15
Packaging Information
AT28C010 Military
Atmel-0010I-PEEPR-AT28C010-Datasheet_062015
16.81(0.662)
16.26(0.640)
16.81(0.662)
16.26(0.640)
2.74(0.108)
2.16(0.085)
2.03(0.080)
1.40(0.055)
INDEX CORNER
0.635(0.025)
0.381(0.015)
X 45°
0.305(0.012)
0.178(0.007)
RADIUS
0.737(0.029)
0.533(0.021)
1.02(0.040) X 45°
PIN 1
1.40(0.055)
1.14(0.045)
2.41(0.095)
1.91(0.075)
2.16(0.085)
1.65(0.065)
12.70(0.500) BSC
1.27(0.050) TYP
12.70(0.500) BSC
PIN #1 ID
9.40(0.370)
6.86(0.270)
0.51(0.020)
0.38(0.015)
1.27(0.050) BSC
1.14(0.045) MAX
3.05(0.120)
2.49(0.098)
1.14(0.045)
0.66(0.026)
1.83(0.072)
0.76(0.030)
10.36(0.408)
9.02(0.355)
0.18(0.007)
0.10(0.004)
12.40(0.488)
11.99(0.472)
21.08(0.830)
20.60(0.811)
42.70(1.68)
41.70(1.64)
PIN
1
15.50(0.610)
13.00(0.510)
2.49(0.098)MAX
0.127(0.005)MIN
1.52(0.060)
0.38(0.015)
0.58(0.023)
0.36(0.014)
1.65(0.065)
1.14(0.045)
15.70(0.620)
15.00(0.590)
17.80(0.700) MAX
0.381(0.015)
0.203(0.008)
2.54(0.100)BSC
5.08(0.200)
3.18(0.125)
SEATING
PLANE
5.72(0.225)
MAX
38.10(1.500) REF
0º~ 15º REF
MIL-STD-1835 C-12
44L, 44-Pad, Non-Windowed, Ceramic
Leadless Chip Carrier (LCC)
Dimensions in Millimeters* and (Inches)
JEDEC OUTLINE MO-115
32L1, 32-Pad, Non-windowed, Combo Lid, Leadless
Chip Carrier (LCC)
Dimensions in Millimeters* and (Inches)
32D6, 32-Lead, 0.600" Wide, Non-Windowed,
Ceramic Dual inline Package (Cerdip)
Dimensions in Millimeters and (Inches)
MIL-STD-1835 D-16 CONFIG A
32F, 32-Lead, Non-Windowed, Ceramic Bottom
Brazed Flat Package (Flatpack)
Dimensions in Millimeters and (Inches)
MIL-STD-1835 F-18 CONFIG B
*Controlling dimension: millimeters*Controlling dimension: millimeters
11.63(0.458)
11.23(0.442)
14.22(0.560)
13.72(0.540)
2.29(0.090)
1.91(0.075)
1.91(0.075)
1.40(0.055)
INDEX CORNER
0.635(0.025)
0.381(0.015)
X 45°
0.305(0.012)
0.178(0.007)
RADIUS
0.737(0.029)
0.533(0.021)
1.02(0.040) X 45°
PIN 1
1.40(0.055)
1.14(0.045)
2.41(0.095)
1.91(0.075)
2.16(0.085)
1.65(0.065)
7.62(0.300) BSC
1.27(0.050) TYP
10.16(0.400) BSC
