LQH32CH3R3M53L Datasheet LQH32CH3R3M53L | P4-P6

Spec No. JELF243A-9106E-01 P.4/7

MURATA MFG.CO., LTD

Reference Only

8.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

8.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･

∗1) <Expression of Inspection No.> □□ OOOO ×××

(1) (2) (3)

(1) Factory Code

(2) Date First digit : Year / Last digit of year

Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D

Third, Fourth digit : Day

(3)

Serial No.

∗2) « Expression of RoHS marking » ROHS – Y (△)

(1) (2)

(1)

RoHS regulation conformity parts.

(2) MURATA classification number

8.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS marking (∗2) ,Quantity, etc ･･･

8.8. Specification of Outer Case

Outer Case Dimensions

(mm)

Standard Reel Quantity in Outer Case

(Reel)

W D H

186 186 93 5

∗Above Outer Case size is typical. It depends on a quantity of an order

9. Caution

Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high

reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)

(2) Aerospace equipment

(7) Traffic signal equipment

(3) Undersea equipment

(8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment

(9) Data-processing equipment

(5) Medical equipment

(10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

Empty tape

190 min.

Leader

Trailer

Cover tape

2.0±0.5

13.0±0.2

21.0±0.8

180±

60±

9±

13±1.4

Direction of feed

210 mi n.

160 min.

Label

Spec No. JELF243A-9106E-01 P.5/7

MURATA MFG.CO., LTD

Reference Only

10. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

10.1 Land pattern designing

Recommended land patterns for flow and reflow soldering are as follows:

It has been designed for Electric characteristics and solderability.

Please follow the recommended pattern. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

Flow Soldering Reflow Soldering ∗

(in mm)

∗ Applicable to flow soldering.

10.2 Flux, Solder

Flux

・Use rosin-based flux.

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・ Don’t use water-soluble flux.

Solder

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 200μm to 300μm

Other flux (except above) Please contact us for details, then use.

10.3 Flow soldering / Reflow soldering conditions

Pre-heating should be in such a way that the temperature difference between solder and product surface is

limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature

difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.

Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration

of product quality.

･Soldering profile

(1)Flow soldering profile

Standard Profile Limit Profile

Pre-heating 150 , 60s min.℃

Heating 250 , 4s℃ ～6s 265 ±3 , 5s℃℃

Cycle of flow 2 times 1 time

265℃±3℃

Heating Time

150

Limit Profile

Standard Profile

(s)Time.

Temp.

(℃)

60s min.

250℃

Chip Coil

Solder Resist

Land

5.5

1.3

1.0

5.5

1.0

2.0

1.0 1.3 1.0

Spec No. JELF243A-9106E-01 P.6/7

MURATA MFG.CO., LTD

Reference Only

(2)Reflow soldering profile

Standard Profile Limit Profile

Pre-heating

150～180°C, 90s±30s

Heating

above 220°C, 30s～60s

above 230°C, 60s max.

Peak temperature 245±3°C 260°C,10s

Cycle of reflow 2 times 1 time

10.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating 150°C,1 min

Tip temperature 350°C max.

Soldering iron output 80W max.

Tip diameter φ3mm max.

Soldering time 3(+1,-0)s

Times 2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on

the products due to the thermal shock.

10.5 Solder Volume

Solder shall be used not to be exceed ed the upper limits as shown below.

 Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

1/3T≦t≦T

T: Lower flange thickness

10.6 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:a

<b) to the mechanical

stress.

(2) Products location on P.C.B. separation

Products (A,B,C,D) shall be located carefully

so that products are not subject to the

mechanical stress due to warping the board.

Because they may be subjected the mechanical

stress in order of A

>C>B ≅ D.

〈

Poor example

〉

〈

Good example

〉

Seam

Slit

Length:a

Upper Limit

Recommendable

Limit Profile

Standard Profile

90s±30s

230℃

260℃

245℃±3℃

220℃

30s～60s

60s max.

180

150

Temp.

(s)

(℃)

Time.

P1-P3 P4-P6 P7-P7

LQH32CH3R3M53L

Mfr. #:

Buy LQH32CH3R3M53L

Manufacturer:

Murata Electronics

Description:

Fixed Inductors 3.3uH 20% 1MHz

Lifecycle:

New from this manufacturer.

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