MAX9720
Charge-Pump Capacitor Selection
Use capacitors with an ESR less than 100m for opti-
mum performance. Low-ESR ceramic capacitors mini-
mize the output resistance of the charge pump. For
best performance over the extended temperature
range, select capacitors with an X7R dielectric. Table 2
lists suggested manufacturers.
Flying Capacitor (C1)
The value of the flying capacitor (C1) affects the charge
pumps load regulation and output impedance. A C1
value that is too small degrades the devices ability to
provide sufficient current drive, which leads to a loss of
output voltage. In most applications, 1µF for both C1
and C2 provides adequate performance. Increasing
the value of C1 improves load regulation and reduces
the charge-pump output resistance to an extent. See
the Output Power vs. Charge Pump Capacitance and
Load Resistance graph in the Typical Operating
Characteristics. Above 2.2µF, the on-resistance of the
switches and the ESR of C1 and C2 dominate.
Hold Capacitor (C2)
The hold capacitor value and ESR directly affect the
ripple on PV
SS
. Increasing the value of C2 reduces out-
put ripple. Likewise, decreasing the ESR of C2 reduces
both ripple and output impedance. Lower capacitance
values can be used in systems with low maximum out-
put power levels. See the Output Power vs. Charge-
Pump Capacitance and Load Resistance graph in the
Typical Operating Characteristics.
Power-Supply Bypass Capacitor
The power-supply bypass capacitor (C3) lowers the
output impedance of the power supply and reduces the
impact of the MAX9720s charge-pump switching tran-
sients. Bypass V
DD
with C3, the same value as C1, and
place it physically close to the device.
TIME Capacitor
The TIME capacitor (C
TIME
) sets the HPS debounce
time. The debounce time is the delay between HPS
exceeding 0.8 x V
DD
and the execution of the
SmartSense routine. The delay ensures that any exces-
sive contact bounce caused by the insertion of a head-
phone plug into the jack does not cause HPS to
register an invalid state (Figure 9). The value of the
C
TIME
in nF equals the nominal delay time in ms, i.e.,
C
TIME
= 10nF = t
DELAY
= 10ms. C
TIME
values in the
200nF to 600nF range are recommended.
Adding Volume Control
The addition of a digital potentiometer provides simple,
digital volume control. Figure 10 shows the MAX9720
with the MAX5408 dual log taper digital potentiometer
used as an input attenuator. Connect the high terminal
of the MAX5408 to the audio input, the low terminal to
GND, and the wiper to C
IN
. Setting the wiper to the top
position passes the audio signal unattenuated. Setting
the wiper to the lowest position fully attenuates the input.
Layout and Grounding
Proper layout and grounding are essential for optimum
performance. Connect PGND and SGND together at a
single point on the PC board. Connect all components
associated with the charge pump (C2 and C3) to the
PGND plane. Connect PV
SS
and SV
SS
together at the
device. Bypassing of both the positive and negative
supplies is accomplished by the charge-pump capaci-
tors, C2 and C3 (see Typical Application Circuit). Place
capacitors C1 and C3 as close to the device as possi-
ble. Place capacitor C2 as close to PV
SS
as possible.
Route PGND and all traces that carry switching tran-
sients away from SGND, traces, and components in the
audio signal path.
50mW, DirectDrive, Stereo Headphone
Amplifier with SmartSense and Shutdown
16 ______________________________________________________________________________________
SUPPLIER PHONE FAX WEBSITE
Taiyo Yuden 800-348-2498 847-925-0899 www.t-yuden.com
TDK 847-803-6100 847-390-4405 www.component.tdk.com
Table 2. Suggested Capacitor Manufacturers
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit
board techniques, bump-pad layout, and the recom-
mended reflow temperature profile, as well as the latest
information on reliability testing results, go to Maxims
website at www.maxim-ic.com/ucsp and look up
Application Note: UCSP—A Wafer-Level Chip-Scale
Package.
MAX9720
50mW, DirectDrive, Stereo Headphone
Amplifier with SmartSense and Shutdown
______________________________________________________________________________________ 17
t
DELAY
3.1µs
70mV
OUT_
HPS
HEADPHONE
INSERTED
Figure 9. HPS Debouncing Delay
OUTL
MAX9720
INL
9
MAX5408
H0
L0
5
6
W0A
7
LEFT AUDIO
INPUT
11
W1A
10
C
IN
C
IN
RIGHT AUDIO
INPUT
INR
OUTR
14
16
H1
L1
12
11
Figure 10. MAX9720 and MAX5408 Volume Control Circuit
Chip Information
TRANSISTOR COUNT: 4858
PROCESS: BiCMOS
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
V
DD
OUTL
HPS
OUTR
SV
SS
SGND
INR
TIME
INL
TOP VIEW
TOP VIEW
(BUMP SIDE DOWN)
MAX9720
TSSOP
MODE1
C1P
PV
SS
PGND
C1N
MODE2
ALERT
UCSP
A
B
C
D
1234
PV
SS
ALERT INL INR
C1N MODE2 TIME SGND
PGND MODE1 HPS SV
SS
C1P V
DD
OUTL OUTR
Pin Configurations
MAX9720
50mW, DirectDrive, Stereo Headphone
Amplifier with SmartSense and Shutdown
18 ______________________________________________________________________________________
MAX4365
OUT+
OUT-
IN
BIAS
V
DD
SHDN
15k
15k
V
DD
0.1µF
0.1µF
15k
0.1µF
1µF
220nF
MAX4063
MAX9720
OUTL
HPS
OUTR
C1P CIN
PV
SS
SV
SS
MODE1
MODE2
1µF
1µF
100k
10k
1µF
INL
INR
ALERT
TIME
AUX_IN
BIAS
IN+
IN-
2.2k
2.2k
0.1µF
0.1µF
V
DD
0.1µF
CODEC/
BASEBAND
PROCESSOR
µC
OUT
OUT
1µF
1µF
V
DD
V
DD
V
DD
System Diagram

MAX9720BEUE+

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
IC AMP AUDIO .05W STER 16TSSOP
Lifecycle:
New from this manufacturer.
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