Data Sheet ADuM3400/ADuM3401/ADuM3402
Rev. E | Page 19 of 24
DATA RATE (Mbps)
CURRENT (mA)
0
0
80
40
20 60
80 100
5V
3.3V
60
40
20
05985-014
Figure 14. Typical ADuM3401 V
DD2
Supply Current vs. Data Rate
for 5 V and 3.3 V Operation
DATA RATE (Mbps)
CURRENT (mA)
0
0
80
4020 60 80 100
5V
3.3V
60
40
20
05985-015
Figure 15. Typical ADuM3402 V
DD1
or V
DD2
Supply Current vs. Data Rate
for 5 V and 3.3 V Operation
TEMPERATURE (°C)
PROPAGATION DELAY (ns)
–50 –25
25
30
35
40
0 50 7525 100
3.3V
5V
05985-016
Figure 16. Propagation Delay vs. Temperature, C Grade
ADuM3400/ADuM3401/ADuM3402 Data Sheet
Rev. E | Page 20 of 24
APPLICATION INFORMATION
PC BOARD LAYOUT
The ADuM3400/ADuM3401/ADuM3402 digital isolators
require no external interface circuitry for the logic interfaces.
Power supply bypassing is strongly recommended at the input
and output supply pins (see Figure 17). Bypass capacitors are
most conveniently connected between Pin 1 and Pin 2 for V
DD1
and between Pin 15 and Pin 16 for V
DD2
. The capacitor value must
be between 0.01 μF and 0.1 μF. The total lead length between both
ends of the capacitor and the input power supply pin must not
exceed 20 mm. Bypassing between Pin 1 and Pin 8 and between
Pin 9 and Pin 16 must also be considered unless the ground pair
on each package side is connected close to the package.
V
DD1
GND
1
V
IA
V
IB
V
IC/OC
V
ID/OD
V
E1
GND
1
V
DD2
GND
2
V
OA
V
OB
V
OC/IC
V
OD/ID
V
E2
GND
2
0
5985-017
Figure 17. Recommended Printed Circuit Board Layout
In applications involving high common-mode transients, care
must be taken to ensure that board coupling across the isolation
barrier is minimized. Furthermore, the board layout must be
designed such that any coupling that does occur equally affects
all pins on a given component side. Failure to ensure this can
cause voltage differentials between pins exceeding the Absolute
Maximum Ratings of the device, thereby leading to latch-up or
permanent damage.
See the AN-1109 Application Note for board layout guidelines.
SYSTEM-LEVEL ESD CONSIDERATIONS AND
ENHANCEMENTS
System-level ESD reliability (for example, per IEC 61000-4-x)
is highly dependent on system design, which varies widely
by application. The ADuM3400/ADuM3401/ADuM3402
incorporate many enhancements to make ESD reliability less
dependent on system design. The enhancements include:
ESD protection cells added to all input/output interfaces.
Key metal trace resistances reduced using wider geometry
and paralleling of lines with vias.
The SCR effect inherent in CMOS devices minimized by
use of guarding and isolation technique between PMOS
and NMOS devices.
Areas of high electric field concentration eliminated using
45° corners on metal traces.
Supply pin overvoltage prevented with larger ESD clamps
between each supply pin and respective ground.
While the ADuM3400/ADuM3401/ADuM3402 improve system-
level ESD reliability, they are no substitute for a robust system-
level design. See the AN-793 Application Note, ESD/Latch-Up
Considerations with iCoupler Isolation Products for detailed
recommendations on board layout and system-level design.
PROPAGATION DELAY-RELATED PARAMETERS
Propagation delay is a parameter that describes the time it takes
a logic signal to propagate through a component. The propagation
delay to a logic low output can differ from the propagation
delay to a logic high.
INPUT (
V
Ix
)
OUTPUT (V
Ox
)
t
PLH
t
PHL
50%
50%
05985-018
Figure 18. Propagation Delay Parameters
Pulse width distortion is the maximum difference between
these two propagation delay values and is an indication of how
accurately the input signal timing is preserved.
Channel-to-channel matching refers to the maximum amount
the propagation delay differs between channels within a single
ADuM3400/ADuM3401/ADuM3402 component.
Propagation delay skew refers to the maximum amount the prop-
agation delay differs between multiple ADuM3400/ADuM3401/
ADuM3402 components operating under the same conditions.
DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY
Positive and negative logic transitions at the isolator input cause
narrow (~1 ns) pulses to be sent to the decoder via the transformer.
The decoder is bistable and is, therefore, either set or reset by
the pulses, indicating input logic transitions. In the absence of
logic transitions at the input for more than ~1 μs, a periodic set
of refresh pulses indicative of the correct input state are sent to
ensure dc correctness at the output. If the decoder receives no
internal pulses of more than about 5 μs, the input side is assumed
to be unpowered or nonfunctional, in which case the isolator
output is forced to a default state (see Table 11) by the watchdog
timer circuit.
The limitation on the magnetic field immunity of the ADuM3400/
ADuM3401/ADuM3402 is set by the condition in which induced
voltage in the receiving coil of the transformer is sufficiently large
to either falsely set or reset the decoder. The following analysis
defines the conditions under which this can occur. The 3.3 V
operating condition of the ADuM3400/ADuM3401/ADuM3402
is examined because it represents the most susceptible mode of
operation.
Data Sheet ADuM3400/ADuM3401/ADuM3402
Rev. E | Page 21 of 24
The pulses at the transformer output have an amplitude greater
than 1.0 V. The decoder has a sensing threshold at about 0.5 V, thus
establishing a 0.5 V margin in which induced voltages can be
tolerated. The voltage induced across the receiving coil is given by
V = (−dβ/dt)∑∏r
n
2
; N = 1, 2, … , N
where:
β is magnetic flux density (gauss).
N is the number of turns in the receiving coil.
r
n
is the radius of the n
th
turn in the receiving coil (cm).
Given the geometry of the receiving coil in the ADuM3400/
ADuM3401/ADuM3402 and an imposed requirement that
the induced voltage be at most 50% of the 0.5 V margin at the
decoder, a maximum allowable magnetic field is calculated as
shown in Figure 19.
MAGNETIC FIELD FREQUENCY (Hz)
100
MAXIMUM ALLOWABLE MAGNETIC FLUX
DENSITY (kgauss)
0.001
1M
10
0.01
1k 10k
10M
0.1
1
100M100k
05985-019
Figure 19. Maximum Allowable External Magnetic Flux Density
For example, at a magnetic field frequency of 1 MHz, the max-
imum allowable magnetic field of 0.2 kgauss induces a voltage
of 0.25 V at the receiving coil, which is about 50% of the sensing
threshold and does not cause a faulty output transition. Similarly, if
such an event occurs during a transmitted pulse (and is of the
worst-case polarity), it reduces the received pulse from >1.0 V to
0.75 Vstill well above the 0.5 V sensing threshold of the decoder.
The preceding magnetic flux density values correspond to specific
current magnitudes at given distances from the ADuM3400/
ADuM3401/ADuM3402 transformers. Figure 20 expresses
these allowable current magnitudes as a function of frequency
for selected distances. As shown, the ADuM3400/ADuM3401/
ADuM3402 are extremely immune and can be affected only by
extremely large currents operated at high frequency very close
to the component. For the 1 MHz example noted, place a 0.5 kA
current 5 mm away from the ADuM3400/ADuM3401/ADuM3402
to affect the operation of the component.
MAGNETIC FIELD FREQUENCY (Hz)
MAXIMUM ALLOWABLE CURRENT (kA)
1000
100
10
1
0.1
0.01
1k 10k 100M100k 1M 10M
DISTANCE = 5mm
DISTANCE = 1m
DISTANCE = 100mm
05985-020
Figure 20. Maximum Allowable Current for Various Current-to-
ADuM3400/ADuM3401/ADuM3402 Spacings
Note that at combinations of strong magnetic field and high
frequency, any loops formed by printed circuit board traces
can induce error voltages sufficiently large enough to trigger
the thresholds of succeeding circuitry. Care must be taken in
the layout of such traces to avoid this possibility.
POWER CONSUMPTION
The supply current at a given channel of the ADuM3400/
ADuM3401/ADuM3402 isolator is a function of the supply
voltage, the channel data rate, and the channel output load.
For each input channel, the supply current is given by
I
DDI
= I
DDI (Q)
f ≤ 0.5 f
r
I
DDI
= I
DDI (D)
× (2f f
r
) + I
DDI (Q)
f > 0.5 f
r
For each output channel, the supply current is given by
I
DDO
= I
DDO (Q)
f ≤ 0.5 f
r
I
DDO
= (I
DDO (D)
+ (0.5 × 10
−3
) × C
L
× V
DDO
) × (2f − f
r
) + I
DDO (Q)
f > 0.5 f
r
where:
I
DDI (D)
, I
DDO (D)
are the input and output dynamic supply currents
per channel (mA/Mbps).
C
L
is the output load capacitance (pF).
V
DDO
is the output supply voltage (V).
f is the input logic signal frequency (MHz); it is half of the input
data rate expressed in units of Mbps.
f
r
is the input stage refresh rate (Mbps).
I
DDI (Q)
, I
DDO (Q)
are the specified input and output quiescent
supply currents (mA).

ADUM3400ARWZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Digital Isolators Quad-CH Digital EH System-Level ESD
Lifecycle:
New from this manufacturer.
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