BYV32E-150,127

BYV32E-150_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 March 2009 3 of 9
NXP Semiconductors
BYV32E-150
Dual rugged ultrafast rectifier diode, 20 A, 150 V
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
RRM
repetitive peak reverse
voltage
-150V
V
RWM
crest working reverse
voltage
-150V
V
R
reverse voltage DC - 150 V
I
O(AV)
average output current square-wave pulse; δ = 0.5; T
mb
115 °C; both
diodes conducting; see Figure 1
; see Figure 2
-20A
I
FRM
repetitive peak forward
current
δ = 0.5; t
p
= 25 µs; T
mb
115 °C; per diode - 20 A
I
FSM
non-repetitive peak
forward current
t
p
= 10 ms; sine-wave pulse; T
j(init)
=2C; per
diode
-125A
t
p
= 8.3 s; sine-wave pulse; T
j(init)
=2C; per
diode
-137A
I
RRM
repetitive peak reverse
current
δ = 0.001; t
p
=2µs - 0.2 A
I
RSM
non-repetitive peak
reverse current
t
p
= 100 µs - 0.2 A
T
stg
storage temperature -40 150 °C
T
j
junction temperature - 150 °C
V
ESD
electrostatic discharge
voltage
HBM; C = 250 pF; R = 1.5 k; all pins - 8 kV
Fig 1. Forward power dissipation as a function of
average forward current; sinusoidal waveform;
maximum values
Fig 2. Forward power dissipation as a function of
average forward current; square waveform;
maximum values
01284
003aac978
4
8
12
0
1.9
a = 1.57
2.2
2.8
4.0
I
F(AV)
(A)
P
tot
(W)
015105
003aac979
5
10
15
0
0.5
0.2
0.1
I
F(AV)
(A)
P
tot
(W)
δ = 1
BYV32E-150_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 March 2009 4 of 9
NXP Semiconductors
BYV32E-150
Dual rugged ultrafast rectifier diode, 20 A, 150 V
5. Thermal characteristics
6. Characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance from
junction to mounting
base
with heatsink compound; both diodes
conducting
--1.6K/W
with heatsink compound; per diode; see
Figure 3
--2.4K/W
R
th(j-a)
thermal resistance from
junction to ambient
-60-K/W
Fig 3. Transient thermal impedance from junction to mounting base as a function of pulse width
003aac980
1
10
1
10
Z
th(j-mb)
(K/W)
10
3
10
2
t
p
(s)
10
6
10110
1
10
5
10
3
10
2
10
4
t
p
t
p
T
P
t
T
δ =
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
F
forward voltage I
F
=8A; T
j
= 150 °C; see Figure 4 - 0.72 0.85 V
I
F
=20A; T
j
=2C - 1 1.15 V
I
R
reverse current V
R
=150V; T
j
= 100 °C - 0.2 0.6 mA
V
R
=150V; T
j
=2C - 6 30 µA
Dynamic characteristics
Q
r
recovered charge I
F
=2A; V
R
=30V; dI
F
/dt = 20 A/µs;
T
j
=2C
-812.5nC
t
rr
reverse recovery time I
F
=1A; V
R
=30V; dI
F
/dt = 100 A/µs;
ramp recovery; T
j
= 25 °C; see Figure 5
-2025ns
I
F
=1A; I
R
= 0.5 A; step recovery;
measured at reverse current = 0.25 A;
T
j
=2C; see Figure 6
-1020ns
V
FR
forward recovery
voltage
I
F
=1A; dI
F
/dt = 10 A/µs; see Figure 7 --1V
BYV32E-150_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 March 2009 5 of 9
NXP Semiconductors
BYV32E-150
Dual rugged ultrafast rectifier diode, 20 A, 150 V
Fig 4. Forward current as a function of forward
voltage
Fig 5. Reverse recovery definitions; ramp recovery
Fig 6. Reverse recovery definitions; step recovery
Fig 7. Forward recovery definitions
0 1.61.20.4 0.8
003aac981
16
8
24
32
0
V
F
(V)
I
F
(A)
(1) (2) (3)
003aac562
t
rr
time
100 %
25 %
I
F
dl
F
dt
I
R
I
RM
Q
r
003aac56
3
t
rr
time
0.25 x I
R
I
F
I
R
I
R
Q
r
I
F
001aab912
time
time
V
FRM
V
F
I
F
V
F

BYV32E-150,127

Mfr. #:
Manufacturer:
WeEn Semiconductors
Description:
Rectifiers RAIL REC-EPI
Lifecycle:
New from this manufacturer.
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