF 0603 Taiyo Yuden LMK107BJ105MA
Figure 1. Test Schematic for 900MHz Application. For 1900MHz or Other Applications,
Component Values Are as Indicated in Figure 1 and in Applications Section
REF DES VALUE SIZE PART NUMBER REF DES VALUE SIZE PART NUMBER
C2 0.01pF 0402 AVX 04023C103JAT L1, L4 15nH 1005 Toko LL1005-FH15NJ
C3 3.9pF 0402 AVX 04025A3R9BAT L2, L3 270nH 1608 Toko LL1608-FSR27J
C4, C5, C6 100pF 0402 AVX 04025A101JAT L5 100nH 1005 Toko LL1005-FHR10J
C8 1µF 0603 Taiyo Yuden LMK107BJ105MA T2 4:1 SM-22 M/A-COM ETC4-1-2
C7, C9 10pF 0402 AVX 04025A100JAT
Figure 2. Test Schematic for 350MHz Applications
IF
OUT
70MHz
5526 F02
16 15 14 13
56 78
12
11
10
9
NC NC
GND
GND
EN
EN
V
CC1
V
CC2
RF
+
RF
LO
+
LO
NC
17
1
2
3
4
NC
NC
IF
+
IF
C9
C7
L4
L1
L5
RF
IN
350MHz
LO
IN
420MHz
15
4
3
2
C4
L3
L2
C3
C2
C6 C5
C8
V
CC
LT5526
RF
GND
GND
DC
ER = 4.4
0.018"
0.018"
0.062"
T2
9
LT5526
5526f
APPLICATIO S I FOR ATIO
WUUU
The LT5526 consists of a double-balanced mixer, RF
buffer amplifier, high speed limiting LO buffer and
bias/enable circuits. The IC has been optimized for
downconverter applications with RF input signals to 2GHz
and LO signals to 2.5GHz. With proper matching, the IF
output can be tuned for operation at frequencies from
0.1MHz to 1GHz. Operation over a wider input frequency
range is possible, though with reduced performance.
The RF, LO and IF ports are all differential, though the LO
port is internally matched for single-ended drive (with
external DC blocking capacitors). The LT5526 is charac-
terized and production tested using single-ended LO drive.
Low side or high side LO injection can be used.
RF Input Port
Figure 3 shows a simplified schematic of the internal RF
input circuit and example external impedance matching
components for a 900MHz application. Each RF input pin
requires a low resistance DC return to ground capable of
handling 7.5mA. The DC ground can be realized using the
center-tap of an input transformer (T1), as shown, or
through matching inductors or bias chokes connected
from Pins 2 and 3 to ground.
A lowpass impedance matching network is used to trans-
form the differential input impedance at Pins 2 and 3 to the
optimum value for the balun output, as illustrated in
Figures 3 and 4. To assist in matching, Table 1 lists the
differential input impedance and reflection coefficient at
Pins 2 and 3 for several RF frequencies. The following
example demonstrates how to design a lowpass imped-
ance transformation network for the RF input.
From Table 1, the differential input impedance at 900MHz
is: R
RF
+ jX
RF
= 31.3 + j8.41. The 8.41 reactance is
divided into two halves, with one half on each side of the
31.3 internal load resistor, as shown in Figure 4. The
matching network consists of additional external series
inductance and a capacitor (C1) in parallel with the desired
source impedance (50 in this example). The external
capacitance and inductance are calculated as follows:
n = R
S
/R
RF
= 50/31.3 = 1.597
Q = (n – 1) = 0.773
X
C
= R
S
/Q = 64.7
C1 = 1/(ω • X
C
) = 2.74pF
X
L
= R
RF
• Q = 24.2
X
EXT
= X
L
– X
RF
= 15.8
L
EXT
= X
EXT
/ω = 2.79nH
2
TL1
Z
0
= 80
LNG = 1.25mm
TL2
Z
0
= 80
LNG = 1.25mm
T1
1:1
6
3
4
2
1
RF
+
C1
2.7pF
RF
IN
900MHz
7.5mA LT5526
7.5mA
5526 F03
3
RF
V
BIAS
T1: LDB31900M05C-417
Figure 3. RF Input with External Matching
for 900MHz Application

LT5526EUF#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Mixer 2GHz Low Power Downconverting Mixer
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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