MPXA6115A
Sensors
4 Freescale Semiconductor, Inc.
1 General Description
1.1 Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
Figure 1. Fully integrated pressure sensor schematic
1.2 Pinout
Figure 2. Device pinout (top view)
Table 1. Pin functions
Pin Name Function
1 DNC Do not connect to external circuitry or ground. Pin 1 is denoted by chamfered corner.
2V
S
Voltage supply
3 GND Ground
4V
OUT
Output voltage
5 DNC Do not connect to external circuitry or ground.
6 DNC Do not connect to external circuitry or ground.
7 DNC Do not connect to external circuitry or ground.
8 DNC Do not connect to external circuitry or ground.
V
S
Pin 2
+5.0 V
GND Pin 3
V
OUT
Pin 4
MPXxx6115A
to ADC
100 nF
51 K
47 pF
1
2
3
45
6
7
8
V
S
V
OUT
GND
DNC
DNC
DNC
DNC
DNC
Pin 1 identification, chamfered corner or notch in pin
MPXA6115A
Sensors
Freescale Semiconductor, Inc. 5
2 Mechanical and Electrical Specifications
2.1 Maximum ratings
2.2 Operating characteristics
Table 2. Maximum ratings
(1)
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating Symbol Value Units
Maximum pressure (P1 > P2) P
max
400 kPa
Storage temperature T
stg
-40° to +125°°C
Operating temperature T
A
-40° to +125°°C
Output source current @ full-scale output
(2)
2.Maximum output current is controlled by effective impedance from V
OUT
to GND or V
OUT
to V
S
in the application circuit.
I
o
+0.5mAdc
Output sink current @ minimum pressure offset
(2)
I
o
--0.5mAdc
Table 3. Operating characteristics (V
S
= 5.0 Vdc, T
A
= 25 °C unless otherwise noted, P1 > P2)
Characteristic Symbol Min Typ Max Unit
Pressure range P
OP
15 115 kPa
Supply voltage
(1)
1.Device is ratiometric within this specified excitation range.
V
S
4.75 5.0 5.25 Vdc
Supply current I
o
6.0 10 mAdc
Minimum pressure offset
(2)
(0 °C to 85° C)
@ V
S
= 5.0 Volts
2.Offset (V
off
) is defined as the output voltage at the minimum rated pressure.
V
off
0.133 0.200 0.268 Vdc
Full-scale output
(3)
(0 °C to 85° C) @ V
S
= 5.0 Volts
3.Full-scale output (V
FSO
) is defined as the output voltage at the maximum or full-rated pressure.
V
FSO
4.633 4.700 4.768 Vdc
Full-scale span
(4)
(0 °C to 85° C) @ V
S
= 5.0 Volts
4.Full-scale span (V
FSS
) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the
minimum rated pressure.
V
FSS
4.433 4.500 4.568 Vdc
Accuracy
(5)
(0 °C to 85° C)
5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at
25 °C due to all sources of error including the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or
maximum rated pressure at 25 °C.
TcSpan: Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C.
———±1.5 %V
FSS
Sensitivity V/P 45.0 mV/kPa
Response time
(6)
6.Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
t
R
—1.0—ms
Warm-up time
(7)
7.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
——20ms
Offset stability
(8)
8.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test.
——± 0.25 %V
FSS
MPXA6115A
Sensors
6 Freescale Semiconductor, Inc.
3 On-chip Temperature Compensation and Calibration
Figure 3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A).
Figure 4 shows a typical application circuit (output source current operation).
Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for
operation over 0 °C to 85 °C temperature range. The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm. The MPXxx6115A series pressure sensor operating characteristics, internal reliability and
qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor
performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
Figure 3. Cross Sectional Diagram SSOP/SOP (not to scale)
Figure 4. Typical application circuit (output source current operation)
Figure 5. Output vs. absolute pressure
Wire Bond
Stainless
Steel Cap
Thermoplastic
Case
Die Bond
Sealed Vacuum Reference
Fluorosilicone
Gel Die Coat
Lead
Frame
Absolute Element
P1
Die
V
S
Pin 2
+5.0 V
GND Pin 3
V
OUT
Pin 4
MPXxx6115A
to ADC
100 nF
51 K
47 pF
Output (Volts)
5.0
4.5
4.0
3.5
3.0
Pressure (ref: to sealed vacuum) in kPa
MAX
MIN
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
2.5
2.0
1.5
1.0
0.5
0
110
Transfer Function:
V
OUT
= V
s
* (.009*P-.095) ± Error
V
S
= 5.0 Vdc
TEMP = 0 to 85 °C
115
120
TYP

MPXA6115AC6U

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors SENSORS INTEGRATED SOP
Lifecycle:
New from this manufacturer.
Delivery:
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