LQH43PN470M26L Datasheet LQH43PN8R2M26L, LQH43PN100M26L, LQH43PN220M26L | P4-P6

SpecNo.JELF243A-0093F-01 P4/8

MURATA MFG.CO., LTD

Reference Only

9.4 Peeling off force of cover tape

Speed of Peeling off 300mm/min

Peeling off force

0.2 to 0.7N

(minimum value is typical)

9.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

9.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･

∗1) <Expression of Inspection No.> □□ OOOO ×××

(1)

(2) (3

)

(1) Factory Code

(2) Date First digit : Year / Last digit of year

Second digit

: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D

Third, Fourth digit : Day

(3) Serial No.

∗2) « Expression of RoHS marking » ROHS – Y (△)

(1)

(2)

(1) RoHS regulation conformity

(2) MURATA classification number

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,

Quantity, etc ･･･

9.8. Specification of Outer Case

Outer Case Dimensions(mm)

Standard Reel Quantity

in Outer Case (Reel)

W D H

186 186 93 4

∗Above Outer Case size is typical. It depends on a quantity

of an order

10. Caution

Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability

for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(2) Aerospace equipment

(7) Traffic signal equipment

(3) Undersea equipment

(8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment

(9) Data-processing equipment

(5) Medical equipment (10) Applications of similar complexity and /or reliability requirements

to the applications listed in the above

165 to 180 degree

Cover tape

Plastic tape

190 min

2.0±0.5

13.0±0.2

21.0±0.8

210 min

60±

17.0±1.4

180±

13.0±

(in mm)

Trailer : 160 min.

Direction of feed

Empty tape

Leader

Cover tape

Label

SpecNo.JELF243A-0093F-01 P5/8

MURATA MFG.CO., LTD

Reference Only

11. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing

Recommended land patterns for flow and reflow soldering are as follows:

These have been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

Flow Soldering Reflow Soldering ∗

(in mm)

∗ Applicable to flow soldering.

11.2 Flux, Solder

Flux

・Use rosin-based flux.

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

Solder

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 200μm to 300μm

Other flux (except above) Please contact us for details, then use.

11.3 Flow soldering conditions / Reflow soldering conditions

・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited

to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is

limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resultingin the deterioration

of product quality.

Soldering profile

(1)Flow soldering profile

Standard Profile Limit Profile

Pre-heating 150℃、60s min.

Heating 250℃、4s～6s 265 ±3℃℃、5s

Cycle of flow 2 times 1 time

Chip Coil

Solder Resist

Land

7.5

1.5

7.5

1.5

3.0

1.5 1.5 1.5

265℃±3℃

Heating Time

150

Limit Profile

Standard Profile

(s)Time.

Temp.

(℃)

60s min.

250℃

SpecNo.JELF243A-0093F-01 P6/8

MURATA MFG.CO., LTD

Reference Only

(2)Reflow soldering profile

Standard Profile Limit Profile

Pre-heating 150～180°C 、90s±30s

Heating above 220°C、30s～60s above 230°C、60s max.

Peak temperature 245±3°C 260°C,10s

Cycle of reflow 2 times 2 times

11.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating 150°C,1 min

Tip temperature 350°C max.

Soldering iron output 80W max.

Tip diameter φ3mm max.

Soldering time 3(+1,-0)s

Times 2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack

on the products due to the thermal shock.

11.5 Solder Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

1/3T≦ t ≦T

(T: Lower flange thickness)

Upper Limit

Recommendable

Limit Profile

Standard Profile

90s±30s

230℃

260℃

245℃±3℃

220℃

30s～60s

60s max.

180

150

Temp.

(s)

(℃)

Time.

P1-P3 P4-P6 P7-P8

LQH43PN470M26L

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LQH43PN470M26L

LQH43PN470M26L

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