SpecNo.JELF243A-0093F-01 P3/8
MURATA MFG.CO., LTD
Reference Only
8.Environmental Performance (It shall be soldered on the substrate.)
No. Item Specification Test Method
8.1 Heat Resistance Appearance:No damage
Inductance Change: within ± 10%
DC Resistance Change: within ± 10%
Temperature: 85±2°C
Time: 1000h (+48 h, -0 h)
Then measured after exposure in the room
condition for 24±2 hours.
8.2 Cold Resistance Temperature: -40±2°C
Time: 1000h (+48 h, -0 h)
Then measured after exposure in the room
condition for 24±2 hours.
8.3 Humidity Temperature: 40±2°C
Humidity: 90 to 95%(RH)
Time: 1000h (+48 h, -0 h)
Then measured after exposure in the room
condition for 24±2 hours.
8.4 Temperature
Cycle
1 cycle:
step 1 : -40±2°C / 30±3 min
step 2 : Ordinary temp. / 10 to 15 min
step 3 : +85±2°C / 30±3 min
step 4 : Ordinary temp. / 10 to 15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24±2 hours.
9.
Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
(in mm)
Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
500 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape 10N min.
Cover tape 5N min.
3.6
2.0±0.05
8.0±0.1
Direction of feed
2.7±0.2
4.0±0.1
4.9
12.0±0.3
1.75±0.1
5
.
5±0.05
φ
1.5
-0
+0.1
0.3±0.05
※
Lead- in/out wire
※
Thepackingdirectionsofthechipcoil
in taping are unified with the in/out
positions of the lead wire.
4.9±0.1
3.6±0.1
2.7±0.1
(0.3)
