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NFE61PT472C1H9L

P1-P3P4-P6P7-P8
Spec. No. JENF243E-0003Q-01 P 4 / 8
MURATA MFG. CO., LTD.
Reference
Only
10.2. Specification of Taping
(1) Packing quantity (standard quantity)
2500 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
10.3. Pull Strength of Plastic Tape and Cover Tape
Plastic tape 5N min.
Cover tape 10N min.
10.4. Peeling off force of cover tape
0.2N to 0.7N (minimum value is typical)
Speed of Peeling off : 300 mm / min
10.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
(in: mm)
10.6. Marking for reel
Customer part number , MURATA part number , Inspection number(1) , RoHS marking(2) , Quantity , etc
1) « Expression of Inspection No. » □□
OOOO 
(1) (2) (3)
(1)
Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y
(△)
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (2) , Quantity , etc
165° ~ 180°
F
Cover Tape
Plastic Tape
Empty tape
190 min.
Leader
Trailer
2.0±0.5
13.0±0.2
21.0±0.8
180±
60±
13±
17±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Cover tape
Label
Spec. No. JENF243E-0003Q-01 P 5 / 8
MURATA MFG. CO., LTD.
Reference
Only
10.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 4
Above Outer Case size is typical. It depends on a quantity of an order.
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged
according to the figure to reinforce the ground-pattern.
(a) Standard land dimensions for reflow (b) Standard land dimensions for flow
･Side on which chips are mounted ･Side on which chips are mounted
12. ! Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
13. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content
exceeding 0.2(wt)%).
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
13.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products
surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way
that the temperature difference is limited to 100°C max.
<Consideration for mounting of 2.5mm pitch>
The mounting of 2.5mm pitch should be prevented on flow soldering to avoid an excess of solder volume.
2.0
4.8
8.8
1.6
2.6
3.0
Small diameter thru hole
0.4
Resist
Copper foil pattern
No pattern
1.5
3.8
4.8
9.0
0.6
1.2
3.2
3.6
(in mm)
Small diameter thru hole
0.4
Resist
Copper foil pattern
No pattern
W
D
Label
H
Spec. No. JENF243E-0003Q-01 P 6 / 8
MURATA MFG. CO., LTD.
Reference
Only
13.3. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
〔Products direction〕
Products shall be located in the sideways
direction (Length:a
b) to the mechanical
stress.
(2) Products location on P.C.B. near seam for separation.
Products (A,B,C,D) shall be located carefully so
that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A
CB D.
13.4. Standard Soldering Conditions
On flow soldering (e.g. double wave soldering), use the product in consideration of the conditions of solder, solder
temperature and immersion time (melting time) because longer soldering time may cause the corrosion of the
electrode.
On dipping soldering, use the product in consideration of the conditions of solder, solder temperature, flux, preheat
and so on because de-wetting may be caused.
Standard soldering profile and the limit soldering profile is as follows.
The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
< Flow Soldering Profile >
Standard Profile Limit Profile
Pre-heating 150°C , 60s min.
Heating 250°C , 4s ~ 6s 265°C ± 3°C , 5s max.
Cycle of flow 2 times 2 times
〈
Poor example
〉
〈
Good example
〉
b
a
Seam
Slit
A
D
B
C
b
a
Lengh:a<b
265°C±3°C
250°C
60s min.
150
Limit Profile
Time.(s)
(
°C
)
Temp.
Heating Time
Standard Profile
P1-P3P4-P6P7-P8

NFE61PT472C1H9L

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Feed Through Capacitors 4700PF 50V 2.0A EMI
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