NXP Semiconductors
PMFPB8032XP
20 V, 3.7 A / 320 mV VF P-channel MOSFET-Schottky combination
PMFPB8032XP All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved
Product data sheet 21 December 2012 6 / 16
017aaa565
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
-1
10
-5
1010
-2
10
-4
10
2
10
-1
t
p
(s)
10
-3
10
3
1
duty cycle = 1
0.75
0.5
0.33
0.25
0.2
0.1
0.05
0.02
0.01
0
FR4 PCB, mounting pad for drain 6 cm
2
Fig. 5. MOSFET transistor: Transient thermal impedance from junction to ambient as a function of pulse
duration; typical values
FR4 PCB, standard footprint
Fig. 6. Schottky diode: Transient thermal impedance from junction to ambient as a function of pulse duration;
typical values
NXP Semiconductors
PMFPB8032XP
20 V, 3.7 A / 320 mV VF P-channel MOSFET-Schottky combination
PMFPB8032XP All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved
Product data sheet 21 December 2012 7 / 16
FR4 PCB, mounting pad for cathode 6 cm
2
Fig. 7. Schottky diode: Transient thermal impedance from junction to ambient as a function of pulse duration;
typical values
10. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
MOSFET transistor static characteristics
V
(BR)DSS
drain-source
breakdown voltage
I
D
= -250 µA; V
GS
= 0 V; T
j
= 25 °C -20 - - V
V
GSth
gate-source threshold
voltage
I
D
= -250 µA; V
DS
= V
GS
; T
j
= 25 °C -0.4 -0.6 -1 V
V
DS
= -20 V; V
GS
= 0 V; T
j
= 25 °C - - -1 µAI
DSS
drain leakage current
V
DS
= -20 V; V
GS
= 0 V; T
j
= 150 °C - - -10 µA
V
GS
= -12 V; V
DS
= 0 V; T
j
= 25 °C - - -100 nAI
GSS
gate leakage current
V
GS
= 12 V; V
DS
= 0 V; T
j
= 25 °C - - 100 nA
V
GS
= -4.5 V; I
D
= -2.7 A; T
j
= 25 °C - 80 102
V
GS
= -4.5 V; I
D
= -2.7 A; T
j
= 150 °C - 116 148
V
GS
= -2.5 V; I
D
= -2.5 A; T
j
= 25 °C - 95 125
R
DSon
drain-source on-state
resistance
V
GS
= -1.8 V; I
D
= -1.1 A; T
j
= 25 °C - 120 156
g
fs
transfer conductance V
DS
= -10 V; I
D
= -2.7 A; T
j
= 25 °C - 15 - S
MOSFET transistor dynamic characteristics
Q
G(tot)
total gate charge - 5.7 8.6 nC
Q
GS
gate-source charge - 0.7 - nC
Q
GD
gate-drain charge
V
DS
= -10 V; I
D
= -2.7 A; V
GS
= -4.5 V;
T
j
= 25 °C
- 0.96 - nC
NXP Semiconductors
PMFPB8032XP
20 V, 3.7 A / 320 mV VF P-channel MOSFET-Schottky combination
PMFPB8032XP All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved
Product data sheet 21 December 2012 8 / 16
Symbol Parameter Conditions Min Typ Max Unit
C
iss
input capacitance - 550 - pF
C
oss
output capacitance - 63 - pF
C
rss
reverse transfer
capacitance
V
DS
= -10 V; f = 1 MHz; V
GS
= 0 V;
T
j
= 25 °C
- 53 - pF
t
d(on)
turn-on delay time - 6 - ns
t
r
rise time - 14 - ns
t
d(off)
turn-off delay time - 120 - ns
t
f
fall time
V
DS
= -10 V; I
D
= -2.4 A; V
GS
= -4.5 V;
R
G(ext)
= 6 Ω; T
j
= 25 °C
- 50 - ns
MOSFET transistor source-drain diode
V
SD
source-drain voltage I
S
= -1.1 A; V
GS
= 0 V; T
j
= 25 °C - -0.8 -1.2 V
Schottky diode
I
F
= 100 mA; T
j
= 25 °C - 225 275 mV
I
F
= 500 mA; T
j
= 25 °C - 285 335 mV
V
F
forward voltage
I
F
= 1 A; T
j
= 25 °C - 320 365 mV
V
R
= 5 V; T
j
= 25 °C - 65 220 µA
V
R
= 5 V; T
j
= 125 °C - 13 50 mA
V
R
= 10 V; T
j
= 25 °C - 110 400 µA
I
R
reverse current
V
R
= 20 V; T
j
= 25 °C - 230 700 µA
C
d
diode capacitance V
R
= 5 V; f = 1 MHz; T
j
= 25 °C - 60 70 pF
V
DS
(V)
0 -4-3-1 -2
017aaa531
-4
-6
-2
-8
-10
I
D
(A)
0
V
GS
= -1.8 V
-10 V
-4.5 V
-2.5 V
-2 V
-1.6 V
-1.5 V
-1.4 V
-1.2 V
-1 V
T
j
= 25 °C
Fig. 8. MOSFET transistor: Output characteristics:
drain current as a function of drain-source
voltage; typical values
017aaa532
-10
-4
-10
-3
I
D
(A)
-10
-5
V
GS
(V)
0 -1.00-0.75-0.25 -0.50
min typ max
T
j
= 25 °C; V
DS
= -5 V
Fig. 9. MOSFET transistor: Subthreshold drain current
as a function of gate-source voltage

PMFPB8032XP,115

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET Broad small-signal MOSFET Portfolio
Lifecycle:
New from this manufacturer.
Delivery:
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