MPXA6115A
Sensors
Freescale Semiconductor, Inc. 7
Figure 6. Transfer function
Figure 7. Temperature error band
Figure 8. Pressure error band
Nominal Transfer Value: V
OUT
= V
S
x (0.009 x P - 0.095)
± (Pressure Error x Temp. Factor x 0.009 x V
S
)
V
S
= 5.0 ± 0.25 Vdc
Break Points
Temp Multiplier
- 40 °C 3
0 °C to 85 °C 1
125 °C 1.75
Temperature in °C
4.0
3.0
2.0
0.0
1.0
-40 -20 0 20 40 60
14012010080
Temperature error factor
NOTE: The Temperature Multiplier is a linear response from 0 ºC to -40 ºC and from 85 ºC to 125 ºC
Error Limits for Pressure
3.0
2.0
1.0
-1.0
-2.0
-3.0
0.0
20
Pressure (in kPa)
Pressure Error (kPa)
15 to 115 (kPa) ±1.5 (kPa)
40 60 80 100 120
Pressure Error (Max)
MPXA6115A
Sensors
8 Freescale Semiconductor, Inc.
4 Package Information
4.1 Minimum recommended footprint for small and super small packages
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry,
the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder
mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
Figure 9. SOP Footprint (Case 98ASB17756C)
Figure 10. SSOP Footprint (Case 98ARH99066A and 98ARH99089A)
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
0.387
9.83
0.150
3.81
0.050
1.27
TYP
MPXA6115A
Sensors
Freescale Semiconductor, Inc. 9
4.2 Package dimensions
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17756C.pdf.
Case 98ASB17756C, Small outline package

MPXA6115AC6U

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors SENSORS INTEGRATED SOP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union